TRANSPARENT GAS BARRIER FILM
    3.
    发明专利

    公开(公告)号:JPH08142250A

    公开(公告)日:1996-06-04

    申请号:JP28956394

    申请日:1994-11-24

    Abstract: PURPOSE: To reduce deterioration of gas barrier performance due to post- processing, in a gas barrier film consisting of a plastic film and an aluminum oxide thin film formed at its single surface, by taking the thickness and refractive index of the aluminum oxide thin film as particular values. CONSTITUTION: This gas barrier film is provided with an aluminum oxide thin film formed on at least the single surface of a plastic film consisting of a polypropylene film or a polyethylene terephthalate film by means of a physical deposition method or a chemical deposition method. The thickness of the aluminum oxide thin film is 8-50nm. The film thickness smaller than 8nm will not meet the gas barrier performance, while the film thickness larger than 50nm will generate a curling, and degrade the gas barrier performance rapidly at the time of processing. The refractive index of the aluminum oxide thin film is 1.70-1.90. The refractive index of not more than 1.70 makes the aluminum oxide thin film porous to be insufficient in gas barrier performance, while the refractive index of not less than 1.90 makes it difficult to ensure transparency.

    ELECTRICAL INSULATING MATERIAL
    4.
    发明专利

    公开(公告)号:JPH08106815A

    公开(公告)日:1996-04-23

    申请号:JP24269594

    申请日:1994-10-06

    Abstract: PURPOSE: To improve processing suitability and heat resistance by using a biaxial orientation polyethylene-2,6-naphthalate film having predetermined crystallinity and chloroform extract. CONSTITUTION: After polyethylene naphthalate produced by fused polymerization or solid phase polymerization is dried, the same is extruded to be sheet-like at a predetermined temperature from an extractor so as to form an amorphous sheet. Thereafter, drawing treatment is conducted so as to form a biaxial orientation film. Crystallinity is controlled by heat treatment so as to be 40% or more, and extract amount is controlled so as to be 0.5%or less after 48 hours extraction with chloroform. By using a biaxial orientation polyethylene-2,6- naphthalate film having 40% or more of crystallinity and 0.5% or less of chloroform extract after 48 hours extraction with chloroform, it is possible to obtain excellent processing suitability and heat resistance, and to improve reliability.

    COMPOSITE FLUOROPLASTIC FILM AND COVER MATERIAL FOR AGRICULTURAL GREENHOUSE USING THE SAME

    公开(公告)号:JPH07205377A

    公开(公告)日:1995-08-08

    申请号:JP4846794

    申请日:1994-03-18

    Abstract: PURPOSE:To obtain a composite fluoroplastic film excellent in ultraviolet cut-off properties and durability and having thermal laminating properties and easy adhesiveness by providing a coating layer based on an ultraviolet absorbable acrylic resin to at least one surface of a fluoroplastic film. CONSTITUTION:A composite fluoroplastic film is obtained by providing a coating layer based on an ultraviolet absorbable acrylic resin to at least one surface of a fluoroplastic film. As a representative example of the material quality of the fluoroplastic film, a tetrafluoroethylene polymer is designated. However, a tetrafuluoroethylene/hexafluoropropylene copolymer is pref. used from the viewpoint of mechanical characteristics, film forming properties and processing aptitude. Herein, the coating layer contains 50wt.% or more of an ultraviolet absorbable acrylic resin. That is, the ultraviolet absorbable acrylic resin is a copolymer resin of a reactive benzophenone compd. having ultraviolet absorbing capacity and an acrylic monomer having a polymerizable unsaturated group.

    LAMINATED FILM
    6.
    发明专利

    公开(公告)号:JPH0781000A

    公开(公告)日:1995-03-28

    申请号:JP23010393

    申请日:1993-09-16

    Abstract: PURPOSE:To provide a laminated film which can be applied to aluminum of general-purpose electrode metal and in which a heat laminating temperature with the metal can be set to a specific temperature by satisfying various characteristics such as heat resistance, dielectric characteristics, thickness accuracy, etc., necessary for a dielectric film of a variable capacitor, etc. CONSTITUTION:A laminated film is formed by laminating a resin composition layer (B layer) having a softening point of 50-200 deg.C at least on one side surface of a film layer (A layer) having a softening point of 250 deg.C or higher at a heat laminating temperature of 200 deg.C or lower, wherein adhesive strengths of the A and B layers of the film is 200g/cm or more, and its dielectric loss is 0.01 (at 25 deg.C, 1kHz) or less.

