Abstract:
A sensor system for measuring physical properties of paper. The paper property sensor system includes a surface and a diaphragm (202) opposed to each other. The small diaphragm includes a first pair (A1, A2) and a second pair (B1, B2) p-type piezoresistors. Each piezoresistor (A1, A2) of the first pair is located perpendicular to and very close to one of the long edges (Fig. 5) of the diaphragm (202). Each piezoresistor (B1, B2) of the second pair is located between and parallel to first pair (A1, A2) of piezoresistors, and away from the short edges of the diaphragm (202). Balancing the first pair of piezoresistors against the second pair in a first Wheatstone bridge (Fig. 7) produces a voltage generated proportional to the thickness of a sheet, while balancing the piezoresistors of the first pair against one another of the piezoresistors of the second pair produces a voltage representative of the coefficient of friction of the sheet.
Abstract:
A system (140) for measuring the mass of a sheet (150) of material including an actuator (141), a position sensing system (42), and a tactile sensor system (200). The actuator (141) imparts a known force to the sheet (150), moving it through to the position sensing system (142), which measures the sheet velocity at various points. Afterward, the sheet (150) moves through the tactile sensor system (200), which determines the coefficient of friction of the sheet. Given these quantities, a controller can determine the mass of the sheet (150), which can be used alter the performance of paper handling devices in a reproductive machine. A second embodiment (Fig. 6) of the mass measuring system includes an actuator, a position sensing system, and a subsystem for eliminating friction. The actuator applies a force to a sheet to move it into and through the subsystem. The position sensing system incorporated in the subsystem senses the acceleration of the sheet. Given this quantity, a controller can determine the mass of the sheet.
Abstract:
A system (140) for measuring the mass of a sheet (150) of material including an actuator (141), a position sensing system (42), and a tactile sensor system (200). The actuator (141) imparts a known force to the sheet (150), moving it through to the position sensing system (142), which measures the sheet velocity at various points. Afterward, the sheet (150) moves through the tactile sensor system (200), which determines the coefficient of friction of the sheet. Given these quantities, a controller can determine the mass of the sheet (150), which can be used alter the performance of paper handling devices in a reproductive machine. A second embodiment (Fig. 6) of the mass measuring system includes an actuator, a position sensing system, and a subsystem for eliminating friction. The actuator applies a force to a sheet to move it into and through the subsystem. The position sensing system incorporated in the subsystem senses the acceleration of the sheet. Given this quantity, a controller can determine the mass of the sheet.
Abstract:
An optical micro-electro-mechanical system (MEMS) switch is disclosed. In a preferred embodiment the optical MEMS switch is used as an M x N optical signal switching system. The optical MEMS switch comprises a plurality of optical waveguides formed on a shuttle for switching optical states wherein the state of the optical switch is changed by a system of drive and latch actuators. The optical MEMS switch utilizes a latching mechanism in association with a thermal drive actuator for aligning the waveguide shuttle. In use the optical MEMS switch may be integrated with other optical components to form planar light circuits (PLCs). When switches and PLCs are integrated together on a silicon chip, compact higher functionality devices, such as Reconfigurable Optical Add-Drop Multiplexers (ROADMs), may be fabricated.
Abstract:
The present invention provides a micromechanical or microoptomechanical structure produced by a process comprising defining the structure in a single-crystal silicon layer separated by an insulator layer from a substrate layer; selectively etching the single crystal silicon layer; depositing and etching a polysilicon layer on the insulator layer, with remaining polysilicon forming mechanical elements of the structure; metalizing a backside of the structure; and releasing the formed structure.
Abstract:
A dry etch process for etching a semiconductor substrate having a p-n heterojunction formed by contact between a p-layer and a n-layer requires application of a reverse bias voltage of less than a p-n breakdown voltage across the p-n heterojunction. A plasma containing chemically reactive negative ions is directed against the n-layer, with etching of non-masked regions of the substrate continuing until it is substantially stopped at the reverse biased p-n heterojunction. The semiconductor substrate can be cooled or periodically recoated with erodable protective material to limit sidewall damage to the semiconductor substrate while still allowing downward etching. This dry etch process is well suited for construction of dimensionally accurate microdevices and microelectromechanical systems.
Abstract:
A system (140) for measuring the mass of a sheet (150) of material including an actuator (141), a position sensing system (42), and a tactile sensor system (200). The actuator (141) imparts a known force to the sheet (150), moving it through to the position sensing system (142), which measures the sheet velocity at various points. Afterward, the sheet (150) moves through the tactile sensor system (200), which determines the coefficient of friction of the sheet. Given these quantities, a controller can determine the mass of the sheet (150), which can be used alter the performance of paper handling devices in a reproductive machine. A second embodiment (Fig. 6) of the mass measuring system includes an actuator, a position sensing system, and a subsystem for eliminating friction. The actuator applies a force to a sheet to move it into and through the subsystem. The position sensing system incorporated in the subsystem senses the acceleration of the sheet. Given this quantity, a controller can determine the mass of the sheet.
Abstract:
A thermal ink-jet ejector (10) having a fluid flow channel (12) extending between an ink inlet (16) and a nozzle (18) for the ejection of liquid ink therefrom, includes a rear channel diffuser (30) disposed between the heating element (20) and the inlet (16), and/or a front channel diffuser (32) disposed between the heating element (20) and the nozzle (16). Each diffuser (30, 32) includes an arrangement of tapers which decrease the flow impedance of liquid ink flowing toward the nozzle (18), and increase the flow impedance of liquid ink flowing toward the inlet (16). The arrangement increases the kinetic energy of droplets being ejected, and also increases the speed of re-fill of the channel with liquid ink following ejection.
Abstract:
A print head (24) is disclosed for use in a marking apparatus in which a propellant stream (A) is passed through a channel (34) and directed toward a substrate (38). Marking material (28), such as ink, toner, etc., is controllably introduced into the propellant stream (A) and imparted with sufficient kinetic energy thereby to be made incident upon the substrate (38). A multiplicity of channels for directing the propellant and marking material allow for high throughput, high resolution marking. Multiple marking materials (28C, 28M, 28Y, 28K) may be introduced into the channel (34) and mixed therein prior to being made incident on the substrate (38), or mixed or superimposed on the substrate (38) without re-registration. One example is a single-pass, full-color printer.