公开(公告)号：WO2009143550A1

公开(公告)日：2009-12-03

申请号：PCT/AT2009/000224

申请日：2009-05-29

Applicant: AT & S AUSTRIA TECHNOLOGIE & SYSTEMTECHNIK AKTIENGESELLSCHAFT ,  WEICHSLBERGER, Günther ,  KRIECHBAUM, Arno ,  MORIANZ, Mike ,  HASLEBNER, Nikolai ,  STAHR, Johannes ,  HARING, Fritz ,  FREYDL, Gerhard ,  KOERTVELYESSY, Andrea ,  BEESLEY, Mark ,  ZLUC, Andreas ,  SCHRITTWIESER, Wolfgang

Inventor： WEICHSLBERGER, Günther ,  KRIECHBAUM, Arno ,  MORIANZ, Mike ,  HASLEBNER, Nikolai ,  STAHR, Johannes ,  HARING, Fritz ,  FREYDL, Gerhard ,  KOERTVELYESSY, Andrea ,  BEESLEY, Mark ,  ZLUC, Andreas ,  SCHRITTWIESER, Wolfgang

IPC: H05K1/18

CPC classification number: H05K1/183 ,  H01L23/5389 ,  H01L24/24 ,  H01L24/25 ,  H01L24/82 ,  H01L2224/24137 ,  H01L2224/2518 ,  H01L2224/32225 ,  H01L2224/73267 ,  H01L2224/92244 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/15174 ,  H01L2924/351 ,  H05K1/0206 ,  H05K1/185 ,  H05K3/305 ,  H05K3/4652 ,  H05K2201/0355 ,  H05K2201/09845 ,  H05K2201/10507 ,  H05K2201/10674 ,  Y10T29/4913 ,  Y10T29/49146 ,  Y10T29/49155 ,  H01L2924/00

Abstract: Bei einem Verfahren zur Integration wenigstens eines elektronischen Bauteils in eine Leiterplatte, sind die folgenden Schritte vorgesehen: Bereitstellen einer Schicht (4) einer Leiterplatte zur Abstützung des elektronischen Bauteils (1, 2, 3), Aufbringen eines Klebers (5) auf eine Oberfläche der Schicht (4), Festlegen des elektronischen Bauteils (1, 2, 3) auf der Schicht (4) mittels des Klebers (5), Aufbringen bzw. Anordnen wenigstens einer elektrisch leitenden Schicht (8) auf bzw. an dem Bauteil (1, 2, 3) an der vom Kleber (5) abgewandten Seite bzw. Oberfläche, und Strukturieren der elektrisch leitenden Schicht (8) entsprechend den Kontakten (7) des elektronischen Bauteils (1, 2, 3) und/oder entsprechend auf der Leiterplatte auszubildenden Leiterbahnen. Darüber hinaus wird eine entsprechend diesem Verfahren hergestellte Leiterplatte zur Verfügung gestellt.

Abstract translation: 在印刷电路板集成的至少一个电子部件的方法中，提供以下步骤：用于支撑所述电子部件提供的电路板的一个层（4）（1，2，3），施加粘合剂（5）的一个表面上 层（4），固定所述电子元件（1，2，3）（所述层（4）通过粘接剂（5）的装置，沉积或上或在元件放置在至少一个导电层（8）1上， 第2页，3）背向（从粘合剂5）或表面，和（8）对应于（触点（7所述导电层图案化）电子部件1，2,3）和/或相应地形成在印刷电路板 互连。 此外，电路板提供根据此方法制造的。

公开(公告)号：WO2007106636A2

公开(公告)日：2007-09-20

申请号：PCT/US2007/062197

申请日：2007-02-15

Applicant: FREESCALE SEMICONDUCTOR INC. ,  LYTLE, William, H. ,  HAYES, Scott, M. ,  LEAL, George, R.

Inventor： LYTLE, William, H. ,  HAYES, Scott, M. ,  LEAL, George, R.

