公开(公告)号：JPH11268440A

公开(公告)日：1999-10-05

申请号：JP9099098

申请日：1998-03-19

Applicant: TORAY INDUSTRIES

Inventor： MIYAJI SHINICHIRO ,  SUNAYAMA KATSUHIRO ,  KUROME TAIICHI

IPC: H05K3/34 ,  B32B27/00 ,  B41N1/24 ,  H05K3/12

Abstract: PROBLEM TO BE SOLVED: To provide a masking material for a solder printing which is excellent in the printability of a solder, and is suitable for a circuit substrate of a high precision. SOLUTION: For this laminated film, on both surfaces of a non-orientated polyphenylene sulfide film layer (layer B) wherein 1.5 wt.% or lower of particles of which the average particle diameter is 2 μm or lower are contained, another film wherein 1.5 wt.% or lower of particles of which the average particle diameter is 2 μm or lower are contained, and the softening point is 175 deg.C or higher is laminated (layer A). In this case, the crystallization temperature (Tcc) of the layer B of the laminated film is in a range of 120-140 deg.C for this laminated film.

公开(公告)号：JPH07149926A

公开(公告)日：1995-06-13

申请号：JP32631593

申请日：1993-11-29

Applicant: TORAY INDUSTRIES

Inventor： SUMIYA TAKASHI ,  TANAKA IWAO ,  KUROME TAIICHI

IPC: C08J5/18 ,  B29C55/12 ,  B29K67/00 ,  B29K105/16 ,  B29L7/00 ,  B32B15/08 ,  B32B15/09 ,  B32B27/18 ,  B32B27/20 ,  C08K3/22 ,  C08K5/04 ,  C08L67/00 ,  C08L67/02

Abstract: PURPOSE:To obtain a white film which is excellent in heat resistance, wet-heat resistance, and formability and esp. suitable for forming after fusion with a metal by using a polyester resin contg. a specified amt. of specific titanium oxide particles. CONSTITUTION:Titanium oxide particles having an average particle size of 0.1-1.2mum and a loss on drying of 0.8% or lower is incorporated into a polyester resin pref. contg. 5.0mol% structural units derived from 4C or higher aliph. acids and alcohols. The resulting polyester resin compsn. is formed into film, to obtain a white polyester film which is excellent in impact strength and formability and esp. suitable for forming after fusion with a metal without detriment to excellent gloss (whiteness) and light-intercepting properties.

公开(公告)号：JPH058568A

公开(公告)日：1993-01-19

申请号：JP16471691

申请日：1991-07-04

Applicant: TORAY INDUSTRIES

Inventor： TSUNASHIMA KENJI ,  KUROME TAIICHI ,  SUZUKI MASARU

IPC: B32B27/00 ,  B32B27/08 ,  B41M5/382 ,  B41M5/40 ,  B41M5/41 ,  B41N1/24

Abstract: PURPOSE:To provide a film for thermal stencil paper imparting sharpness and high gradation properties in both of character printing and solid printing, generating no printing irregularity and excellent in sticking preventing properties, easy adhesiveness and antistatic properties. CONSTITUTION:As a base film for thermal stencil paper, a biaxially stretched film wherein a crystal m.p. Tm is 220 deg.C or lower, glass transition temp. Tg is 0 deg.C or higher and crystal melting half breadth W1/2 is 14 deg.C or less is used.

公开(公告)号：JPH04359027A

公开(公告)日：1992-12-11

申请号：JP13140191

申请日：1991-06-03

Applicant: TORAY INDUSTRIES

Inventor： TSUNASHIMA KENJI ,  KUROME TAIICHI ,  HIRAOKA TOSHIHIKO

IPC: B29C55/02 ,  B29K23/00 ,  B29L7/00 ,  C08J5/18 ,  C08L23/00 ,  C08L25/00 ,  C08L25/18

Abstract: PURPOSE:To provide the title film excellent in mechanical properties, in particular, impact resistance, also having antistatic property and ready adhesivity despite its being noncrystalline and high in Tg. CONSTITUTION:The objective film consisting of a polymer >=90 deg.C in glass transition temperature can be obtained by copolymerization between a noncrystalline polyolefin and a polymer having either sulfonate or carboxylate.

