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公开(公告)号：KR101616941B1
公开(公告)日：2016-04-29
申请号：KR1020090083818
申请日：2009-09-07
Applicant: 삼성전자주식회사
Abstract: 체적탄성파공진기를이용한위상천이장치를개시한다. 체적탄성파공진기를이용한위상천이장치는체적탄성파공진기의주파수에대한위상변화특성을이용하고, 하나이상의인덕터, 하나이상의커패시터등을함께이용하여위상천이장치를구성할수 있다.
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公开(公告)号：KR101408116B1
公开(公告)日：2014-06-18
申请号：KR1020080039469
申请日：2008-04-28
Applicant: 삼성전자주식회사 , 고려대학교 산학협력단
CPC classification number: H03H9/462 , B81B2201/0271 , B81C1/00142 , B82Y10/00 , B82Y40/00 , G03F7/0002 , H03H3/0072 , H03H9/2463
Abstract: 공진기 제조 방법이 개시된다. 본 방법에 따르면, 나노 임프린트 기술을 이용하여, 기판 상에서 서로 이격된 복수 개의 전극 패턴을 마련하는 단계 및 복수 개의 전극 패턴들에 연결된 연장 전극 패턴을 형성하고, 연장 전극 패턴들 사이에 걸쳐지는 나노 구조물을 형성하는 단계를 포함한다. 이에 따라, 나노 레벨의 공진 구조물을 가지는 NEMS 공진기를 용이하게 제조할 수 있다.
나노 임프린트, 나노 구조물, 공진기-
公开(公告)号：KR101400238B1
公开(公告)日：2014-05-29
申请号：KR1020080007186
申请日：2008-01-23
Applicant: 삼성전자주식회사 , 고려대학교 산학협력단
IPC: H01L21/336 , H01L29/78 , B82Y40/00
CPC classification number: H01L29/0665 , B81B2201/0271 , B81C1/00142 , B82Y10/00 , H01L29/0673 , H01L29/068 , H01L29/49 , H01L29/78 , Y10S977/936 , Y10S977/937 , Y10S977/938
Abstract: 공진 구조체가 개시된다. 본 공진 구조체는, 제1 단자, 상기 제1 단자와 대향 배치된 제2 단자, 상기 제1 단자 및 상기 제2 단자 사이를 연결하는 와이어부, 상기 와이어부와 일정거리 이격 배치되어, 상기 와이어부를 공진시키는 제3 단자 및, 상기 와이어부 상에 형성되며, 네거티브 저항 성분을 제공하는 포텐셜 배리어부를 포함한다. 이에 따라, 트랜스덕션 효율을 높일 수 있다.
공진 구조체, 와이어부, 포텐셜 베리어-
公开(公告)号：KR1020140052380A
公开(公告)日：2014-05-07
申请号：KR1020120118435
申请日：2012-10-24
Applicant: 삼성전자주식회사 , 고려대학교 산학협력단
IPC: H01P7/00
CPC classification number: H01L29/82 , B81B3/0078 , B81B2201/0271 , B82Y25/00 , G01N29/022 , G01N29/036 , H01L29/0673 , H01L29/42372 , H01L29/78 , Y10S977/762 , Y10S977/938
Abstract: Disclosed are a nanoresonance apparatus and a method for same, including at least one protruding portion on a gate electrode or a nanowire. The nanoresonance apparatus includes at least one gate electrode configured to generate a magnetic field; at least one protruding portion connecting a source electrode to a drain electrode and formed in a direction of the gate electrode; and a nanowire configured to resonate according to the magnetic field.
Abstract translation: 公开了一种纳米谐振装置及其方法，包括在栅电极或纳米线上的至少一个突出部分。 所述纳米谐振装置包括至少一个被配置为产生磁场的栅电极; 至少一个突出部分，其将源电极连接到漏电极并沿栅电极的方向形成; 以及配置成根据磁场共振的纳米线。
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公开(公告)号：KR1020120061466A
公开(公告)日：2012-06-13
申请号：KR1020100122794
申请日：2010-12-03
Applicant: 삼성전자주식회사
Abstract: PURPOSE: A low pass filter using a BAWR(Bulk Acoustic Wave Resonator) is provided to reduce the size of a low-pass filter by using a BAWR of a serial segment having different resonant frequencies. CONSTITUTION: An input terminal(210) is connected to a first RF(Radio Frequency) device. An output terminal(220) is connected to a second RF device. The output terminal transfers a signal filtered by a low-pass filter through a parallel segment(230), a first serial segment(240), and a second serial segment(250) to the second RF device. The parallel segment is parallely connected between the input terminal and the output terminal. The parallel segment includes a first BAWR(231), a third BAWR(233), and a fifth BAWR(235). The first serial segment is serially connected between the input terminal and the output terminal. The second serial segment is serially connected between the input terminal and the output terminal.
