Abstract:
PROBLEM TO BE SOLVED: To provide a device having a sealed actuator chamber and a vent connected to the actuator chamber. SOLUTION: The vent connects the chamber to exterior atmosphere surrounding the device so as to equalize the pressure in the chamber. The vent has a size and form to allow pressure equalization to occur outside a normal operation cycle of the chamber and controls the pressure to prevent undesirable deflection of a membrane in the chamber and ensure the suitable operation of the device. COPYRIGHT: (C)2006,JPO&NCIPI
Abstract:
PROBLEM TO BE SOLVED: To provide a waveguide which will not be affected by polarized light, and to provide a forming method of the waveguide. SOLUTION: The waveguide includes a base plate 100 and a waveguide structure on the base plate, and the waveguide structure includes a base 102 and a rectangular waveguide 104. The base 102 has a base height (h), measured from the base plate. The rectangular waveguide 104 has a waveguide height (H), measured from the base plate and a waveguide width (W) which is the width between both side surfaces of the rectangular waveguide. The waveguide structure satisfies the equations:(1):H-4≤(W-3) 2 , (2):H-1≥(W-4) 2 , (3):H≤1.7*h+2.9 and (4):H≥0.87*h+1.8 (where * in the equations represents multiplication). COPYRIGHT: (C)2006,JPO&NCIPI
Abstract translation:要解决的问题:提供不受偏振光影响的波导,并提供波导的形成方法。 解决方案:波导包括基板100和基板上的波导结构,波导结构包括基座102和矩形波导104.基座102具有基座高度(h),从基座 盘子。 矩形波导104具有从基板测量的波导高度(H)和作为矩形波导的两侧表面之间的宽度的波导宽度(W)。 波导结构满足以下等式:(1):H-4≤(W-3) 2 SP>,(2):H-1≥(W-4) ,(3):H≤1.7* h + 2.9和(4):H≥0.87* h + 1.8(其中*表示乘法)。 版权所有(C)2006,JPO&NCIPI
Abstract:
PROBLEM TO BE SOLVED: To improve flexibility of design and manufacturability in a bistable system. SOLUTION: A bistable microelectromechanical system (MEMS) based system 100 comprises a micromachined beam 110 having a first stable state, in which the beam 110 is substantially stress-free and has a specified non-linear shape, and a second stable state. The curved shape of the beam 110 may comprise a simple curve or a compound curve. In embodiments, the boundary conditions 112 for the beam 110 are fixed boundary conditions, bearing boundary conditions, spring boundary conditions, or a combination thereof. COPYRIGHT: (C)2004,JPO
Abstract:
PROBLEM TO BE SOLVED: To reduce deflection caused by etching. SOLUTION: Structure for a micro-device is fabricated by forming a first layer of sacrifical material, a layer of a structural material over the first sacrifical material layer, a second layer of sacrifical material over the structural material layer, and a protective layer over the second sacrifical material layer. A release etch is used to remove the first and second sacrifical material layers at substantially same rate. A structural feature is fabricated by forming a first layer of a first material, a layer of structural material over the first layer of the first material, at least one cut in the structural material layer, and a first layer of a sacrifical material different from the first material over the structural material layer such that an interface is created between the first layer of the sacrifical material and the first layer of the first material in at least one cut. COPYRIGHT: (C)2003,JPO
Abstract:
PROBLEM TO BE SOLVED: To provide a coating for an inkjet printhead front face.SOLUTION: The present invention provides a coating comprising a crosslinked dimethyl methyltrifluoropropyl siloxane polymer and having high thermal stability as indicated by the weight loss less than about 15% when heated to the temperature of 290°C at a pressure of up to 350 psi. The present invention also provides a process comprising: coating a substrate with a reactant mixture comprising a polymer having vinyl groups and a crosslinking agent having Si-H groups; and subjecting the coated reactant mixture to a curing treatment at a first temperature.
Abstract:
PROBLEM TO BE SOLVED: To provide a design of a stepped nozzle in which an ink droplet size can be regulated independently from droplet velocity and the necessity of the complicated design optimization is reduced.SOLUTION: An inkjet printer includes: a print head configured to receive ink; and one or more stepped nozzles provided with the print head. The one or more stepped nozzles have an exit diameter which is set so as to regulate the droplet size of ink to be ejected and an entrance diameter which is set so as to regulate the velocity of the ink droplet to be ejected independently from the size of the ink droplet to be ejected.
Abstract:
PROBLEM TO BE SOLVED: To provide an inkjet printing system that independently control the mass and speed of ink liquid drops ejected from an inkjet print head. SOLUTION: A taper angle 330 depends on relationships among an exit diameter 310, an inside diameter 315, and/or thickness 325. For example, when the thickness 325 is fixed, the taper angle 330 can get larger as the difference between the exit diameter 310 and the inside diameter 315 is increased. Likewise, when the thickness 325 is fixed, the taper angle 330 can get smaller as the difference between the exit diameter 310 and the inside diameter 315 is decreased. The different values of and adjustments among the exit diameter 310, the inside diameter 315, the thickness 325, and the taper angle 330 can dictate the mass and speed of ink liquid drops that exit the nozzle 305. Further, they can allow the mass and speed of liquid drops to be independently dictated by the exit diameter 310 and the taper angle 330, respectively. COPYRIGHT: (C)2011,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To connect a chip conductor to a package conductor without wire bonding. SOLUTION: A substrate (chip) 320 is bonded on the surface of a package 310. A sealing member is printed on the surface of the package 310 and a substrate 320, a conductive member is printed over a formed sealing layer 350, a sealing member is printed over a formed wire layer 360, and some layers including a forming sealing layer 370 are cured occasionally or collectively. A semiconductor device 300 can be manufactured through these steps described above. A space between a package-side connecting pad 340 and a substrate-side connecting pad 330 is connected with the wire layer 360. The space between the wire layer 360 and the surface of the package 310 and the substrate 320 is electrically insulated with the sealing layer 350 of a predetermined thickness extending along the surface of the package 310 and the substrate 320. The pattern of a stratified wire formed in the wire layer 360 can be set more softly than the wire bonding. COPYRIGHT: (C)2009,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To minimize a possibility of short circuits in a micro electromechanical system(MEMS) which possibly contacts a conductive fluid, and also avoid effects of electromagnetic interference to the MEMS. SOLUTION: An electrical connection is formed in a microstructure of the micro electromechanical system(MEMS) which is provided with a first conductive layer arranged on a substrate and formed of a conductive material for forming a conductive pathway, a first dielectric layer arranged on the first conductive layer and formed of a dielectric material for sealing the conductive material, and a second conductive layer arranged on the first dielectric layer and formed of a conductive material for forming an outer shield.
Abstract:
PROBLEM TO BE SOLVED: To provide a capacitive electrostatic actuator or a silicon material actuator which has solved the problem that an minute electromechanical structure(MEMS) generates a electrode contact and causes damage to electrodes as a result of arc discharge after several thousands of cycles, the electrode contact is generated between the center area of an element supported to prevent contact and a certain position of the edge of thin film separated from the opposite electrode due to the sufficient deflection of a silicon thin film, and contact at the intermediate positions of these elements and subsequent arc discharge are generated in relation to an earlier deterioration and fault of a capacitor, thereby extremely shortening the operation life of the actuator. SOLUTION: The minute electromechanical type liquid exhausting apparatus is provided with an internal structure to insulate a conductor at the bottom surface of the upper part of a thin film, and an external structure to prevent contact between electrodes due to an excessive deflection of the thin film at a position isolated from the center area of the thin film of the bottom surface at the upper part of the thin film.