Abstract:
A material film forming method is provided which comprises coating a liquid material on a surface of a substrate to form a material film of the liquid material the on the surface of the substrate, while rotating the substrate, and drying the material film, while rotating the substrate and letting air or nitrogen gas blow onto a predetermined area of the material film.
Abstract:
A dye-based, thermal ink jet printer ink is formulated by combining a water miscible organic solvent, water, and a dye, and blending the water miscible organic solvent, the water, and the dye together. The ink has the ability to form printed images on a variety of textile media and can be used to achieve acceptable results on both coated silk and coated cotton substrates. Also included is a method of making the ink jet ink and a method of applying the ink to a recording medium.
Abstract:
According to one aspect of the invention, a method of processing a wafer is provided. The wafer is located in a wafer processing chamber of a system for processing a wafer. A silicon layer is then formed on the wafer while the wafer is located in the wafer processing chamber. The wafer is then transferred from the wafer processing chamber to a loadlock chamber of the system. Communication between the processing chamber and the loadlock chamber is closed off. The wafer is then exposed to ozone gas while located in the loadlock chamber, whereafter the wafer is removed from the loadlock chamber out of the system.
Abstract:
Single wafer processing methods and systems for manufacturing films having low-k properties and low indices of refraction. The methods incorporate a processing station in which both curing and post-cure, in situ gas cooling take place.
Abstract:
A turbomachine component includes a silicon nitride substrate and a multi-layer coating bonded to the substrate. The coating includes an interlayer of porous fibrous silicon nitride having a density of between 85-98%. The coating also includes an outer layer formed of an oxide compound, preferably tantalum oxide, that is applied by Electron Beam-Physical Vapor Deposition. The combination of the silicon nitride interlayer and tantalum oxide outer layer serves to protect the substrate from the adverse affects of oxidation, impact by foreign objects and extreme operating temperatures.
Abstract:
A process capable of forming a silicon film on a substrate efficiently, for example, at a high yield and a high forming rate with simple operation and device unlike CVD and plasma CVD. A process for forming a silicon film on a substrate by thermally decomposing at least one silicon compound selected from the group consisting of cyclopentasilane and silylcyclopentasilane in the presence of an inert organic medium vapor under atmospheric pressure.
Abstract:
The bleeding of lignosulfonates from lignosulfonate-treated substrates when contacted under humid conditions is reduced by rendering the lignosulfonates water-insoluble via reacting them with an amine polymer-epichlorohydrin adduct containing at least one quaternary ammonium group under acidic conditions.
Abstract:
A process for plating metal in submicron structures. A seedlayer is deposited on surfaces of submicron structures. The seedlayer is annealed at a temperature of about 80null C. to about 130null C. Metal is plated on the seedlayer.
Abstract:
The present invention relates to a process of using steam to achieve simultaneous impregnation and drying of lignocellulosic material to improve the strength of lignocellulosic material and to reduce the number of serial processing steps. The steam may be either indigenously generated by way of a heated press or heated nip, or the steam may be externally applied.
Abstract:
A thin film of metal or metal compound is produced by preparing an ultrafine particle dispersion liquid by dispersing ultrafine particles at least partly made of metal into a given organic solvent, applying the ultrafine particle dispersion liquid to a substrate, drying the ultrafine particle dispersion liquid to leave metal or metal compound particles on the substrate, heating the metal or metal compound particles to join the metal or metal compound particles, and annealing the metal or metal compound particles into a thin film.