公开(公告)号：US08344270B2

公开(公告)日：2013-01-01

申请号：US12466976

申请日：2009-05-15

Applicant: Klaus Backhaus

Inventor： Klaus Backhaus

IPC: H05K1/00

CPC classification number: H05K5/006 ,  H05K1/0271 ,  H05K1/18 ,  H05K1/189 ,  H05K7/142 ,  H05K2201/09063 ,  H05K2201/10015 ,  H05K2201/1003 ,  H05K2201/10166 ,  H05K2201/105

Abstract: A combination of a main carrier and a printed circuit board. Light and heavy electrical and/or electronic components are fixed on the printed circuit board, wherein at least one heavy component is mechanically fixedly connected to the main carrier and electrically conductively connected to conductor tracks of a first section of the printed circuit board. The first section of the printed circuit board is electrically conductively connected to a second section of the printed circuit board and decoupled from the second section of the printed circuit board with regard to mechanical vibrations by means of a decoupling device. The decoupling device may be, for example, a flexible section or a recess formed in said printed circuit board.

Abstract translation: 主载体和印刷电路板的组合。 轻和重的电气和/或电子部件被固定在印刷电路板上，其中至少一个重的部件机械地固定地连接到主载体上并与导电连接到印刷电路板的第一部分的导体轨道。 印刷电路板的第一部分导电地连接到印刷电路板的第二部分，并且借助于去耦装置与印刷电路板的第二部分相关的机械振动解耦。 去耦装置可以是例如在所述印刷电路板中形成的柔性部分或凹部。

公开(公告)号：US08183473B2

公开(公告)日：2012-05-22

申请号：US12591408

申请日：2009-11-18

Applicant: Gyu Man Hwang ,  Dae Hyeong Lee ,  Bong Gyun Kim

Inventor： Gyu Man Hwang ,  Dae Hyeong Lee ,  Bong Gyun Kim

IPC: H05K7/02

CPC classification number: H05K5/0026 ,  H01L2224/48091 ,  H05K1/0306 ,  H05K1/141 ,  H05K3/0061 ,  H05K2201/105 ,  H05K2203/049 ,  H01L2924/00014

Abstract: Disclosed is a power package for an electrical device of an Electronic Control Unit (ECU) in an Electric Power Steering (EPS) system, the power package including: a housing which is formed with an upper part and a lower part and is formed to be in a two-step structure where substrate layers are provided on each of the upper and lower parts; a Printed Circuit Board (PCB) layer which is provided on the lower part of the housing and has a path line formed thereon to flow a current; and an LTCC layer which is provided on the upper part of the housing, is connected to the PCB layer through wire-bonding, and is formed of a Low Temperature Co-fired Ceramics. The power package for an electrical device can expand areas of the PCB and LTCC layers, thereby enhancing freedom degree of design of the PCB and LTCC layers and reducing a size of the entire case.

Abstract translation: 公开了一种用于电动转向（EPS）系统中的电子控制单元（ECU）的电气设备的电力包，该电力包装包括：壳体，其形成有上部和下部，并形成为 在两个阶段的结构中，其中衬底层设置在每个上部和下部上; 印刷电路板（PCB）层，其设置在壳体的下部并且具有形成在其上的路线以流动电流; 并且设置在壳体的上部的LTCC层通过引线接合连接到PCB层，并且由低温共烧陶瓷形成。 用于电气设备的功率封装可以扩展PCB和LTCC层的面积，从而提高PCB和LTCC层的自由度设计，并减小整个外壳的尺寸。

公开(公告)号：US08168899B2

公开(公告)日：2012-05-01

申请号：US12550824

申请日：2009-08-31

Applicant: Toshiaki Imai ,  Koji Suzuki

Inventor： Toshiaki Imai ,  Koji Suzuki

IPC: H01H27/06

CPC classification number: H05K3/306 ,  F02N11/0803 ,  H05K3/3447 ,  H05K2201/1003 ,  H05K2201/10189 ,  H05K2201/105

Abstract: A coil bobbin to which an immobilizer coil is mounted, coil connecting terminals to which ends of the coil are connected, a fixed contact, a terminal for the fixed contact and connector terminals are integrally formed by resin molding into a coil bobbin integrated type insulator. Then, the coil connecting terminals, the terminal for the fixed contact, and the connector terminals are respectively soldered to a wiring board. All of them are incorporated in a body. In this manner, stress exerted on the soldered areas between the coil connecting terminals and the wiring board can be moderated to the substantially same extent as stress exerted on the soldered areas between the terminal for the fixed contact and the connector terminals, and the wiring board.

