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公开(公告)号：EP1193530A3
公开(公告)日：2003-08-13
申请号：EP01307643.5
申请日：2001-09-07
Applicant: Xerox Corporation
Inventor： Rosa, Michel A. , Fork, David K. , Peeters, Eric
CPC classification number: G02B6/3518 , B81B2201/045 , B81B2203/04 , B81C1/00666 , G02B6/3556 , G02B6/358 , G02B6/3584 , G02B26/0841
Abstract: Optical cross-connect (100) involve the general concept of a two dimensional array (104) of microelectromechanical system (MEMS) tilt mirrors (106) being used to direct light coming from a first optical fiber (110) to a second optical fiber (111). Each MEMS tilt mirror (106) in the two dimensional array can rotate about its x and y axis and is suspended by a plurality of suspension arms (450) attached to a glass substrate.
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公开(公告)号：EP1231617A1
公开(公告)日：2002-08-14
申请号：EP02250727.1
申请日：2002-02-01
Applicant: Xerox Corporation
Inventor： Fork, David K. , Chua, Christopher L. , Van Schuylenbergh, Koenraad F. , Johnson, Noble M. , Biegelsen, David K.
CPC classification number: H01L27/08 , H01F17/0033 , H01F41/041 , H01L21/4853 , H05K3/4092
Abstract: Several methods and structures for improving the yield of out-of-plane micro-device structures including springs and coils (31,32) are described. In one method the elastic members have graded perforations for controlling rate of release. In another method and structure, a layout enables the contact landing area to be increased. To form the coils opposite ends of the sprigs (31,32) are provided with inter-engaging formations (33,34) to facilitate their interconnection. The high yield structures may be used in numerous electronic applications such as filter circuits.
Abstract translation: 描述了用于提高包括弹簧和线圈（31,32）的面外微型器件结构的产量的几种方法和结构。 在一种方法中，弹性构件具有用于控制释放速率的渐变穿孔。 在另一种方法和结构中，布局使得能够增加接触着陆区域。 为了形成线圈，小柱（31,32）的相对端部设置有相互接合的结构（33,34），以便于它们的互连。 高产量结构可用于许多电子应用中，例如滤波电路。
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33.发明公开Amorphous silicon sensor with micro-spring interconnects for achieving high uniformity in integrated light-emitting sources 有权具有微槽的连接由非晶硅制成的传感器，用于产生在集成发光器件高均匀性
公开(公告)号：EP1110739A2
公开(公告)日：2001-06-27
申请号：EP00127818.3
申请日：2000-12-19
Applicant: Xerox Corporation
Inventor： Lemmi, Francesco , Chua, Christopher L. , Mei, Ping , Lu, Jeng Ping , Fork, David K. , McIntyre, Harry J.
CPC classification number: H01L31/1055 , B41J2/45 , H01L25/0753 , H01L31/1016 , H01L2924/0002 , H01L2924/3011 , H01S5/02 , H01S5/0262 , H01S5/4025 , H01L2924/00
Abstract: A hybrid structure or device is provided wherein carried on a single substrate is at least one micro-spring interconnect having an elastic material that is initially fixed to a surface of the substrate, an anchor portion which is fixed to the substrate surface and a free portion. The spring contact is self-assembling in that as the free portion is released it moves out of the plane of the substrate. Also integrated on the substrate is a sensor having an active layer and contacts. The substrate and sensor may be formed of materials which are somewhat partially transparent to light at certain infrared wavelengths.
Abstract translation: 一种混合结构或装置被提供worin承载在单个基片由具有弹性材料的至少一个微弹簧互连并最初固定到基板的表面上，一个锚定部分的所有其固定于基板表面和自由部 ， 弹簧接触是自组装，DASS作为游离部分被释放它移出衬底的平面之外。 这样在基片上集成是具有活性层和接触的传感器。 基板和传感器可以被形成的，其在红外某些波长有些部分透光的材料。
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34.发明公开
公开(公告)号：EP0810638A2
公开(公告)日：1997-12-03
申请号：EP97303455.6
申请日：1997-05-21
Applicant: XEROX CORPORATION
Inventor： Fork, David K. , Boyce, James B. , Mei, Ping , Ready, Steve , Johnson, Richard I. , Anderson, Greg B.
IPC: H01L21/20 , H01L21/316
CPC classification number: H01L21/0237 , H01L21/02488 , H01L21/02532 , H01L21/0262 , H01L21/02675 , Y10S438/967 , Y10T428/24479 , Y10T428/24926 , Y10T428/265
Abstract: The invention provides a buffered substrate that includes a substrate, a buffer layer and a silicon layer. The buffer layer is disposed between the substrate and the silicon layer. The buffer layer has a melting point higher than a melting point of the substrate. A polycrystalline silicon layer is formed by crystallizing the silicon layer using a laser beam.
Abstract translation: 本发明提供一种缓冲衬底，其包括衬底，缓冲层和硅层。 缓冲层设置在基板和硅层之间。 缓冲层的熔点高于基板的熔点。 通过使用激光束使硅层结晶来形成多晶硅层。
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公开(公告)号：EP0917084B1
公开(公告)日：2011-03-09
申请号：EP98309137.2
申请日：1998-11-09
Applicant: Xerox Corporation
Inventor： Fork, David K.
