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公开(公告)号：JPH08197690A
公开(公告)日：1996-08-06
申请号：JP2587695
申请日：1995-01-20
Applicant: TORAY INDUSTRIES
Inventor： MIYAJI SHINICHIRO , YOMODA JOICHI , KINOSHITA SHUICHI
Abstract: PURPOSE: To provide an electric insulating material well-balanced in various characteristics such as heat resistance, electric characteristics, chemical resistance, impact resistance or the like and excellent in workability markedly enhanced in moldability. CONSTITUTION: In a laminate consisting of a non-stretched polyphenylene sulfide sheet layer and a polyphenylene sulfide fiber sheet layer, the respective layers are laminated without interposing an adhesive between them.
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公开(公告)号：JPH06322151A
公开(公告)日：1994-11-22
申请号：JP10808693
申请日：1993-05-10
Applicant: TORAY INDUSTRIES
Inventor： KIDA KENJI , MIYAJI SHINICHIRO , UEDA TOMOAKI
Abstract: PURPOSE:To obtain a mold release film capable of providing a green sheet, good in heat, water and solvent resistances and flatness and further peelability from the green sheet. CONSTITUTION:The biaxially oriented polyphenylene sulfide film contains a polyorganosiloxane compound in an amount of 1-10000ppm based on 100 pts.wt. polyphenylene sulfide.
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公开(公告)号：JPH0691812A
公开(公告)日：1994-04-05
申请号：JP24482692
申请日：1992-09-14
Applicant: TORAY INDUSTRIES
Inventor： MIYAJI SHINICHIRO , KIDA KENJI , UEDA TOMOAKI
Abstract: PURPOSE:To provide a metal base circuit board excellent in the bonding strength with a metal plate while holding the excellent hygroscopic characteristic, high frequency characteristic or heat-resistance of PPS. CONSTITUTION:A layer (A) consisting of a sheet composed of a resin compsn. based on poly-p-phenylene sulfide and an electric circuit is laminated to a metal layer (C) through a layer (B) of a resin compsn. composed of copolymerized polyphenylene sulfide containing at least one or more kind of a copolymerizable unit other than a p-phenylene sulfide unit.
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公开(公告)号：JPH0645714A
公开(公告)日：1994-02-18
申请号：JP19536992
申请日：1992-07-22
Applicant: TORAY INDUSTRIES
Inventor： MIYAJI SHINICHIRO , KIDA KENJI , UEDA TOMOAKI
Abstract: PURPOSE:To accomplish a circuit substrate (including a multilayer circuit substrate) having well-balanced heat-resisting property, dimensional stability to heat, high frequency characteristics, moisture absorption characteristics and the like in high dimensions, also having high adhesive strength with a circuit layer, small conductive resistance on circuit, especially suitable for high-speed signal processing and adaptability for high frequency. CONSTITUTION:This multilayer substrate is formed on the surface of a fiber sheet which is formed by impregnating a resin composition, which is mainly composed of poly-p-phenylene sulfide, by laminating a circuit substrate consisting of an electric circuit of metal layer formed through the intermediary of a resin composition layer consisting of copolymer polyphenylene sulfide containing one or more kinds of copolymer unit other than a p-phenylene sulfide unit.
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公开(公告)号：JPH05338083A
公开(公告)日：1993-12-21
申请号：JP34338491
申请日：1991-12-25
Applicant: TORAY INDUSTRIES
Inventor： MIYAJI SHINICHIRO , DEGUCHI YUKICHI , KOBAYASHI HIROAKI
Abstract: PURPOSE:To obtain a film excellent in both heat resistance and impact resistance. CONSTITUTION:A laminated film is obtained by laminating a biaxially-oriented poly-p-phenylene sulfide film on a biaxially-oriented polyester film through an adhesive. The adhesive layer has a hardness index ranging 1-3000. A thickness A of the biaxially-oriented poly-p-phenylene sulfide film and a thickness B of the biaxially-oriented polyester film meet a requirement of 0.1
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Patent Agency Ranking
公开(公告)号：JPH05310957A
公开(公告)日：1993-11-22
申请号：JP14686092
申请日：1992-05-13
Applicant: TORAY INDUSTRIES
Inventor： MIYAJI SHINICHIRO , KIDA KENJI , UEDA TOMOAKI
Abstract: PURPOSE:To provide an insulating substrate utilizing the excellent high frequency characteristics, low hygroscopicity and flame retardancy of polyphenylene sulfide, excellent in the heat resistance and processability for circuit substrates, and suitable for the circuit substrates requiring the high speed treatments and high frequency treatments of signals, and to provide the circuit substrate (including multi-layer circuit substrates). CONSTITUTION:The fiber sheet having a thermal shrinkage of
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公开(公告)号：JPH0245144A
公开(公告)日：1990-02-15
申请号：JP19559188
申请日：1988-08-04
Applicant: TORAY INDUSTRIES
Inventor： MIYAJI SHINICHIRO , DEGUCHI YUUKO , KAGEHIRA TOKUO
IPC: B32B27/00
Abstract: PURPOSE:To obtain a laminate combining each characteristic of heat resistance, chemical resistance, flame-retardant properties, shock resistance, resistance to moist heat, workability, etc., in a balanced manner by laminating a biaxially oriented polyphenylene sulfide layer on at least one side of a non-oriented polyphenylene sulfide layer without through adhesives. CONSTITUTION:A biaxially oriented polyphenylene sulfide layer is laminated on at least one side of a non-oriented polyphenylene sulfide layer without through adhesives. A film or a sheet or the like in 1mm or less manufactured by melting and molding a composition containing not less than 60wt.% polyphenylene sulfide is used as a non-oriented sheet. A film obtained by melting and molding a resin composition including not less than 90wt.% polyphenylene sulfide, forming the resin composition to a sheet shape and biaxially orienting and thermally treating the sheet-like resin composition is employed as a biaxially oriented polyphenylene sulfide film. Both the sheet and the film are thermocompression-bonded at a high temperature and high pressure or PPS is melt-extruded and laminated directly onto the biaxially oriented film as a laminating method. The former method is executed by a roll press, a hot plate pres, etc., under the conditions of a temperature of 180-270 deg.C and a pressure of 1-20kg/cm .