Abstract translation: 目的：提供使用BAWR（体声波谐振器）的低通滤波器，通过使用具有不同谐振频率的串行片段的BAWR来减小低通滤波器的尺寸。 构成：输入端子（210）连接到第一RF（射频）装置。 输出端子（220）连接到第二RF装置。 输出端子将由低通滤波器滤波的信号通过并行段（230），第一串行段（240）和第二串行段（250）传送到第二RF设备。 并联段并联连接在输入端和输出端之间。 并行段包括第一BAWR（231），第三BAWR（233）和第五BAWR（235）。 第一串行段串联连接在输入端和输出端之间。 第二串行段串联连接在输入端和输出端之间。
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Patent Agency Ranking
公开(公告)号：KR1020120049665A
公开(公告)日：2012-05-17
申请号：KR1020100111045
申请日：2010-11-09
Applicant: 삼성전자주식회사
CPC classification number: H03H7/38 , H03H9/54 , H03H2007/386
Abstract: PURPOSE: A matching segment circuit for a radio frequency and a radio frequency integrated device using the same are provided to improve the performance of a duplexer by using a duplexer including a matching segment circuit for an RF. CONSTITUTION: A matching segment circuit for an RF(Radio Frequency) comprises an input terminal(110), a parallel segment(120), and a serial segment(130), and an output terminal(140). The input terminal is composed of a single input port. The input terminal is connected to an external first RF device. The parallel segment is composed of a parallel structure of a first inductor(123) and a first capacitor(121). The serial segment is serially connected to the parallel segment. The serial segment is composed of a second inductor(131) and a second capacitor(133). The output terminal is composed of a single output port.
Abstract translation: 目的：提供一种用于射频的匹配段电路和使用其的射频集成装置，以通过使用包括用于RF的匹配段电路的双工器来改善双工器的性能。 构成：用于RF（射频）的匹配段电路包括输入端（110），并联段（120）和串行段（130）以及输出端（140）。 输入端子由单个输入端口组成。 输入端子连接到外部第一RF器件。 并联段由第一电感器（123）和第一电容器（121）的并联结构组成。 串行段串联连接到并行段。 串行段由第二电感器（131）和第二电容器（133）构成。 输出端子由单个输出端口组成。
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公开(公告)号：KR1020120029039A
公开(公告)日：2012-03-26
申请号：KR1020100090835
申请日：2010-09-16
Applicant: 삼성전자주식회사
CPC classification number: G01N29/022 , G01N29/036 , G01N29/30 , G01N2291/0255 , G01N2291/0256 , G01N2291/0426 , G01R23/02 , H03H9/15 , H03B5/08 , H03H9/54 , H03H9/56 , H03H9/70
Abstract: PURPOSE: A bulk acoustic wave resonator sensor is provided to sense a sample having very small mass and volume by forming a micro structure of hundreds of micrometers. CONSTITUTION: A bulk acoustic wave resonator sensor(210) measures one or more changed resonant frequencies while reacting to a sensing target. The bulk acoustic wave resonator sensor measures the changed resonant frequency signal in a reactive state of a coating layer and a sample injected from the outside. A reference volume acoustic resonator(220) measures a fundamental resonant frequency while not reacting to an external environment. The reference volume acoustic resonator measures the fundamental resonant frequency in a state there is only an antigen before inputting an antibody in order to compare the reference volume acoustic resonator with the changed resonant frequency signal through an antigen-antibody reaction. A sensing part(230) senses the sensing target based on one or more changed resonant frequencies and the fundamental resonant frequency.
