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公开(公告)号：KR1020110076494A
公开(公告)日：2011-07-06
申请号：KR1020090133231
申请日：2009-12-29
Applicant: 제일모직주식회사
Abstract: PURPOSE: A thermoplastic rubber compound is provided to ensure excellent ductility, surface hardness, and restitution at high and low temperatures and to enable use for the manufacture of various molded products such as electrical and electronic parts and automobile parts. CONSTITUTION: A thermoplastic rubber compound includes (A) a block copolymer including at least two aromatic vinyl compounds and one or more conjugated diene-based compounds, (B) paraffin oil, (C) polyolefin resins, (D) inorganic additives, (E) polyphenylene ether-based resins and (F) a polypropylene-silicone rubber master batch. The polypropylene-silicone rubber master batch is included in the amount of 0.01-5 weight%.
Abstract translation: 目的：提供热塑性橡胶化合物，以确保在高低温下具有优异的延展性，表面硬度和恢复性，并可用于制造各种模制产品，如电气和电子零件以及汽车零件。 构成：热塑性橡胶化合物包括（A）包含至少两种芳族乙烯基化合物和一种或多种共轭二烯基化合物的嵌段共聚物，（B）石蜡油，（C）聚烯烃树脂，（D）无机添加剂，（E ）聚苯醚系树脂和（F）聚丙烯 - 硅橡胶母料。 聚丙烯 - 硅橡胶母料的含量为0.01-5重量％。
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公开(公告)号：KR1020110075660A
公开(公告)日：2011-07-06
申请号：KR1020090132167
申请日：2009-12-28
Applicant: 제일모직주식회사
Abstract: PURPOSE: A polyamide-based resin composition is provided to ensure excellent heat resistance, light resistance, and water resistance, thereby ensuring a contact angle with water of 60° or greater. CONSTITUTION: A polyamide-based resin composition comprises (A) 40-70 weight% of polyamide resin, (B) 5-30 weight% of white pigment, (C) 0.01-5 weight% of a hindered amine compound with an average molecular weight of 1,000-10,000, and (D) more than 0 weight% and 60 weight% of filler. The hindered amine compound has average molecular weight of 2,000-5,000. The hindered amine compound is represented by chemical formula 1.
Abstract translation: 目的：提供聚酰胺类树脂组合物，以确保优异的耐热性，耐光性和耐水性，从而确保与水的接触角为60°以上。 构成：聚酰胺类树脂组合物包含（A）40-70重量％的聚酰胺树脂，（B）5-30重量％的白色颜料，（C）0.01-5重量％的受阻胺化合物，其平均分子量 重量为1,000-10,000，（D）大于0重量％和60重量％的填料。 受阻胺化合物的平均分子量为2,000-5,000。 受阻胺化合物由化学式1表示。
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公开(公告)号：KR1020100073672A
公开(公告)日：2010-07-01
申请号：KR1020080132400
申请日：2008-12-23
Applicant: 제일모직주식회사
IPC: C08L69/00 , C08K3/10 , C08L101/00
CPC classification number: C08G59/688 , C08G59/62 , C08K3/32 , C08K3/38 , C08K5/09 , C08L25/02 , C08L69/00 , C08L2666/04
Abstract: PURPOSE: A branched polycarbonate resin composition is provided to be applied to various molded products including auto parts, a computer housing, and other office supplies due to excellent impact strength, heat resistance, mechanical strength, and workability. CONSTITUTION: A branched polycarbonate resin composition comprises: 80-99 weight% of a polycarbonate resin; 0.5-20 weight% of a polymer having a reactive group and carbon-carbon double bond; and 0.0001-0.8 weight% of an ionic compound including an ion which is selected from an alkali metal ion and an organic cation. The average molecular weight of the polycarbonate resin is 10,000-200,000 g/mol.
