公开(公告)号：EP2309521A1

公开(公告)日：2011-04-13

申请号：EP09171375.0

申请日：2009-09-25

Applicant: Arcus Elektrotechnik Alois Schiffmann GmbH

Inventor： Wild, Manuel ,  Lasinger, Fritz

IPC: H01C1/16 ,  H05K1/00 ,  H05K1/02 ,  H05K3/00

CPC classification number: H01C1/16 ,  H05K1/0286 ,  H05K1/141 ,  H05K1/142 ,  H05K1/167 ,  H05K3/0052 ,  H05K3/3447 ,  H05K3/368 ,  H05K2201/09263 ,  H05K2201/09963 ,  H05K2201/10303 ,  H05K2201/10363

Abstract: Es wird eine Widerstandsbaugruppe angegeben, die insbesondere für Mittelspannungs- und Hochspannungsanwendungen geeignet ist. Die Baugruppe weist einen isolierenden, langgestreckten Träger (10) mit zwei gegenüberliegenden Hauptflächen (11, 12) auf. Auf der einen Hauptfläche (11) ist eine erste Widerstandsanordnung (20) vorgesehen, während eine zweite Widerstandsanordnung (30) auf der anderen Hauptfläche (12) vorgesehen ist, die sich beide über die Länge des Trägers (10) erstrecken. Der Träger (10) besitzt eine Vielzahl von integrierten, abtrennbaren Modulen (14), die jeweils miteinander verbunden sind und miteinander verbundene Teile der beiden Widerstandsanordnungen (20) und (30) tragen. An den jeweiligen Enden der Module (14) sind Verbindungsanschlüsse (A - D) für die erste und die zweite Widerstandsanordnung (20, 30) vorgesehen.

Abstract translation: 电阻组件（100）具有隔离和细长的载体（10），其具有两个相对的相对的面。 电阻装置（20）设置在载体的一个表面上，主面在载体的长度上延伸。 载体具有多个集成和分离的模块（14）。

公开(公告)号：EP2203937A2

公开(公告)日：2010-07-07

申请号：EP08803570.4

申请日：2008-09-03

Applicant: Siemens Aktiengesellschaft

Inventor： BIRNER, Martin ,  KREUTZER, Rainer ,  SCHIERLING, Hubert ,  SELIGER, Norbert

IPC: H01L25/065 ,  H01L23/373 ,  H01L23/538

CPC classification number: H05K1/142 ,  H01L25/072 ,  H01L25/16 ,  H01L2924/0002 ,  H01L2924/30107 ,  H05K1/0306 ,  H05K3/0061 ,  H05K3/32 ,  H05K2201/09963 ,  Y10T29/49117 ,  H01L2924/00

Abstract: The invention relates to an electronic circuit. In order to improve manufacture thereof, the electronic circuit is composed of modules of sub-circuits that are arranged on a common substrate, such as a cooling body, and that are electrically interconnected by means of a planar electrical contact element.

Abstract translation: 为了改善电子电路的制造，电子电路由布置在诸如冷却体的公共基板上的子电路的模块构成，并且通过平面电接触元件电互连。

公开(公告)号：EP2198339A2

公开(公告)日：2010-06-23

申请号：EP08793593.8

申请日：2008-08-29

Applicant: LG Electronics Inc. ,  LG Innotek Co., Ltd.

Inventor： KIM, Yong Suk ,  HUR, Hoon

IPC: G02F1/13357

CPC classification number: H05K1/142 ,  H05K1/0206 ,  H05K1/141 ,  H05K3/403 ,  H05K2201/09963 ,  H05K2201/10106 ,  H05K2201/209 ,  H05K2203/167

Abstract: Disclosed are a light emitting unit and a liquid crystal display device using the same. The light emitting unit includes a circuit board including circuit lines and a plurality of connecting members, and a plurality of unit modules connected to the connecting members of the circuit board. The unit module includes at least one light emitting device.

公开(公告)号：EP0629110A2

公开(公告)日：1994-12-14

申请号：EP94108706.6

申请日：1994-06-07

Applicant: MURATA MANUFACTURING CO., LTD.

