公开(公告)号：US20080171836A1

公开(公告)日：2008-07-17

申请号：US11834651

申请日：2007-08-06

Applicant: Bruce P. Lee

Inventor： Bruce P. Lee

IPC: C08F283/06

CPC classification number: C08G69/40 ,  C08F8/00 ,  C08G65/33389 ,  C08G71/04 ,  C09D5/1637 ,  C09J171/02 ,  C09J175/04 ,  C09J201/06

Abstract: Synthesis methods for creating polymeric compounds comprising dihydroxyphenyl derivatives (DHPD), or DHPp i.e. polymers modified with DHPD, with desired surface active effects are described. The polymer backbone of DHPp has structural or performance features that can be tailored to control physical properties of DHPp, allowing it to be useful for different applications i.e. tissue adhesives or sealants, adhesion promoting coatings, and antifouling coatings.

Abstract translation: 描述了用于产生包含二羟基苯基衍生物（DHPD）或DHPp，即用DHPD改性的聚合物的聚合化合物的合成方法，其具有所需的表面活性效果。 DHPp的聚合物骨架具有结构或性能特征，其可以被调整以控制DHPp的物理性能，使其可用于不同的应用，即组织粘合剂或密封剂，粘附促进涂层和防污涂料。

公开(公告)号：US06627688B1

公开(公告)日：2003-09-30

申请号：US09830903

申请日：2001-05-02

Applicant: Yasuyuki Takeda

Inventor： Yasuyuki Takeda

IPC: C08K509

CPC classification number: C09J133/062 ,  C08G18/6229 ,  C08G2290/00 ,  C08L2666/34 ,  C09D175/04 ,  C09J7/22 ,  C09J7/29 ,  C09J7/38 ,  C09J201/06 ,  C09J2203/334 ,  C09J2400/163 ,  C09J2433/00 ,  Y10T428/31605 ,  Y10T428/31681 ,  Y10T428/31692 ,  Y10T428/31696 ,  Y10T428/31699

Abstract: The adhesive composition comprises a hydroxyl group-containing adhesive polymer having little or no carboxylic groups in the molecule, and a separate compound that is an aromatic carboxylic acid compound. This composition prevents the corrosion of a metal layer without requiring formation of a protective film in the production of an adhesive sheet comprising a metal layer.

Abstract translation: 粘合剂组合物包含在分子中具有很少或不具有羧基的含羟基的粘合剂聚合物和作为芳族羧酸化合物的单独化合物。 该组合物在生产包括金属层的粘合片时不会形成保护膜，从而防止金属层的腐蚀。

公开(公告)号：US20180016481A1

公开(公告)日：2018-01-18

申请号：US15545786

申请日：2016-12-27

Applicant: NITTO DENKO CORPORATION ,  NITTO, Inc.

Inventor： Yoshio TERADA ,  Kyle Robert BARNES ,  Midori SEGAWA

IPC: C09J201/06 ,  C09J7/02 ,  C09J133/00 ,  C09J201/02

CPC classification number: C09J201/06 ,  C01B32/20 ,  C01B32/21 ,  C09J7/20 ,  C09J7/385 ,  C09J7/40 ,  C09J133/00 ,  C09J133/04 ,  C09J201/00 ,  C09J201/025 ,  C09J2201/602 ,  C09J2203/326 ,  C09J2400/10

Abstract: Provided are a graphite pressure-sensitive adhesive tape that is suitable for improving thermal efficiency; and a graphite pressure-sensitive adhesive tape with a release liner, which contains the pressure-sensitive adhesive tape. This graphite pressure-sensitive adhesive tape with a release liner is provided with a graphite pressure-sensitive adhesive tape, which has a first pressure-sensitive adhesive layer and a graphite layer in this order, and a release liner that protects the surface of the first pressure-sensitive adhesive layer. The first pressure-sensitive adhesive layer has a single layer structure.

公开(公告)号：US20170226263A1

公开(公告)日：2017-08-10

申请号：US15519306

申请日：2015-11-24

Applicant: MITSUBISHI GAS CHEMICAL COMPANY, INC.

Inventor： Takashi KOBAYASHI ,  Kentaro TAKANO ,  Masayuki KATAGIRI ,  Keita TOKUZUMI ,  Tatsuya SHIMA

IPC: C08G14/12 ,  B32B15/14 ,  B32B5/02 ,  H01L23/29 ,  C08G73/06 ,  C08L61/34 ,  C08L63/00 ,  C08J5/24 ,  B32B15/098 ,  B32B7/12

CPC classification number: C08G14/12 ,  B32B5/022 ,  B32B7/12 ,  B32B15/098 ,  B32B15/14 ,  B32B2260/046 ,  B32B2262/0269 ,  B32B2262/0276 ,  C08G61/02 ,  C08G73/0655 ,  C08J5/24 ,  C08J2361/34 ,  C08L61/00 ,  C08L61/34 ,  C08L63/00 ,  C08L71/02 ,  C08L79/04 ,  C09J4/00 ,  C09J11/06 ,  C09J11/08 ,  C09J161/00 ,  C09J161/34 ,  C09J163/00 ,  C09J165/04 ,  C09J179/04 ,  C09J201/06 ,  C09K3/10 ,  H01L23/29

Abstract: The present invention provides a cyanic acid ester compound having a structure represented by the following general formula (1): wherein n represents an integer of 1 or larger.