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公开(公告)号：JPH01309208A
公开(公告)日：1989-12-13
申请号：JP14007988
申请日：1988-06-07
Applicant: TORAY INDUSTRIES
Inventor： MIYAJI SHINICHIRO , DEGUCHI YUKICHI
Abstract: PURPOSE:To eliminate the lowering of the AC withstanding voltage of a coated wire even under the impregnation of resin by specifying the adhesion strength between the biaxially oriented polyphenylene sulfide film to be coated on a bundle of element wires and the resin to be impregnated in the film. CONSTITUTION:When a bundle of element wires consisting of insulator coated wire is coated further with a biaxially oriented polyphenylene sulfide film and impregnated with resin, the adhesion strength between the biaxially oriented polyphenylene sulfide film and the resin to be impregnated in the film is made to be higher than 30g/cm, preferably higher than 40g/cm. Here, the adhesion strength is defined as the value measured at peel velocity of 200mm/min and peel angle or 90 degree. Contrary, when the adhesion strength is lower than 30g/cm, the AC withstanding voltage of the coated wire is lowered significantly by the impregnation of resin. Thereby the lowering of the AC withstanding voltage, one of the demerits of the impregnated composite wire, can be eliminated to obtain a high AC withstanding voltage.
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公开(公告)号：JPH0195586A
公开(公告)日：1989-04-13
申请号：JP25312987
申请日：1987-10-07
Applicant: TORAY INDUSTRIES
Inventor： MIYAJI SHINICHIRO , DEGUCHI YUKICHI , KOBAYASHI HIROAKI
IPC: H05K1/05
Abstract: PURPOSE:To enhance resistance to chemicals and an electric characteristic by a method wherein an electric circuit composed of a metal layer is formed on one side of a biaxially oriented polyphenylene sulfide film and a metal sheet is laminated on the other side of the film. CONSTITUTION:An electric circuit composed of a metal layer is formed on one side of a biaxially oriented polyphenylene sulfide film which has been formed by melting a resin composition composed mainly of polyphenylene sulfide to shape a sheet, by stretching it biaxially and by heat-treating it; a metal sheet is laminated on the other side of the film. The metal sheet which is to be pasted on the polyphenylene sulfide film is preferably an ordinary steel sheet, a silicon steel sheet, an aluminum sheet or the like; its thickness is preferably 0.2-5.0mm. By this setup, an electric characteristic and resistance to chemicals are enhanced.
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公开(公告)号：JP2000156210A
公开(公告)日：2000-06-06
申请号：JP32846198
申请日：1998-11-18
Applicant: TORAY INDUSTRIES , MATSUMOTO SEISAKUSHO KK
Inventor： MIYAJI SHINICHIRO , KUROME TAIICHI , DOI TAKIO
Abstract: PROBLEM TO BE SOLVED: To provide a gasket having high accuracy, to improve its workability in processing it, and also adapt it for high volume production by forming it from a molding of a high-polymer film and by integrating the high-polymer film with a metal case of a positive electrode. SOLUTION: When this gasket is manufactured, firstly, a layered product composed by laminating a high-polymer film and metal foil each formed into an annular shape by drilling a hole in the central part is cut down into the same concentric shape as and larger than the hole and thereafter molded. Thereby, or by forming it into the same concentric outline as and larger than the hole, then molding it and thereafter cutting down along the outline, the gasket integrated with a metal case of a positive electrode can be manufactured. In this case, a crystalline high-polymer having a melting point of 150 deg.C or above, or an amorphous high-polymer having a glass transition temperature of 150 deg.C or above is used for the high-polymer film used as the gasket material, for instance, polypropylene or polyphenylene sulfide is particularly preferable in view of electrolyte resistance (chemical resistance) and a hygroscopic characteristic.
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