CPC classification number: G06K7/10732 , H04N1/486
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Patent Agency Ranking
公开(公告)号：EP1231617B1
公开(公告)日：2010-06-09
申请号：EP02250727.1
申请日：2002-02-01
Applicant: Xerox Corporation
Inventor： Fork, David K. , Chua, Christopher L. , Van Schuylenbergh, Koenraad F. , Johnson, Noble M. , Biegelsen, David K.
CPC classification number: H01L27/08 , H01F17/0033 , H01F41/041 , H01L21/4853 , H05K3/4092
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公开(公告)号：EP1277696B1
公开(公告)日：2006-07-05
申请号：EP02254667.5
申请日：2002-07-03
Applicant: Xerox Corporation
Inventor： Fork, David K. , Chua, Christopher L.
CPC classification number: B81C1/00666 , B81B2203/0118 , B81B2203/0307 , B81C1/00476 , G01R1/06727 , G01R3/00 , H01L2924/0002 , H01R12/52 , H01R12/718 , H01R13/035 , H01R13/24 , H05K3/4092 , Y10T29/49147 , Y10T29/49204 , Y10T29/49208 , H01L2924/00
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公开(公告)号：EP1193530B1
公开(公告)日：2006-02-01
申请号：EP01307643.5
申请日：2001-09-07
Applicant: Xerox Corporation
Inventor： Rosa, Michel A. , Fork, David K. , Peeters, Eric
CPC classification number: G02B6/3518 , B81B2201/045 , B81B2203/04 , B81C1/00666 , G02B6/3556 , G02B6/358 , G02B6/3584 , G02B26/0841
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公开(公告)号：EP1277696A3
公开(公告)日：2004-04-07
申请号：EP02254667.5
申请日：2002-07-03
Applicant: Xerox Corporation
Inventor： Fork, David K. , Chua, Christopher L.
CPC classification number: B81C1/00666 , B81B2203/0118 , B81B2203/0307 , B81C1/00476 , G01R1/06727 , G01R3/00 , H01L2924/0002 , H01R12/52 , H01R12/718 , H01R13/035 , H01R13/24 , H05K3/4092 , Y10T29/49147 , Y10T29/49204 , Y10T29/49208 , H01L2924/00
Abstract: Methods are disclosed for fabricating spring structures (127) in which a passive, conductive coating (130) is deposited onto the spring structure (127) after release. A release layer (110) is deposited on a substrate (101) and then a spring metal layer (120) is formed thereon. A first mask is then used to etch the spring metal layer to form a spring metal finger (127). A second (release) mask is then deposited that defines a release window used to remove a portion of the release layer (110) and release a free end of the spring metal finger. The second mask is also used as a mask during the subsequent directional deposition of a conductive coating material (130) on the cantilevered tip of the finger (127). The second mask is then stripped, and the residual coating deposited thereon is lifted off. The resulting spring structure includes conductive coating (130) on the upper surface and front edge (128) of the finger tip.
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40.发明公开Capillary-channel probes for liquid pickup, transportation and dispense using spring beams 有权Kapillarkanalsonden使用弹簧臂接收，运输和分配液体的
公开(公告)号：EP1388369A2
公开(公告)日：2004-02-11
申请号：EP03254696.2
申请日：2003-07-28
Applicant: Xerox Corporation
Inventor： Hantschel, Thomas , Fork, David K. , Rosa, Michael A. , DeBruyer, Dirk , Chow, Eugene M.
CPC classification number: G01N35/1074 , B01J2219/00387 , B01L3/0244 , B01L3/0255 , B01L3/502715 , B01L2300/0819 , B01L2400/025 , B01L2400/0406 , B41J2/14314 , B41J2/16 , B41J2/1628 , B41J2/1629 , B41J2/1631 , B41J2/1632 , B41J2/1639 , B41J2/1643 , C40B60/14 , G01N35/1009 , G01N2035/00237 , G01N2035/1037 , G03F7/0002 , Y10T436/2575
Abstract: Fluidic conduits (330A), which can be used in microarraying systems (300), dip pen nanolithography systems, fluidic circuits, and microfluidic systems, are disclosed that use channel spring probes (350) that include at least one capillary channel (351). Formed from spring beams (e.g., stressy metal beams) that curve away from the substrate when released, channels (351) can either be integrated into the spring beams (300) or formed on the spring beams. Capillary forces produced by the narrow channels (351) allow liquid to be gathered, held, and dispensed by the channel spring probes. Because the channel spring beams can be produced using conventional semiconductor processes, significant design flexibility and cost efficiencies can be achieved.
Abstract translation: 流体导管（330A），其可在microArraying系统（300），蘸笔纳米光刻系统，流体回路，和微流体系统中使用，但盘游离缺失确实使用了信道弹簧探针（350）确实包括至少一个毛细通道（351）。 从弹簧束形成（例如，stressy金属梁）做曲线从所述基板离开当释放时，通道（351）可以被集成到无论是弹簧杆（300）或形成在弹性梁。 由窄的通道（351）中产生的毛细管力使液体被收集，英雄，并且由信道弹簧探针分配。 因为信道弹簧杆可使用常规的半导体工艺来制造，显著设计灵活性和成本效率得以实现。
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