公开(公告)号：US09574266B2

公开(公告)日：2017-02-21

申请号：US14164867

申请日：2014-01-27

Applicant: TOPPAN PRINTING CO., LTD.

Inventor： Mitsuru Kano ,  Jin Sato ,  Toshiaki Yoshihara ,  Masato Kon

IPC: C23C16/02 ,  C23C16/04 ,  C23C16/44 ,  C23C16/455 ,  C08K3/00 ,  C09J201/02 ,  C09J201/06 ,  C09J201/08 ,  B05D3/14 ,  B05D3/10 ,  B32B7/04 ,  C23C16/40 ,  C23C28/04 ,  C23C28/00 ,  B05D3/00

CPC classification number: C23C16/403 ,  B05D3/007 ,  B05D3/107 ,  B05D3/141 ,  B05D3/145 ,  B05D3/148 ,  B32B7/04 ,  C08K3/01 ,  C08K3/013 ,  C09J201/02 ,  C09J201/025 ,  C09J201/06 ,  C09J201/08 ,  C09J2400/10 ,  C09J2400/22 ,  C23C16/02 ,  C23C16/0227 ,  C23C16/0245 ,  C23C16/0272 ,  C23C16/04 ,  C23C16/405 ,  C23C16/44 ,  C23C16/455 ,  C23C16/45525 ,  C23C16/45555 ,  C23C28/00 ,  C23C28/042 ,  Y10T428/25 ,  Y10T428/251 ,  Y10T428/258 ,  Y10T428/259 ,  Y10T428/31562 ,  Y10T428/31721 ,  Y10T428/31757

Abstract: A laminate body includes a base material, a film-like or a membrane-like undercoat layer that is formed in at least a portion of the outer surface of the base material, and an atomic layer deposition film that is formed on a surface opposite to a surface coming into contact with the base material among both surfaces of the undercoat layer in the thickness direction thereof. At least a portion of precursors of the atomic layer deposition film bind to the undercoat layer, and the atomic layer deposition film is formed into a membrane shape covering the undercoat layer.

Abstract translation: 层压体包括形成在基材的外表面的至少一部分中的基材，膜状或膜状底涂层，以及形成在与基材的相反侧的表面上的原子层沉积膜 在底涂层的厚度方向的两面中与基材接触的表面。 原子层沉积膜的前体的至少一部分与底涂层结合，原子层沉积膜形成为覆盖底涂层的膜状。

公开(公告)号：US20150184043A1

公开(公告)日：2015-07-02

申请号：US14580699

申请日：2014-12-23

Applicant: BOSTIK SA

Inventor： David GOUBARD ,  Olivier LAFERTE ,  Herveline TROADEC

IPC: C09J175/04 ,  C09J201/06 ,  C09J7/02

CPC classification number: C09J175/08 ,  C08G18/10 ,  C08G18/227 ,  C08G18/289 ,  C08G18/4825 ,  C08G18/4829 ,  C08G18/5096 ,  C08G18/755 ,  C08L9/00 ,  C09J7/26 ,  C09J7/38 ,  C09J175/04 ,  C09J201/06 ,  C09J2201/122 ,  C09J2201/16 ,  C09J2201/606 ,  C09J2201/622 ,  C09J2400/243 ,  C09J2475/00 ,  C09J2483/00 ,  Y10T428/2896

Abstract: The present invention relates to a self-adhesive article comprising a support layer of foam or similar type and an adhesive layer obtained by cross-linking an adhesive composition. The present invention also relates to a mixture of at least two polymers suitable for use for the manufacture of the self-adhesive article as well as an adhesive composition comprising said mixture of at least two polymers according to the invention.

公开(公告)号：US08815793B2

公开(公告)日：2014-08-26

申请号：US11068298

申请日：2005-02-28

Applicant: Phillip B. Messersmith ,  Jeffrey Dalsin ,  Lijun Lin ,  Bruce P. Lee ,  Kul Huang

Inventor： Phillip B. Messersmith ,  Jeffrey Dalsin ,  Lijun Lin ,  Bruce P. Lee ,  Kul Huang

IPC: A61K38/00 ,  C08L89/02

CPC classification number: C09J201/06 ,  A61L24/046 ,  C08G65/3331 ,  C08G65/33317 ,  C08G65/33396 ,  C09J171/02 ,  C08L71/02 ,  C08L101/02

Abstract: Adhesive polymeric compositions which can comprise dihydroxyphenyl moieties and derivatives thereof, and related methods of use.