Inventor： Kohno, Yoshiaki ,  Suzuki, Tatsuya

IPC: H05K3/20

CPC classification number: H01L21/4846 ,  H05K1/0306 ,  H05K3/20 ,  H05K3/4611 ,  H05K3/4629 ,  H05K2201/0317 ,  H05K2201/09963 ,  H05K2203/0726

Abstract: A method of forming a predetermined conductive pattern (2) on a substrate (1) by preparing a plurality of transferring metal band supplying members(3, 4, 5)having a plurality of metal bands(3b, 4b, 5b) formed so as to form the conductive pattern (2) in a collected state respectively formed on supporting members (3a, 4a, 5a) and sequentially transferring the metal bands on the substrate (1) using the plurality of transferring metal band supplying members (3, 4, 5).

Abstract translation: 一种通过制备具有多个金属带（3b，4b，5b）的多个转移金属带供给构件（3,4,5）形成基板（1）上的预定导电图案（2）的方法，其形成为 以分别形成在支撑部件（3a，4a，5a）上的收集状态形成导电图案（2），并使用多个转印金属带供给部件（3,4）将基板（1）上的金属带顺序地转印， 5）。

公开(公告)号：US20170303418A1

公开(公告)日：2017-10-19

申请号：US15641223

申请日：2017-07-04

Applicant: Misako TAWARAYAMA

Inventor： Misako TAWARAYAMA

IPC: H05K7/02 ,  H05K7/14 ,  H05K5/02

CPC classification number: H05K7/023 ,  H05K1/0284 ,  H05K1/0286 ,  H05K1/14 ,  H05K5/0247 ,  H05K7/14 ,  H05K2201/09963

Abstract: The present invention provides a three-dimensional substrate having a different shape than the conventional circuit substrate when a plurality of components are combined to form an electronic circuit. In addition, an electronic device is provided from the three-dimensional substrate. The three-dimensional substrate forms a component forming the three-dimensional structure by three-dimensionally forming the electronic circuit. The component includes at least one electronic component and an electric connection structure for electrically connecting the electronic component with the outside the component. When a plurality of components are combined, the electronic device having the three-dimensional shape having a different shape than the component is formed. The present invention provides the three-dimensional substrate capable of being designed by the shape of the substrate itself.

公开(公告)号：US09208924B2

公开(公告)日：2015-12-08

申请号：US12552487

申请日：2009-09-02

Applicant: Daniel Boss ,  Scott Qualls ,  David McDonald ,  Terrance Z. Kaiserman ,  Keith J. Margolin ,  Michael Wassief ,  Liang Chai

Inventor： Daniel Boss ,  Scott Qualls ,  David McDonald ,  Terrance Z. Kaiserman ,  Keith J. Margolin ,  Michael Wassief ,  Liang Chai

IPC: H01B7/30 ,  H01B5/02 ,  H01R25/14 ,  H05K3/10 ,  H01B13/16 ,  H01R4/24

CPC classification number: H01H59/00 ,  H01B5/02 ,  H01B13/165 ,  H01H49/00 ,  H01R4/2404 ,  H01R25/147 ,  H05K3/103 ,  H05K2201/09672 ,  H05K2201/09963 ,  Y10T29/49117 ,  Y10T29/49155 ,  Y10T307/74

Abstract: An electrically conductive element, including an insulator and a first conductor, is provided, which can be affixed to a second conductor consisting of conductive structural element, wherein the insulator is positioned between the first and second conductors to electrically isolate them. A power supply may be connected between the first and second conductors to provide power thereto, and an electrical device may be connected across the first and second conductors.

Abstract translation: 提供了包括绝缘体和第一导体的导电元件，其可以固定到由导电结构元件组成的第二导体，其中绝缘体位于第一和第二导体之间以将它们电隔离。 电源可以连接在第一和第二导体之间以向其提供电力，并且电气设备可以跨越第一和第二导体连接。

公开(公告)号：US20150167910A1

公开(公告)日：2015-06-18

申请号：US14107759

申请日：2013-12-16

Applicant: Harald STOYAN

Inventor： Harald STOYAN

IPC: F21K99/00 ,  F21V23/06

CPC classification number: F21S2/005 ,  F21K9/20 ,  F21V23/06 ,  F21Y2115/10 ,  H05K1/141 ,  H05K1/142 ,  H05K1/147 ,  H05K1/148 ,  H05K3/3442 ,  H05K3/363 ,  H05K2201/046 ,  H05K2201/09963 ,  H05K2201/10106 ,  Y10T29/41

Abstract: A method for producing a light emitting diode arrangement. A plurality of LED modules (110, 120, 130) are provided, which in each case comprise at least one radiation emitting semiconductor component (1000) on a carrier body (1300). At least one separately fabricated connection carrier (200) is provided. The LED modules are arranged in such a way that they are adjacent to one another in pairs. A mechanically stable and electrically conductive connection between the carrier bodies of two LED modules is produced by means of the connection carrier. Furthermore, a light emitting diode arrangement is disclosed.