Abstract translation: 目的：提供一种支化聚碳酸酯树脂组合物，其由于优异的冲击强度，耐热性，机械强度和可加工性而适用于包括汽车部件，计算机外壳和其它办公用品在内的各种模塑产品。 构成：支化聚碳酸酯树脂组合物包含：80-99重量％的聚碳酸酯树脂; 0.5-20重量％的具有反应性基团和碳 - 碳双键的聚合物; 和0.0001-0.8重量％的包含选自碱金属离子和有机阳离子的离子的离子化合物。 聚碳酸酯树脂的平均分子量为10,000-200,000g / mol。
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公开(公告)号：KR1020100066193A
公开(公告)日：2010-06-17
申请号：KR1020080124876
申请日：2008-12-09
Applicant: 제일모직주식회사
Abstract: PURPOSE: A polycarbonate thermoplastic resin composition is provided to secure the simultaneously, the mobility, the heat resistance, and the property balance of the composition. CONSTITUTION: A polycarbonate thermoplastic resin composition contain 30~80 parts of polycarbonate resin by weight, 10~50 parts of (meth)acrylic acid alkyl ester copolymer by weight, and 5~30 parts of rubber-modified vinyl graft copolymer by weight, for 100 parts of polycarbonate thermoplastic resin composition by weight. The (meth)acrylic acid alkyl ester copolymer contains 40~80 parts of (meth)acrylic-acid alkyl ester monomer by weight, 10~30 parts of aromatic vinyl monomer by weight, and 2~50 parts of unsaturated nitrile monomer by weight.
Abstract translation: 目的：提供聚碳酸酯热塑性树脂组合物以同时确保组合物的迁移率，耐热性和性能平衡。 构成：聚碳酸酯热塑性树脂组合物含有30〜80重量份的聚碳酸酯树脂，10〜50重量份的（甲基）丙烯酸烷基酯共聚物，5〜30重量份的橡胶改性的乙烯基接枝共聚物， 100份聚碳酸酯热塑性树脂组合物。 （甲基）丙烯酸烷基酯共聚物含有40〜80重量份的（甲基）丙烯酸烷基酯单体，10〜30重量份的芳香族乙烯基单体和2〜50重量份的不饱和腈单体。
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公开(公告)号：KR1020140105119A
公开(公告)日：2014-09-01
申请号：KR1020130018935
申请日：2013-02-22
Applicant: 제일모직주식회사
CPC classification number: C08L69/00 , C08J5/00 , C08K3/04 , C08K3/041 , C08K2201/001 , C08K2201/003 , C08K2201/004 , H01B1/20
Abstract: The present invention is to provide a thermoplastic resin composition having excellent electrical conductivity, impact resistance, and extrusion characteristics. The thermoplastic resin composition according to the present invention comprises, for a) 100 parts by weight of a polycarbonate resin, b) 0.5 to 5 parts by weight of carbon nantubes and c) 1 to 10 parts by weight of carbon black. Conductivity and impact resistance of the thermoplastic resin composition are excellent.
Abstract translation: 本发明提供具有优异导电性，耐冲击性和挤出特性的热塑性树脂组合物。 根据本发明的热塑性树脂组合物包含：a）100重量份的聚碳酸酯树脂，b）0.5至5重量份的碳纳米管和c）1至10重量份的炭黑。 热塑性树脂组合物的电导率和耐冲击性优异。
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Patent Agency Ranking
公开(公告)号：KR1020130078190A
公开(公告)日：2013-07-10
申请号：KR1020110146992
申请日：2011-12-30
Applicant: 제일모직주식회사
CPC classification number: C08K13/02 , C08K3/22 , C08K7/14 , C08K9/06 , C08K2003/222 , C08K2201/005 , C08L77/06 , C08L81/04
Abstract: PURPOSE: A thermoplastic resin composition and a molded product are provided to have an excellent heat conductivity and humid proof, mobility and industrially usable level of strength. CONSTITUTION: A thermoplastic resin composition comprises (a) 30-50 weight% of thermoplastic matrix resin, and (b) 50-70 weight% of silane group chemical surface processing magnesium oxide. The silane chemical is vinyl group or amine group containing silane oligomer. The thermoplastic matrix resin (A) is polyamide resin. The magnesium oxide (B) is in spherical particle and contains 80% or more of the total magnesium oxide weight with the average particle diameter of 30-80 micron, and has a specific surface area (BET) of 0.4-0.6 g / cm.