Abstract translation: 安装有防盗线圈的线圈架，连接有线圈的线圈连接端子，固定触点，固定触点用端子和连接器端子通过树脂模制一体地形成为线圈架一体型绝缘体。 然后，将线圈连接端子，固定接点端子和连接器端子分别焊接到布线板。 所有这些都被并入身体。 以这种方式，施加在线圈连接端子和布线板之间的焊接区域上的应力可以被调节到与施加在用于固定触点的端子与连接器端子之间的焊接区域上的应力的大致相同的程度，并且布线板 。

公开(公告)号：US20090059541A1

公开(公告)日：2009-03-05

申请号：US11897316

申请日：2007-08-30

Applicant: Lee R. Hinze

Inventor： Lee R. Hinze

IPC: H05K1/18

CPC classification number: H05K5/064 ,  H05K1/18 ,  H05K3/284 ,  H05K3/308 ,  H05K5/0247 ,  H05K2201/09754 ,  H05K2201/0999 ,  H05K2201/10015 ,  H05K2201/10295 ,  H05K2201/105 ,  H05K2201/1059 ,  H05K2201/10962

Abstract: An electronic assembly includes a printed circuit board and an electrical component arranged within a housing. The component is mounted in a lower region of the housing, and the printed circuit board is supported over the component. The housing is formed of a electrically insulating material and includes embedded conductors connecting the component to the printed circuit board. Potting material is disposed on the printed circuit board within the housing. A fill hole may be provided in the board over the component to allow the potting material to flow onto the electrical component for mechanical stabilization.

Abstract translation: 电子组件包括布置在壳体内的印刷电路板和电气部件。 该部件安装在壳体的下部区域中，印刷电路板被支撑在部件上。 壳体由电绝缘材料形成，并且包括将部件连接到印刷电路板的嵌入导体。 灌封材料设置在外壳内的印刷电路板上。 填充孔可以设置在板上的部件上，以允许灌封材料流到电气部件上用于机械稳定。

公开(公告)号：US20080157680A1

公开(公告)日：2008-07-03

申请号：US11755074

申请日：2007-05-30

Applicant: Tsutomu Tominaga ,  Masahiro Kimata ,  Takayuki Kifuku ,  Shuzo Akiyama ,  Tadayuki Fujimoto

Inventor： Tsutomu Tominaga ,  Masahiro Kimata ,  Takayuki Kifuku ,  Shuzo Akiyama ,  Tadayuki Fujimoto

IPC: H01J7/24

CPC classification number: H05K7/20509 ,  H05K3/308 ,  H05K3/32 ,  H05K3/328 ,  H05K7/20854 ,  H05K2201/10166 ,  H05K2201/10295 ,  H05K2201/105 ,  H05K2201/1059 ,  H05K2201/10962

Abstract: An electronic control apparatus can be reduced in size and cost, and also improved in the reliability of electrical connection by eliminating certain parts such as a power board, etc. The apparatus includes a housing, a heat sink arranged in the housing, semiconductor switching elements mounted on the heat sink and having terminals, a circuit board arranged in opposition to the heat sink and having an electronic circuit formed thereon including a control circuit for controlling the semiconductor switching elements, and a plurality of conductive plates electrically connecting the circuit board and the semiconductor switching elements to each other. The individual conductive plates are arranged along a lead-out direction in which the individual terminals of the semiconductor switching elements lead out, so that they are bonded to the individual terminals.

Abstract translation: 电子控制装置的尺寸和成本可以减小，并且通过消除诸如电源板等的某些部件来提高电连接的可靠性。该装置包括壳体，布置在壳体中的散热器，半导体开关元件 安装在散热器上并具有端子，电路板布置成与散热器相对并且具有形成在其上的电子电路，包括用于控制半导体开关元件的控制电路，以及多个导电板，电连接电路板和 半导体开关元件彼此。 各个导电板沿着半导体开关元件的各个端子引出的引出方向布置，从而它们被结合到各个端子。