Abstract translation: 一种制造发光二极管装置的方法。 提供了多个LED模块（110,120,130），其在每种情况下都包括在载体主体（1300）上的至少一个辐射发射半导体部件（1000）。 提供至少一个单独制造的连接支架（200）。 LED模块以彼此成对相邻的方式布置。 通过连接载体产生两个LED模块的载体之间的机械稳定且导电的连接。 此外，公开了一种发光二极管装置。

公开(公告)号：US08637882B2

公开(公告)日：2014-01-28

申请号：US11904170

申请日：2007-09-26

Applicant: Harald Stoyan

Inventor： Harald Stoyan

IPC: H01L33/00

CPC classification number: H05K1/141 ,  F21S2/005 ,  F21V21/005 ,  F21V23/06 ,  F21Y2115/10 ,  H05K1/142 ,  H05K1/147 ,  H05K1/148 ,  H05K3/3442 ,  H05K3/363 ,  H05K2201/046 ,  H05K2201/09963 ,  H05K2201/10106

Abstract: A method for producing a light emitting diode arrangement. A plurality of LED modules (110, 120, 130) are provided, which in each case comprise at least one radiation emitting semiconductor component (1000) on a carrier body (1300). At least one separately fabricated connection carrier (200) is provided. The LED modules are arranged in such a way that they are adjacent to one another in pairs. A mechanically stable and electrically conductive connection between the carrier bodies of two LED modules is produced by means of the connection carrier. Furthermore, a light emitting diode arrangement is disclosed.

Abstract translation: 一种制造发光二极管装置的方法。 提供了多个LED模块（110,120,130），其在每种情况下都包括在载体主体（1300）上的至少一个辐射发射半导体部件（1000）。 提供至少一个单独制造的连接支架（200）。 LED模块以彼此成对相邻的方式布置。 通过连接载体产生两个LED模块的载体之间的机械稳定且导电的连接。 此外，公开了一种发光二极管装置。

公开(公告)号：US08441114B2

公开(公告)日：2013-05-14

申请号：US12733929

申请日：2008-09-03

Applicant: Martin Birner ,  Rainer Kreutzer ,  Hubert Schierling ,  Norbert Seliger

Inventor： Martin Birner ,  Rainer Kreutzer ,  Hubert Schierling ,  Norbert Seliger

IPC: H01L23/22

CPC classification number: H05K1/142 ,  H01L25/072 ,  H01L25/16 ,  H01L2924/0002 ,  H01L2924/30107 ,  H05K1/0306 ,  H05K3/0061 ,  H05K3/32 ,  H05K2201/09963 ,  Y10T29/49117 ,  H01L2924/00

Abstract: To improve manufacture of an electronic circuit, the electronic circuit is composed of modules of sub-circuits arranged on a common substrate, such as a cooling body, and that are electrically interconnected by a planar electrical contact element.

Abstract translation: 为了改善电子电路的制造，电子电路由布置在诸如冷却体的公共基板上的子电路的模块组成，并且通过平面电接触元件电互连。

公开(公告)号：US20100309633A1

公开(公告)日：2010-12-09

申请号：US12733929

申请日：2008-09-03

Applicant: Martin Birner ,  Rainer Kreutzer ,  Hubert Schierling ,  Norbert Seliger

Inventor： Martin Birner ,  Rainer Kreutzer ,  Hubert Schierling ,  Norbert Seliger

IPC: H05K7/20 ,  H01R43/00

CPC classification number: H05K1/142 ,  H01L25/072 ,  H01L25/16 ,  H01L2924/0002 ,  H01L2924/30107 ,  H05K1/0306 ,  H05K3/0061 ,  H05K3/32 ,  H05K2201/09963 ,  Y10T29/49117 ,  H01L2924/00

Abstract: To improve manufacture of an electronic circuit, the electronic circuit is composed of modules of sub-circuits arranged on a common substrate, such as a cooling body, and that are electrically interconnected by a planar electrical contact element.

Abstract translation: 为了改善电子电路的制造，电子电路由布置在诸如冷却体的公共基板上的子电路的模块组成，并且通过平面电接触元件电互连。