Abstract translation: 可包含二羟基苯基部分及其衍生物的粘合剂聚合物组合物及相关使用方法。

公开(公告)号：US20120078296A1

公开(公告)日：2012-03-29

申请号：US13245608

申请日：2011-09-26

Applicant: Bruce P. Lee

Inventor： Bruce P. Lee

IPC: A61B17/03 ,  B32B37/12

CPC classification number: C08G69/40 ,  C08F8/00 ,  C08G65/33389 ,  C08G71/04 ,  C09D5/1637 ,  C09J171/02 ,  C09J175/04 ,  C09J201/06

Abstract: Synthesis methods for creating polymeric compounds comprising dihydroxyphenyl derivatives (DHPD), or DHPp i.e. polymers modified with DHPD, with desired surface active effects are described. The polymer backbone of DHPp has structural or performance features that can be tailored to control physical properties of DHPp, allowing it to be useful for different applications i.e. tissue adhesives or sealants, adhesion promoting coatings, and antifouling coatings.

Abstract translation: 描述了用于产生包含二羟基苯基衍生物（DHPD）或DHPp，即用DHPD改性的聚合物的聚合化合物的合成方法，其具有所需的表面活性效果。 DHPp的聚合物骨架具有结构或性能特征，其可以被调整以控制DHPp的物理性能，使其可用于不同的应用，即组织粘合剂或密封剂，粘附促进涂层和防污涂料。

公开(公告)号：US07629056B2

公开(公告)日：2009-12-08

申请号：US10860578

申请日：2004-06-04

Applicant: Itsuo Watanabe ,  Tohru Fujinawa ,  Motohiro Arifuku ,  Houko Kanazawa ,  Atsushi Kuwano

Inventor： Itsuo Watanabe ,  Tohru Fujinawa ,  Motohiro Arifuku ,  Houko Kanazawa ,  Atsushi Kuwano

IPC: B32B27/30 ,  B32B27/28 ,  B32B27/34 ,  B32B27/36 ,  B32B27/38 ,  B32B27/42 ,  C09J5/06

CPC classification number: H01L24/83 ,  C08G18/0823 ,  C08G18/2865 ,  C08G18/3206 ,  C08G18/3821 ,  C08G18/672 ,  C08K5/14 ,  C08K5/1515 ,  C08K5/521 ,  C08L9/02 ,  C08L13/00 ,  C08L21/00 ,  C09D5/24 ,  C09D175/16 ,  C09J201/06 ,  H01B1/20 ,  H01B1/22 ,  H01L23/293 ,  H01L24/29 ,  H01L24/81 ,  H01L2224/04026 ,  H01L2224/16225 ,  H01L2224/2919 ,  H01L2224/73204 ,  H01L2224/81801 ,  H01L2224/83192 ,  H01L2224/838 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01052 ,  H01L2924/01067 ,  H01L2924/01073 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/04953 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/07811 ,  H01L2924/09701 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/19043 ,  H05K3/323 ,  H05K3/361 ,  H05K2201/0133 ,  H05K2201/0145 ,  Y10T428/31511 ,  Y10T428/31515 ,  Y10T428/31725 ,  Y10T428/31786 ,  Y10T428/31855 ,  Y10T428/31935 ,  C08G18/8016 ,  C08L2666/16 ,  H01L2924/00

Abstract: A circuit terminal connected structure and a circuit terminal connecting method are provided. Both the structure and the method feature a circuit connecting material formulated with the following components: a curing agent capable of generating free radicals upon heating; an acrylate or methacrylate radical polymerizable substance; and either an acrylic rubber or a maleimide radical polymerizable substance having at least two maleimide groups per molecule. In some embodiments, the curing agent features a 10-hour half life temperature of 40° C. or above and a 1-minute half-life temperature of 180° C. or below. In other embodiments, the circuit connecting material includes conductive particles. In additional embodiments, the circuit connecting material includes a hydroxyl-group-containing resin having a weight average molecular weight of 10,000 or more.

Abstract translation: 提供电路端子连接结构和电路端子连接方法。 结构和方法都具有由以下组分配制的电路连接材料：加热时能够产生自由基的固化剂; 丙烯酸酯或甲基丙烯酸酯可自由基聚合物质; 以及每分子具有至少两个马来酰亚胺基团的丙烯酸橡胶或马来酰亚胺可自由基聚合物质。 在一些实施方案中，固化剂具有40℃或更高的10小时半衰期和180℃或更低的1分钟半衰期温度。 在其他实施例中，电路连接材料包括导电颗粒。 在另外的实施方案中，电路连接材料包括重均分子量为10,000以上的含羟基的树脂。

公开(公告)号：US07119144B2

公开(公告)日：2006-10-10

申请号：US10178278

申请日：2002-06-24

Applicant: Jeffrey Harold Deitch ,  Joseph James Zupancic ,  Mai Chen

Inventor： Jeffrey Harold Deitch ,  Joseph James Zupancic ,  Mai Chen

IPC: B32B27/00 ,  C08L67/08

CPC classification number: C09J201/06 ,  C08G61/12 ,  C08G81/027 ,  C08G2261/334 ,  C08G2261/35 ,  C08G2261/42 ,  C08G2261/76 ,  Y10T428/31554 ,  Y10T428/31855

Abstract: A composition, which is particularly useful as an adhesive, as well as a method of making an adhesive composition, and a method of using an adhesive composition are disclosed.