公开(公告)号：US4674161A

公开(公告)日：1987-06-23

申请号：US719467

申请日：1985-04-03

Applicant: Egon Edinger ,  Friedrich Pedall

Inventor： Egon Edinger ,  Friedrich Pedall

IPC: H04R1/06 ,  H04R1/04 ,  H04R17/00 ,  H04R31/00 ,  H05K3/34 ,  H01L41/22

CPC classification number: H04R1/04 ,  H04R17/00 ,  H05K3/3405 ,  H05K2201/10083 ,  H05K2201/10446 ,  H05K2201/105 ,  Y10T29/42 ,  Y10T29/49005

Abstract: A piezo-electric acoustic transducer has two strip-shaped terminal leads for connection of an acoustic-electric transducer plate to an amplifier assembly of the microphone. Previously the two leads were manually soldered to Griplet soldering rivets on the component side of the circuit boards with the addition of soldering tin, and were insulated from the housing by means of an insulating ring. In the present invention, the terminal strips are directly soldered to the connector paths of a flat amplifier assembly and are electrically insulated from the housing by means of a tab. With this type of automated soldering and insulation, a work piece carrier is provided with a plurality of devices for the mounting of the flat assembly on the carrier plate.

Abstract translation: 压电声换能器具有两个带状端子引线，用于将声电换能器板连接到麦克风的放大器组件。 以前，两个引线手动焊接到电路板的元件侧的Griplet焊接铆钉上，加上焊锡，并通过绝缘环与外壳绝缘。 在本发明中，端子条被直接焊接到扁平放大器组件的连接器路径上，并通过突片与壳体电绝缘。 使用这种类型的自动焊接和绝缘，工件托架设置有用于将平板组件安装在承载板上的多个装置。

公开(公告)号：WO2019002007A1

公开(公告)日：2019-01-03

申请号：PCT/EP2018/066166

申请日：2018-06-19

Applicant: SIEMENS AKTIENGESELLSCHAFT

Inventor： BLANK, Rene ,  FRANKE, Martin ,  FRÜHAUF, Peter ,  NERRETER, Stefan ,  KNOFE, Rüdiger ,  MÜLLER, Bernd ,  STROGIES, Jörg ,  WILKE, Klaus

IPC: H05K1/02 ,  H05K3/46 ,  H05K1/14 ,  H05K1/03

CPC classification number: H05K3/4688 ,  H01L23/3677 ,  H01L2224/33 ,  H05K1/0201 ,  H05K1/0206 ,  H05K1/0271 ,  H05K1/0373 ,  H05K1/145 ,  H05K3/4602 ,  H05K3/4676 ,  H05K2201/0116 ,  H05K2201/0187 ,  H05K2201/062 ,  H05K2201/066 ,  H05K2201/068 ,  H05K2201/105 ,  H05K2201/1056 ,  H05K2201/2036 ,  H05K2203/1194

Abstract: Die Erfindung betrifft eine elektrische Baugruppe (1) und ein Verfahren zu deren Herstellung. Die elektrische Baugruppe (1) weist dabei wenigstens ein erstes Bauteil (6) auf, welches wenigstens teilweise aus einem geschäumten Werkstoff gebildet ist. Bei dem Verfahren zum Herstellen der elektrischen Baugruppe (1) wird wenigstens ein Teilbereich (9, 10) des ersten Bauteils (6) in seinen thermomechanischen Eigenschaften modifiziert durch Schäumen des wenigstens einen Teilbereiches (9, 10) und/oder durch Einbringen von Gasblasen in den wenigstens einen Teilbereich (9, 10).

公开(公告)号：WO2008049504A3

公开(公告)日：2008-09-25

申请号：PCT/EP2007008563

申请日：2007-10-02

Applicant: BROSE FAHRZEUGTEILE ,  EBERLEIN ANDRE ,  ROSENTHAL KARL-HEINZ

Inventor： EBERLEIN ANDRE ,  ROSENTHAL KARL-HEINZ

IPC: H05K1/18 ,  B60R16/023 ,  H05K3/32 ,  H05K5/02 ,  H05K7/02 ,  H05K7/06 ,  H05K7/12 ,  H05K7/14

CPC classification number: B60R16/0239 ,  H01R4/2416 ,  H01R12/58 ,  H05K3/308 ,  H05K3/325 ,  H05K7/026 ,  H05K2201/10295 ,  H05K2201/105 ,  H05K2201/1059 ,  H05K2201/10651 ,  H05K2201/10962

Abstract: The invention relates to a module (1) comprising a housing (2), a printed circuit board (3) and a separate electronic component (4) which has a number of electric connections (5), characterized in that the or each connection (5) of the component (4) is electrically connected to a conductor track of the printed circuit board (3) by means of a blade contact (25), the component (4) being fixed in the housing (2) by means of a number of elastic bearing elements (18). The component (4) is thus easily and securely fixed. Rattling noises are avoided.