IPC: H01L23/02

CPC classification number: H05K1/0271 ,  H01L21/561 ,  H01L21/568 ,  H01L21/6835 ,  H01L23/5389 ,  H01L23/544 ,  H01L24/19 ,  H01L24/24 ,  H01L24/82 ,  H01L24/96 ,  H01L2223/5442 ,  H01L2223/5446 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/24137 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/18162 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/3511 ,  H05K1/0306 ,  H05K1/111 ,  H05K1/115 ,  H05K2201/10507

Abstract: Methods and apparatus are provided for an electronic panel assembly (EPA) (82, 83), comprising: providing one or more electronic devices (30) with primary faces (31) having electrical contacts (36), opposed rear faces (33) and edges (32) therebetween. The devices (30) are mounted primary faces (31) down on a temporary support (60) in openings (44) in a warp control sheet (WCS) (40) attached to the support (60). Plastic encapsulation (50) is formed at least between lateral edges (32, 43) of the devices (30) and WCS openings (44). Undesirable panel warping (76) during encapsulation is mitigated by choosing the WCS coefficient of thermal expansion (CTE) to be less than the encapsulation CTE. After encapsulation cure, the EPA (82) containing the devices (30) and the WCS (40) is separated from the temporary support (60) and, optionally, mounted on another carrier (70) with electrical contacts (36) exposed. Thin film insulators (85) and conductors (87) are desirably applied to couple electrical contacts (36) on various devices (30) to each other and to external terminals (88), thereby forming an integrated multi-device EPA (84).

Abstract translation: 提供了一种用于电子面板组件（EPA）（82,83）的方法和装置，包括：为一个或多个电子设备（30）提供具有电触头（36），相对的后表面（33）和 其间的边缘（32）。 装置（30）在连接到支撑件（60）的经线控制片（WCS）（40））的开口（44）中的主要面（31）向下安装在临时支撑件（60）上。 至少在装置（30）的横向边缘（32,43）和WCS开口（44）之间形成塑料封装（50）。 通过选择WCS热膨胀系数（CTE）小于封装CTE来减轻封装期间的不希望的面板翘曲（76）。 在封装固化之后，含有装置（30）和WCS（40）的EPA（82）与临时支撑件（60）分离，并且可选地安装在具有暴露的电触点（36）的另一个载体（70）上。 期望施加薄膜绝缘体（85）和导体（87）以将各种装置（30）上的电触点（36）彼此耦合到外部端子（88），从而形成集成的多装置EPA（84）。

公开(公告)号：EP2719267B1

公开(公告)日：2016-05-18

申请号：EP12796666.1

申请日：2012-06-07

Applicant: Moncrieff, Scott

Inventor： Moncrieff, Scott

IPC: H05K7/02

CPC classification number: H05K5/0017 ,  B29C45/14467 ,  B29C45/14639 ,  B29C45/14688 ,  B29C2045/14532 ,  D06F39/005 ,  G02B6/0001 ,  H05K1/0298 ,  H05K1/16 ,  H05K1/18 ,  H05K1/181 ,  H05K1/189 ,  H05K3/0014 ,  H05K3/12 ,  H05K3/284 ,  H05K3/30 ,  H05K5/0243 ,  H05K2201/09818 ,  H05K2201/10507 ,  Y10T29/49004

公开(公告)号：EP2894714A4

公开(公告)日：2016-04-20

申请号：EP13833774

申请日：2013-06-20

Applicant: DENSO CORP ,  NIPPON SOKEN

Inventor： YUKIZAKI YASUMUNE ,  SUZUKI TADAO ,  KATAOKA RYOHEI ,  SUGIMOTO YUJI

IPC: H01Q1/32 ,  H01Q1/02 ,  H01Q1/22

CPC classification number: H01Q1/3275 ,  H01Q1/02 ,  H01Q1/241 ,  H01Q1/42 ,  H01Q9/42 ,  H05K1/181 ,  H05K5/003 ,  H05K2201/10098 ,  H05K2201/10507

Abstract: A vehicle-mounted antenna device (20) includes a base (22), a board (24), a circuit section (30), and a housing (32). The base is mountable on a roof (11) of a vehicle (10). The board has an antenna element section (26) and is stood on a surface (22a) of the base. The circuit section serves as at least part of a wireless communication circuit electrically connected to the antenna element section. The housing is made of a resin material and forms a projection of a vehicle outer shape. The board and the circuit section are located in space formed by the base and the housing. The board is stood on the surface of the base so that a first direction perpendicular to the surface of the base differs from a second direction equal to a thickness direction of the board. The circuit section is implemented on the board at a position away from the base in the first direction.