Abstract translation: 目的：提供一种体声波谐振器传感器，用于通过形成数百微米的微结构来感测质量和体积非常小的样品。 构成：体声波谐振器传感器（210）在与感测对象反应的同时测量一个或多个改变的谐振频率。 体声波谐振器传感器测量涂层的反应状态和从外部注入的样品的改变的谐振频率信号。 参考体积声共振器（220）测量基本共振频率，而不对外部环境做出反应。 参考体积声共振器在输入抗体之前仅存在抗原的状态下测量基本共振频率，以通过抗原 - 抗体反应将参考体积声共振器与改变的共振频率信号进行比较。 感测部分（230）基于一个或多个改变的谐振频率和基本谐振频率来感测感测对象。
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公开(公告)号：KR1020120028780A
公开(公告)日：2012-03-23
申请号：KR1020100090811
申请日：2010-09-15
Applicant: 삼성전자주식회사
IPC: H01L25/065 , H01L23/13 , H01L23/538 , H01L23/66 , H01L25/16 , H01P1/208
CPC classification number: H01L23/66 , H01L23/13 , H01L23/5385 , H01L25/0652 , H01L25/0657 , H01L25/16 , H01L2223/6616 , H01L2224/16225 , H01L2224/48227 , H01L2225/0652 , H01L2225/06548 , H01L2225/06572 , H01L2924/01322 , H01L2924/15311 , H01L2924/3011 , Y10T29/49165 , H01P1/2088 , H01L2924/00
Abstract: PURPOSE: An RF stacked module and an arranging method thereof are provided to minimize interference between a device and a wire by using the RF stacked module through a 3D vertical wire. CONSTITUTION: A first wafer(110) includes a first penetration hole(111,113,115) and a first RF device(117). A second wafer(120) includes a second RF device and a second penetration hole corresponding to the first penetration hole. A vertical wire is connected to the first penetration hole and the second penetration hole. A penetration electrode is connected to an external device through the bottom of the first penetration hole or the top of the second penetration hole.
Abstract translation: 目的：提供RF堆叠模块及其布置方法，以通过使用RF堆叠模块通过3D垂直线来最小化设备和线之间的干扰。 构成：第一晶片（110）包括第一穿透孔（111,113,115）和第一RF器件（117）。 第二晶片（120）包括对应于第一穿透孔的第二RF器件和第二穿透孔。 垂直线连接到第一穿透孔和第二穿透孔。 穿透电极通过第一穿透孔的底部或第二穿透孔的顶部连接到外部装置。
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公开(公告)号：KR1020110032197A
公开(公告)日：2011-03-30
申请号：KR1020090089581
申请日：2009-09-22
Applicant: 삼성전자주식회사
CPC classification number: H01Q1/2208 , H01Q1/243 , H01Q1/38 , H01Q11/083
Abstract: PURPOSE: The portable apparatus offering ultra-wideband. Antenna is arranged to the center of instrument. The size of the portable apparatus is miniaturized. CONSTITUTION: The portable apparatus(100) arranges the camera(110), speaker(120), vibrator(130), controller(140), the memory(145), first, 2 modems(150, 155), first, 2 antennas, the RF module(180), power supply unit(190), battery(195). The first, and 2 antenna comprise the respective slot, and microstrip.
Abstract translation: 目的：提供超宽带的便携式设备。 天线安排在仪器的中心。 便携式设备的尺寸小型化。 构成：便携式设备（100）将照相机（110），扬声器（120），振动器（130），控制器（140），存储器（145），第一，第二调制解调器（150,155） RF模块（180），电源单元（190），电池（195）。 第一和第二天线包括相应的槽和微带。
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公开(公告)号：KR1020100073748A
公开(公告)日：2010-07-01
申请号：KR1020080132502
申请日：2008-12-23
Applicant: 삼성전자주식회사
CPC classification number: H01L23/10 , H01L21/50 , H01L21/76898 , H01L25/50 , H01L27/14601 , H01L2225/06513 , H01L2225/06541 , H01L2924/0002 , H01L2924/00
Abstract: PURPOSE: A substrate level bonding method and a substrate level package are provided to apply superior bonding force regardless of the surface shape of a substrate by adopting a dry-film resist(DFR) as an adhesive material. CONSTITUTION: A first substrate including a plurality of substrate units is prepared(S10). The substrate units are spaced apart by holes. A first DFR layer is formed on the first surface of the first substrate(S20). Substrate adhered parts of the first DFR layer which covers each substrate unit is partially hardened(S30). Parts of the first DFR layer which corresponds to the holes are removed(S40). The external surface of the substrate adhered parts are attached to a second substrate(S50).
Abstract translation: 目的：通过采用干膜抗蚀剂（DFR）作为粘合剂材料，提供了与衬底的表面形状无关的优异结合力的衬底水平焊接方法和衬底层封装。 构成：准备包括多个基板单元的第一基板（S10）。 基板单元由孔隔开。 在第一基板的第一表面上形成第一DFR层（S20）。 覆盖每个基板单元的第一DFR层的基板粘合部分被部分硬化（S30）。 去除与孔对应的第一DFR层的部分（S40）。 将基板粘接部的外表面安装在第二基板上（S50）。
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