    POLYPHENYLENE SULFIDE RESIN COMPOSITION AND SHEETLIKE MATERIAL

    公开(公告)号:JPH0741674A

    公开(公告)日:1995-02-10

    申请号:JP19034893

    申请日:1993-07-30

    Abstract: PURPOSE:To obtain a PPS resin composition suitable for sheets and a PPS sheetlike material, having mechanical strength of practical level and extremely improved thermal dimensional stability and heat resistance (solder heat resistance) while maintaining excellent characteristics of PPS such as moisture- absorption characteristics, high-frequency characteristics and chemical resistance. CONSTITUTION:This polyphenylene sulfide resin composition is the polyphenylene sulfide resin composition containing inorganic particles, wherein the particle flatness of inorganic particles in the resin composition is 5-120 and the content of the inorganic particles is 5-80wt.%. The composition is molded to give a polyphenylene sulfide sheetlike material.

    RESIN-IMPREGNATED FIBER SHEET
    8.
    发明专利

    公开(公告)号:JPH06286067A

    公开(公告)日:1994-10-11

    申请号:JP7377993

    申请日:1993-03-31

    Abstract: PURPOSE:To balance various characteristics such as heat resistance, thermal dimensional stability, mechanical characteristics, etc., in high dimensions and to improve through-hole, thermal fusion-bonding processability by resin- impregnated fiber sheet having specific values of resin impregnating degree of resin composition, relative crystallization index, size of microcrystal, and a ratio of residual crystallization energy to crystallization energy. CONSTITUTION:A resin-impregnated fiber sheet is obtained by impregnating a resin sheet with resin composition containing poly-p-phenylene sulfide as a main ingredient in which resin impregnation degree of the composition is 80% or more, relative crystallization index is 2.5-13.0, a size of a microcrystal is 50-100 Angstrom and residual crystallization energy DELTAHt is 20-80% of crystallization energy DELTAHq of the composition. Of fiber sheets, a glass fiber sheet is preferable in view of electric insulation, thermal dimensional stability, and particularly cloth of glass fiber is preferable in view of points of heat resistance, dimensional stability and processability. Of which, a range of 0.7-1.4 of average density of warps to wefts of the cloth is preferable in view of thermal dimensional stability.

    ULTRAVIOLET-SCREENING FILM
    9.
    发明专利

    公开(公告)号:JPH06263891A

    公开(公告)日:1994-09-20

    申请号:JP5706393

    申请日:1993-03-17

    Abstract: PURPOSE:To prepare a film excellent in film formability, ultraviolet screening properties and their persistence. CONSTITUTION:This screening film is prepared by incorporating 0.05-5.0wt.%, based on the resin, benzotriazole ultraviolet absorber having a 5wt.% heating loss temperature of 300 deg.C or above in a film based on an ethylene/ tetrafluoroethylene copolymer resin.

    PRINTED WIRING BOARD
    10.
    发明专利

    公开(公告)号:JPH0645764A

    公开(公告)日:1994-02-18

    申请号:JP19537092

    申请日:1992-07-22

    Abstract: PURPOSE:To obtain a printed wiring board mounted with electronic parts high in mounting density by a method wherein semiconductor chips are built in holes provided inside the board. CONSTITUTION:A printed wiring board is composed of two outer boards 2 and an inner board 1 sandwiched in between the two outer boards 2 and equipped with circuit wiring layers 3 each provided onto the surface of the wiring board and between the boards. A hole 7 is provided to the inner board 1 at a prescribed position, and a pad and a wiring used for mounting an IC chip 6 are formed on the circuit wiring layer 3 exposed at the hole 7. The IC chip 6 is mounted on the circuit wiring layer 3 through the intermediary of bumps 5. Electronic parts 4 are formed on the surfaces of the printed wiring board at prescribed positions. As mentioned above, an IC is mounted inside the hole 7 provided to the inner board 1, so that elements mounted on a printed wiring board can be enhanced in number per unit area.

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