公开(公告)号：EP2719267A4

公开(公告)日：2015-03-18

申请号：EP12796666

申请日：2012-06-07

Applicant: MONCRIEFF SCOTT

Inventor： MONCRIEFF SCOTT

IPC: H05K7/02

CPC classification number: H05K5/0017 ,  B29C45/14467 ,  B29C45/14639 ,  B29C45/14688 ,  B29C2045/14532 ,  D06F39/005 ,  G02B6/0001 ,  H05K1/0298 ,  H05K1/16 ,  H05K1/18 ,  H05K1/181 ,  H05K1/189 ,  H05K3/0014 ,  H05K3/12 ,  H05K3/284 ,  H05K3/30 ,  H05K5/0243 ,  H05K2201/09818 ,  H05K2201/10507 ,  Y10T29/49004

公开(公告)号：EP2286644A1

公开(公告)日：2011-02-23

申请号：EP09753314.5

申请日：2009-05-29

Applicant: AT & S Austria Technologie & Systemtechnik Aktiengesellschaft

Inventor： WEICHSLBERGER, Günther ,  KRIECHBAUM, Arno ,  MORIANZ, Mike ,  HASLEBNER, Nikolai ,  STAHR, Johannes ,  HARING, Fritz ,  FREYDL, Gerhard ,  KOERTVELYESSY, Andrea ,  BEESLEY, Mark ,  ZLUC, Andreas ,  SCHRITTWIESER, Wolfgang

IPC: H05K1/18

CPC classification number: H05K1/183 ,  H01L23/5389 ,  H01L24/24 ,  H01L24/25 ,  H01L24/82 ,  H01L2224/24137 ,  H01L2224/2518 ,  H01L2224/32225 ,  H01L2224/73267 ,  H01L2224/92244 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/15174 ,  H01L2924/351 ,  H05K1/0206 ,  H05K1/185 ,  H05K3/305 ,  H05K3/4652 ,  H05K2201/0355 ,  H05K2201/09845 ,  H05K2201/10507 ,  H05K2201/10674 ,  Y10T29/4913 ,  Y10T29/49146 ,  Y10T29/49155 ,  H01L2924/00

Abstract: In a method for integrating at least one electronic component into a printed circuit board, the following steps are provided: providing a layer (4) of a printed circuit board for supporting the electronic component (1, 2, 3), applying an adhesive (5) to a surface of the layer (4), fixing the electronic component (1, 2, 3) on the layer (4) by means of the adhesive (5), applying or arranging at least one electrically conductive layer (8) on or at the component (1, 2, 3) at the side or surface remote from the adhesive (5), and patterning the electrically conductive layer (8) in accordance with the contacts (7) of the electronic component (1, 2, 3) and/or in accordance with conductor tracts to be formed on the printed circuit board. A printed circuit board produced in accordance with this method is furthermore provided.

公开(公告)号：EP2820929A4

公开(公告)日：2015-09-30

申请号：EP12869733

申请日：2012-03-01

Applicant: AUTOLIV DEV

Inventor： CACLARD LAURENT

IPC: H05K9/00 ,  H05K1/02 ,  H05K5/00

CPC classification number: H05K9/0039 ,  H05K1/0215 ,  H05K1/0218 ,  H05K5/0047 ,  H05K7/1427 ,  H05K2201/0723 ,  H05K2201/0919 ,  H05K2201/10015 ,  H05K2201/1003 ,  H05K2201/10371 ,  H05K2201/10507

Abstract: An electronic unit (1) having a circuit board, PCB, (2) arranged to be mounted in a main housing (6, 7 and having a first housing part (6) and a second housing part (7), where the first housing part (6) is at least partly electrically conducting. The PCB (2) having a first outer layer (3), a second outer layer (4), and a ground plane (5). The first outer layer (3) faces the first housing part (6) and the second outer layer (4) faces the second housing part (7) The ground plane (5) is in electrical contact with the first housing part (6) forming a first chamber (29), facing the first outer layer (3), and a second chamber (30), facing the second outer layer (4). The chambers (29, 30) are separated by the ground plane (5), providing electromagnetic shielding between the chambers (29, 30).

公开(公告)号：EP2894714A1

公开(公告)日：2015-07-15

申请号：EP13833774.6

申请日：2013-06-20

Applicant: Denso Corporation ,  Nippon Soken, Inc.