Abstract translation: 它是（1），包括壳体（2）的组件，与电路板（3）中并用（4），其具有多个电端子（5）的一个单独的电子部件，其中，所述或每个终端（5）的分量的 （4）被电通过切割触点（25）与印刷电路板（3）的导体轨道的方式连接，并且其中经由多个在所述壳体（2）弹性支承元件（18）的装置（4）是固定的。 这里的组分（4）是容易和安全的固定。 避免嘎嘎声。

公开(公告)号：WO2008043585A1

公开(公告)日：2008-04-17

申请号：PCT/EP2007/057475

申请日：2007-07-19

Applicant: SIEMENS VDO AUTOMOTIVE AG ,  CHRISTOPH, Markus ,  MENKE, Oliver ,  MEYER, Christian ,  PLANKL, Christian ,  PROBST, Heinrich

Inventor： CHRISTOPH, Markus ,  MENKE, Oliver ,  MEYER, Christian ,  PLANKL, Christian ,  PROBST, Heinrich

IPC: G01P1/02 ,  G01P15/08 ,  H05K5/00 ,  B60R21/013 ,  G01D11/24

CPC classification number: G01P1/023 ,  B60R21/013 ,  G01D11/245 ,  H05K1/141 ,  H05K3/3447 ,  H05K5/006 ,  H05K2201/10151 ,  H05K2201/105

Abstract: Die Erfindung beschreibt ein elektronisches Modul (1), welches folgende Merkmale umfasst: zumindest einen Sensor (23) zur Erfassung einer physikalischen Größe, insbesondere einer Beschleunigung und/oder Verzögerung; eine elektronische Schaltung mit zumindest einem Bauelement (27) zur Verarbeitung analoger und/oder digitaler Signale, wobei die Schaltung mit dem zumindest einen Sensor (23) elektrisch verbunden ist; eine Leiterplatte (21), auf der die elektronische Schaltung zumindest teilweise angeordnet ist; sowie eine Sensorleiterplatte (22), auf welcher der zumindest eine Sensor (23) angeordnet ist. Die Sensorleiterplatte (22) und die Leiterplatte (21) sind in einem gemeinsamen Gehäuse (10) aufgenommen, wobei die Sensorleiterplatte (22) mechanisch entkoppelt von der Leiterplatte (21) in dem Gehäuse (10) gehaltert ist.

Abstract translation: 本发明描述了一种电子模块（1），包括：用于检测一个物理变量的至少一个传感器（23），尤其是加速和/或减速; 与至少一个装置（27），用于处理模拟和/或数字信号的电子电路，其包括至少一个传感器（23）中的电路电连接; 一电路板（21），在其上的电子电路被设置成至少部分; 和传感器电路板（22），其上设置的至少一个传感器（23）。 所述传感器PCB（22）和所述电路板（21）被容纳在一个共同的壳体（10），其中所述传感器电路板（22）被机械地从在壳体中的电路板（21）去耦合（10）被支撑。

公开(公告)号：EP2218376B1

公开(公告)日：2017-02-15

申请号：EP10163051.5

申请日：2008-10-01

Applicant: Nestec S.A.

Inventor： Etter, Stefan ,  Gaudenz, Urs ,  Gavillet, Gilles ,  Hodel, Thomas ,  Kollep, Alexandre ,  Möri, Peter ,  Moser, Renzo ,  Preisig, Peter ,  Schwab, Robin

IPC: A47J31/36

CPC classification number: A47J31/441 ,  A47J31/407 ,  A47J31/542 ,  A47J31/545 ,  F24H1/101 ,  F24H9/2028 ,  H01H37/52 ,  H05K1/18 ,  H05K3/306 ,  H05K2201/10151 ,  H05K2201/10166 ,  H05K2201/10181 ,  H05K2201/10189 ,  H05K2201/10424 ,  H05K2201/105 ,  H05K2201/2036