公开(公告)号：JPH04298589A

公开(公告)日：1992-10-22

申请号：JP8593991

申请日：1991-03-27

Applicant: TORAY INDUSTRIES

Inventor： HIRAOKA TOSHIHIKO ,  KUROME TAIICHI ,  TSUNASHIMA KENJI

IPC: B29C55/02 ,  B32B27/36 ,  B65B11/00 ,  C09J7/02 ,  C09J201/00 ,  H05K3/18

Abstract: PURPOSE:To obtain a masking film which has a necessary flexibility and retains sufficiently high high-temperature dimensional stability and chemical resistance by providing a pressure-sensitive adhesive layer on one side of a specific flexible film made from a copolymeric polyester. CONSTITUTION:A masking film which comprises a flexible film, which is made from a copolyester film with a DELTATcg of 60 deg.C or less and has a tensile Young's modulus of 0.1-50kg/mm at 25 deg.C, a dimensional change of 10% or less at 160 deg.C and a dimensional change of + or -15% or less when immersed in chemicals, and a pressure-sensitive adhesive layer formed on one side of the film. The copolyester preferably contains a long-chain dicarboxylic acid as the soft segment in view of improving the flexibility, high-temperature dimensional stability and chemical resistance. Particularly, the long-chain aliphatic dicarboxylic acid may preferably be a branched long-chain aliphatic dicarboxylic acid. A dimer acid is preferred above all.

公开(公告)号：JPH04293985A

公开(公告)日：1992-10-19

申请号：JP8130291

申请日：1991-03-22

Applicant: TORAY INDUSTRIES

Inventor： KUROME TAIICHI ,  TSUNASHIMA KENJI ,  HIRAOKA TOSHIHIKO

IPC: C09J7/02 ,  C09J201/00 ,  H05K3/34

Abstract: PURPOSE:To obtain a masking film having sufficiently high dimensional stability at high temperature with necessary flexibility by providing a self-adhesive layer on one side of a specified flexible film made of a copolyester. CONSTITUTION:A masking film obtained by providing a self-adhesive layer on one side of a flexible film which is made of a copolyester having a Tcg of at most 60 deg.C and has a Young's modulus in tension of 0.1-50kg/mm and a dimensional change of at most 15% after heating at 250 deg.C. The copolyester should have a Tcg, defined as a difference between the cooling crystallization temperature and the glass transition temperature, of at most 60 deg.C; if the Tcg is above that, such problems will occur that the Young's modulus in tension may possibly increase with time and the flexibility will be inferior. It is desirable that the hard segment of the copolyester has a melting point of 200 deg.C or higher, a glass transition temperature of 90 deg.C or lower, and a Tcg of 80 deg.C or lower when it forms a homopolymer from the viewpoint of providing good soldering characteristics, etc.

公开(公告)号：JPH03142991A

公开(公告)日：1991-06-18

申请号：JP28217889

申请日：1989-10-30

Applicant: TORAY INDUSTRIES

Inventor： KUROME TAIICHI ,  ITO NOBUAKI

IPC: B32B15/088 ,  B32B15/08 ,  H05K1/05

Abstract: PURPOSE:To improve insulation reliability and heat emissivity and to bendably use by laminating a thin aromatic polyamide film having specific moisture absorptivity in the insulating layer of a metal base circuit board. CONSTITUTION:An aromatic polyamide film having 4.0 wt.% of lower of moisture absorptivity and 2-20mum of thickness is provided in an insulating layer of a metal base circuit board. The film has 4.0 wt.% or lower of moisture absorptivity or preferably 3.0 wt.% or lower. The obtained laminated product is formed with a circuit by etching a metal foil or coating with insulation resist. Thus, the metal base circuit board having excellent heat emissivity, insulation reliability and being moldable such as bendably folding, etc., is obtained.