Inventor： YUKIZAKI, Yasumune ,  SUZUKI, Tadao ,  KATAOKA, Ryohei ,  SUGIMOTO, Yuji

IPC: H01Q1/32 ,  H01Q1/22

CPC classification number: H01Q1/3275 ,  H01Q1/02 ,  H01Q1/241 ,  H01Q1/42 ,  H01Q9/42 ,  H05K1/181 ,  H05K5/003 ,  H05K2201/10098 ,  H05K2201/10507

Abstract: A vehicle-mounted antenna device (20) includes a base (22), a board (24), a circuit section (30), and a housing (32). The base is mountable on a roof (11) of a vehicle (10). The board has an antenna element section (26) and is stood on a surface (22a) of the base. The circuit section serves as at least part of a wireless communication circuit electrically connected to the antenna element section. The housing is made of a resin material and forms a projection of a vehicle outer shape. The board and the circuit section are located in space formed by the base and the housing. The board is stood on the surface of the base so that a first direction perpendicular to the surface of the base differs from a second direction equal to a thickness direction of the board. The circuit section is implemented on the board at a position away from the base in the first direction.

Abstract translation: 车载天线装置（20）包括基座（22），电路板（24），电路部分（30）和壳体（32）。 基座可安装在车辆（10）的屋顶（11）上。 板具有天线元件部分（26）并且站在基座的表面（22a）上。 电路部分用作电连接到天线元件部分的无线通信电路的至少一部分。 壳体由树脂材料制成并形成车辆外形的突起。 板和电路部分位于由基座和壳体形成的空间中。 板位于基座的表面上，使得垂直于基座表面的第一方向与等于板的厚度方向的第二方向不同。 电路部分在板上在第一方向远离基座的位置上实现。

公开(公告)号：EP2719267A2

公开(公告)日：2014-04-16

申请号：EP12796666.1

申请日：2012-06-07

Applicant: Moncrieff, Scott

Inventor： Moncrieff, Scott

IPC: H05K7/02

CPC classification number: H05K5/0017 ,  B29C45/14467 ,  B29C45/14639 ,  B29C45/14688 ,  B29C2045/14532 ,  D06F39/005 ,  G02B6/0001 ,  H05K1/0298 ,  H05K1/16 ,  H05K1/18 ,  H05K1/181 ,  H05K1/189 ,  H05K3/0014 ,  H05K3/12 ,  H05K3/284 ,  H05K3/30 ,  H05K5/0243 ,  H05K2201/09818 ,  H05K2201/10507 ,  Y10T29/49004

Abstract: Provided are systems and methods for a control assembly including: a first film that is in-molded that includes decorative graphics, a front surface and a rear surface; and a second film molded to the rear surface of the first film having a printed circuit that includes sensors, control circuits and interconnects and a front and rear surface; and an internal connector.

Abstract translation: 提供了用于控制组件，其包括系统和方法：第一电影并在模制做包括装饰图形，前表面和后表面; 和第二薄膜成型，具有印刷电路做了包括传感器和控制电路，互连和一个前部和后部表面的第一部电影的后表面; 和内部连接器。

公开(公告)号：EP2286644B1

公开(公告)日：2012-09-26

申请号：EP09753314.5

申请日：2009-05-29

Applicant: AT & S Austria Technologie & Systemtechnik Aktiengesellschaft

Inventor： WEICHSLBERGER, Günther ,  KRIECHBAUM, Arno ,  MORIANZ, Mike ,  HASLEBNER, Nikolai ,  STAHR, Johannes ,  HARING, Fritz ,  FREYDL, Gerhard ,  KOERTVELYESSY, Andrea ,  BEESLEY, Mark ,  ZLUC, Andreas ,  SCHRITTWIESER, Wolfgang

IPC: H05K1/18 ,  H01L23/538

CPC classification number: H05K1/183 ,  H01L23/5389 ,  H01L24/24 ,  H01L24/25 ,  H01L24/82 ,  H01L2224/24137 ,  H01L2224/2518 ,  H01L2224/32225 ,  H01L2224/73267 ,  H01L2224/92244 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/15174 ,  H01L2924/351 ,  H05K1/0206 ,  H05K1/185 ,  H05K3/305 ,  H05K3/4652 ,  H05K2201/0355 ,  H05K2201/09845 ,  H05K2201/10507 ,  H05K2201/10674 ,  Y10T29/4913 ,  Y10T29/49146 ,  Y10T29/49155 ,  H01L2924/00