Abstract translation: 目的：提供热塑性树脂组合物和模制产品，以具有优异的导热性和防潮性，流动性和工业上的强度水平。 构成：热塑性树脂组合物包含（a）30-50重量％的热塑性基体树脂，和（b）50-70重量％的硅烷基化学表面处理氧化镁。 硅烷化学品是含乙烯基或含胺基的硅烷低聚物。 热塑性基体树脂（A）是聚酰胺树脂。 氧化镁（B）为球形粒子，其平均粒径为30〜80微米，总氧化镁重量的80％以上，比表面积（BET）为0.4〜0.6g / cm 3。
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公开(公告)号：KR101277719B1
公开(公告)日：2013-06-24
申请号：KR1020090127312
申请日：2009-12-18
Applicant: 제일모직주식회사
Abstract: (A) (A-1) 폴리카보네이트 수지 및 (A-2) 비닐계 공중합체를 포함하는 기초 수지, 그리고 (B) 1종 이상의 아크릴계 단량체를 포함하는 아크릴계 공중합체를 포함하는 폴리카보네이트 수지 및 비닐계 공중합체의 블렌드 조성물 및 이를 이용한 성형품이 제공된다.
폴리카보네이트 수지, 비닐계 공중합체, 아크릴계 공중합체, 웰드 강도-
公开(公告)号：KR101266293B1
公开(公告)日：2013-05-22
申请号：KR1020080134785
申请日：2008-12-26
Applicant: 제일모직주식회사
Abstract: 본발명의일 구현예에따른폴리카보네이트계열가소성수지조성물은웰드강도와내충격성이우수한동시에유동성, 내열성, 열안정성, 작업성등의물성밸런스가우수하여, 박막의복잡한성형이요구되는전기전자하우징, 컴퓨터하우징또는기타사무용기기등에광범위하게적용가능하다.
Abstract translation: 根据本发明的一个实施方式的聚碳酸酯基塑性树脂组合物具有优异的焊接强度和耐冲击性，并且具有优异的物理性能如流动性，耐热性，热稳定性和可加工性等的平衡， ，电脑房或其他办公设备。
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公开(公告)号：KR101232270B1
公开(公告)日：2013-02-12
申请号：KR1020090132412
申请日：2009-12-29
Applicant: 제일모직주식회사
Abstract: 본 발명은 액정 폴리에스테르 수지 조성물에 관한 것으로, 보다 상세하게는 (A) 액정 폴리에스테르 수지 20 내지 80 중량%, (B) 무기 충진제 20 내지 80 중량%로 이루어진 기초수지 100 중량부에 대하여, (C) 몬탄산 염 0.01∼10 중량부로 이루어진 것을 특징으로 한다. 본 발명은 액정 폴리에스테르 수지의 결정화 속도를 빠르게 함으로써 정밀한 인서트 성형에 우수한 이형성을 제공하고 반사율이 우수한 수지 조성물을 제공한다.
액정 폴리에스테르 수지, 몬탄산 염, LED 리플렉터, 고백색, 결정화속도, 이형성-
公开(公告)号：KR1020110079146A
公开(公告)日：2011-07-07
申请号：KR1020090136120
申请日：2009-12-31
Applicant: 제일모직주식회사
CPC classification number: C08L77/00 , C08K3/013 , C08K3/38 , C08L23/00 , C08L33/12 , C08L77/06 , C08L81/04 , C08L2666/06 , C08L81/00 , C08L2666/04
Abstract: PURPOSE: A polyamide-based resin composition is provided to ensure excellent whiteness, thermo-conductivity, and extruding-moldability and to use as materials of a heat removal plate used for a reflector for LED. CONSTITUTION: A polyamide-based resin composition comprises a polyamide resin, thermally conductive filler, filling material, and thermoplastic resin. The thermoplastic resin has compatibility with polyamide. The average molecular weight of the thermoplastic resin is 500,000 - 5,000,000. The thermally conductive filler is one or more selected from the group consisting of boron nitride, aluminum oxide, boron nitride, boron carbide, calcium fluoride and aluminum nitride. The thermoplastic resin is one or more selected from the group consisting of an acrylic resin, a sulfide resin and a polyolefin resin.
Abstract translation: 目的：提供聚酰胺类树脂组合物，以确保优异的白度，热导率和挤出成型性，并且用作用于LED的反射器的散热板的材料。 构成：聚酰胺类树脂组合物包含聚酰胺树脂，导热填料，填充材料和热塑性树脂。 热塑性树脂与聚酰胺具有相容性。 热塑性树脂的平均分子量为500,000-5,000,000。 导热填料是选自氮化硼，氧化铝，氮化硼，碳化硼，氟化钙和氮化铝中的一种或多种。 热塑性树脂是选自丙烯酸树脂，硫化物树脂和聚烯烃树脂中的一种或多种。
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