Abstract:
본 발명에 따라 공간 절약형 마이크로 부품들과 나노 부품들 및 이들의 제조 방법이 제안된다. 이러한 부품들의 특징은, 상기 부품들이 상당한 두께의 경성 기판을 갖지 않는다는 점이다. 이 경우, 기계적으로 응력 보상이 이루어지는 구조를 이용하여, 그리고/또는 적절한 응력 보상층들의 증착을 통한 능동적인 기계적 응력 보상에 의해, 부품 내에서 변형 및/또는 휨을 야기하는 기계적 응력이 보상되므로, 비교적 두꺼운 기판에 대한 필요성이 없어진다. 그럼으로써 상기 부품들의 전체 두께가 감소하고, 기술적 시스템 내에서의 집적 가능성이 향상된다. 추가로 이와 같은 부품들의 사용 분야가 확장된다.
Abstract:
An electronic apparatus includes a first die, a second die, a third die, and a fourth die, wherein a portion of the second die and a portion of the third die are movably connected between the first die and the fourth die.
Abstract:
An actuator comprises a connection section having one end rotatably connected to a connection point (C1) of a fixed section and the other end rotatably connected to a connection point (C2) of a moving section, a connection section having one end rotatably connected to a connection point (C3) of the fixed section and the other end rotatably connected to a connection point (C4) of the moving sections a comb-teeth electrode having the root section connected to a comb-teeth base point (B1) and the fore-end section extending along the turning path, and a comb-teeth electrode having the root section connected to the fixed section and the other section extending along the curve of the comb-teeth electrode and opposed to the comb-teeth electrode with a predetermined gap.
Abstract:
A method of fabricating a micro actuator is provided including a media stage having a media loading surface and a coil for driving the media stage, formed on the opposite surface of the media stage to the media loading surface. The method includes forming a groove on a first surface of a first substrate, forming a coil on a first surface of a second substrate, bonding the first surface of the first substrate to the first surface of the second substrate, and forming the media loading surface on a second surface of the second substrate, which is opposite the first surface of the second substrate.
Abstract:
An electronic apparatus includes a first die, a second die, a third die, and a fourth die, wherein a portion of the second die and a portion of the third die are movably connected between the first die and the fourth die.
Abstract:
The hinge (13) should preferably be formed to have a higher resistance than ever against the pivoting of the mirror body (12) to effectively prevent the hinge (13) from being damaged. By adopting a suitable one of a variety of production steps as necessary, the hinge (13) can be formed more finely and with a higher precision and thus the micro mirror unit can be produced more easily in a shorter time. To this end, the hinge (13) is formed from a different material, such as SiNX, from the mirror substrate material from which the frame (11) and mirror body (12) are formed.
Abstract translation:优选地,铰链(13)形成为具有比以往更高的抗反射镜主体(12)的枢转的阻力,以有效地防止铰链(13)被损坏。 通过根据需要采用各种生产步骤中的合适的一种,铰链(13)可以更精细地形成并且具有更高的精度,从而可以在更短的时间内更容易地制造微反射镜单元。 为此,铰链(13)由形成框架(11)和镜体(12)的反射镜基板材料由不同的材料(例如SiN x X)形成。
Abstract:
A thermal actuator includes a first arm having a proximal end and a distal end, a second arm, parallel to the first arm, having a proximal end and a distal end, and a third arm arranged between and parallel to the first and second arms, the third arm having a proximal end and a distal end. The third arm has at least one portion at the distal end of the third arm having a width that is substantially larger than a width of the first arm and a width of the second arm. The distal ends of the first, second and third arms are coupled together to form a distal end of the thermal actuator, and the first, second and third arms preferably are made of a single material. A number of thermal actuators can be arranged in an array. The thermal actuator or array of thermal actuators can be coupled to an applicator.
Abstract:
A method of fabricating a semiconductor integrated microactuator device that includes the steps of: bonding or laminating a driving element to a substrate for generating a vertical motion, and coupling a conversion element to the driving element for converting the vertical motion into rotational motion. The method can be effectively used for micro-actuators that utilize Coulomb's force, vibration, and fluid pressure as their driving force.