公开(公告)号：JPH03142235A

公开(公告)日：1991-06-18

申请号：JP28217789

申请日：1989-10-30

Applicant: TORAY INDUSTRIES

Inventor： KUROME TAIICHI ,  ITO NOBUAKI

IPC: B32B15/088 ,  H05K1/03 ,  H05K3/38

Abstract: PURPOSE:To obtain an aromatic polyamide film laminated with a metallic thin film which is excellent in adhesive force between the metallic thin film layer and the aromatic polyamide film and utilized for a printed circuit and a connector, etc., by performing prescribed heat treatment on the aromatic polyamide film wherein the metallic thin film is laminated at least on the single face. CONSTITUTION:Surface treatment such as corona discharge treatment is performed on an aromatic polyamide film so as to become a contact angle of water in accordance with necessity. A metallic thin film is laminated thereon by a vacuum deposition method, etc. The aromatic polyamide film laminated with the metallic thin film is heat-treated at 60 - 150 deg.C for at least one minute. As a method of heat-treatment, an ordinary hot-air oven can be utilized. As the film to be laminated, a sheetlike or rolllike film may be utilized. Further heat treatment is preferably performed in the inert gas atmosphere such as nitrogen from a point of view for preventing oxidation of the metallic thin film. In the aromatic polyamide film laminated with the metallic thin film processed by this treatment, adhesive force can be enhanced without largely deteriorating the characteristics of the metallic thin film.

公开(公告)号：JPH02280305A

公开(公告)日：1990-11-16

申请号：JP10202089

申请日：1989-04-21

Applicant: TORAY INDUSTRIES

Inventor： KUROME TAIICHI ,  ITO NOBUAKI

IPC: H01F27/24

Abstract: PURPOSE:To improve layer insulating reliability and magnetic characteristics and to increase occupation factor of amorphous metal by winding heat-resistant film which consists of polyamide having specified characteristics together with an amorphous metallic thin band. CONSTITUTION:In an amorphous wound magnetic core which is made by winding an amorphous metallic thin band together with a heat-resistant film, an aromatic polyamide film having a thickness of 2 to 20mum, a Young's modulus of 300(kg/mm ) or more, and a thermosoftening temperature of 300 deg.C or below is used. The amorphous metallic thin band is expressed by (Fe1-aMa)100-x-y SixBy (atomic%), where M is selected from Ti, Hf, V, Nb, Ta, Cr, Mo, W, Mn, Ni, Co, Cu, Ag, Au, Ru, Rh, Pd, Pt, Y, and rare earth elements, and 0

公开(公告)号：JPH02193618A

公开(公告)日：1990-07-31

申请号：JP1269489

申请日：1989-01-20

Applicant: TORAY INDUSTRIES

Inventor： ITO NOBUAKI ,  KUROME TAIICHI

IPC: A47J36/02 ,  B32B15/08 ,  B32B15/088

Abstract: PURPOSE:To provide the container which has high heat resistance and is usable in a microwave oven, oven and oven toaster by constituting the container from an arom. polyamide layer featuring that the amount of extract from the layer into chloroform does not exceed a specific value and metallic foil. CONSTITUTION:The arom. polyamide consists of a polymer contg. >=50mol%, more preferably >=70% basic constituting unit NH-Ar1-NHOC-Ar2-CO and the arom. polyamide layer is formed by applying the soln. thereof on the metallic foil and removing the org. solvent or may be formed by laminating the previously formed arom. polyamide film on the metallic foil. The extraction material to be extracted from the arom. polyamide layer into the chloroform is =0.1wt.%. The thickness of the layer is preferably 1 to 20mum, more preferably 2 to 15mum and the tensile elongation thereof is preferably >=10%, more preferably >=20%. The shrinkage stress in a temp. range of 25 to 350 deg.C is preferably , more preferably in both MD and TD directions.