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公开(公告)号：KR101459120B1
公开(公告)日：2014-11-12
申请号：KR1020110049058
申请日：2011-05-24
Applicant: 제일모직주식회사
Abstract: (A) 수첨 삼원 블록 공중합체; (B) 비방향족 오일; (C) 폴리올레핀 수지; (D) 무기 필러; (E) 폴리페닐렌에테르계 수지 및 (F) 실리콘 수지를 포함하는 열가소성 고무 및 이를 이용한 성형품이 제공된다. 상기 열가소성 고무는 저경도 및 고강도 특성을 동시에 보유하고 우수한 내마모성과 항균성을 갖는다.
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公开(公告)号：KR1020120078558A
公开(公告)日：2012-07-10
申请号：KR1020110049058
申请日：2011-05-24
Applicant: 제일모직주식회사
Abstract: PURPOSE: A thermoplastic rubber is provided to have excellent thermal resistance, low hardness, and high strength, to have excellent physical properties, restitution, etc at room temperature and low temperatures, and to have excellent surface properties like thermal resistance, chemical resistance, processability, antibacterial property, moldability, etc. CONSTITUTION: A thermoplastic rubber comprises 25-55 weight% of hydrogenated block terpolymer, 20-50 weight% of aromatic oil, 5-15 weight% polyolefin resin, 5-20 weight% of inorganic filler, 3-15 weight% of polyphenylenether based resin, and 0.01-5 parts by weight of silicone resin, and additionally comprises metal(oxide)-containing aid. The thermoplastic rubber has surface hardness(shore A) of 0.1-50 A by KSM 6518. The hydrogenated block terpolymer comprises 20-35 weight% of an aromatic vinyl based polymer block.
Abstract translation: 目的：提供热塑性橡胶以具有优异的耐热性，低硬度和高强度，在室温和低温下具有优异的物理性能，还原性等，并具有优异的表面性能，如耐热性，耐化学性，加工性 抗菌性，成型性等构成：热塑性橡胶含25-55重量％氢化嵌段三元共聚物，20-50重量％芳族油，5-15重量％聚烯烃树脂，5-20重量％无机填料， 3-15重量％的多苯基树脂，和0.01-5重量份的有机硅树脂，并且还包括含金属（氧化物）的助剂。 热塑性橡胶通过KSM 6518具有0.1-50A的表面硬度（Shore A）。氢化嵌段三元共聚物包含20-35重量％的芳族乙烯基聚合物嵌段。
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公开(公告)号：KR1020110075660A
公开(公告)日：2011-07-06
申请号：KR1020090132167
申请日：2009-12-28
Applicant: 제일모직주식회사
Abstract: PURPOSE: A polyamide-based resin composition is provided to ensure excellent heat resistance, light resistance, and water resistance, thereby ensuring a contact angle with water of 60° or greater. CONSTITUTION: A polyamide-based resin composition comprises (A) 40-70 weight% of polyamide resin, (B) 5-30 weight% of white pigment, (C) 0.01-5 weight% of a hindered amine compound with an average molecular weight of 1,000-10,000, and (D) more than 0 weight% and 60 weight% of filler. The hindered amine compound has average molecular weight of 2,000-5,000. The hindered amine compound is represented by chemical formula 1.
Abstract translation: 目的：提供聚酰胺类树脂组合物，以确保优异的耐热性，耐光性和耐水性，从而确保与水的接触角为60°以上。 构成：聚酰胺类树脂组合物包含（A）40-70重量％的聚酰胺树脂，（B）5-30重量％的白色颜料，（C）0.01-5重量％的受阻胺化合物，其平均分子量 重量为1,000-10,000，（D）大于0重量％和60重量％的填料。 受阻胺化合物的平均分子量为2,000-5,000。 受阻胺化合物由化学式1表示。
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Patent Agency Ranking
公开(公告)号：KR1020080062503A
公开(公告)日：2008-07-03
申请号：KR1020060138412
申请日：2006-12-29
Applicant: 제일모직주식회사
IPC: C08L69/00 , C08L67/03 , C08K5/5415
CPC classification number: C08L69/00 , C08K3/22 , C08K9/02 , C08K9/04 , C08L27/18 , C08L67/02 , C08L83/04 , C08L2666/02
Abstract: A polycarbonate resin composition, a pellet formed by extruding the composition, and a liquid crystal display backlight part formed by using the composition are provided to improve flame retardancy and light resistance and to enhance the physical properties balance of heat resistance, impact strength, workability and appearance. A polycarbonate resin composition comprises 60-95 parts by weight of a thermoplastic polycarbonate resin; 5-40 parts by weight of a polyethylene naphthalate-terephthalate copolymer; 5-50 parts by weight of titanium dioxide; 0.1-10 parts by weight of an organosiloxane polymer represented by the formula; and 0.05-5 parts by weight of a fluorinated polyolefin-based resin, wherein R1 is independently C1-C8 alkyl group, a C6-C30 aryl group or an aryl group substituted with an alkyl group; and n is an integer of 1-10,000.
Abstract translation: 提供聚碳酸酯树脂组合物，通过挤出组合物形成的颗粒和使用该组合物形成的液晶显示器背光部分，以改善阻燃性和耐光性，并提高耐热性，冲击强度，可加工性和 出现。 聚碳酸酯树脂组合物包含60-95重量份的热塑性聚碳酸酯树脂; 5-40重量份聚萘二甲酸乙二醇酯 - 对苯二甲酸乙二醇酯共聚物; 5-50重量份二氧化钛; 0.1-10重量份由下式表示的有机硅氧烷聚合物; 和0.05-5重量份氟化聚烯烃基树脂，其中R1独立地为C1-C8烷基，C6-C30芳基或被烷基取代的芳基; n为1-10,000的整数。
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公开(公告)号：KR100833957B1
公开(公告)日：2008-05-30
申请号：KR1020060138698
申请日：2006-12-29
Applicant: 제일모직주식회사
IPC: C08L69/00 , C08K5/5415 , C08L83/06
Abstract: A polycarbonate resin composition, a pellet obtained by extruding the composition, and an external material for electric or electronic products obtained by injection molding the composition are provided to improve impact resistance and chemical resistance. A polycarbonate resin composition comprises 100 parts by weight of a thermoplastic polycarbonate resin; and 0.1-10 parts by weight of a phenyl-substituted siloxane copolymer having a kinematic viscosity of 300-1,000 mm^2/s at 25 deg.C represented by the formula II, wherein R1 is a methyl group or a phenyl group; R2 is a methyl group, a phenyl group, a hydroxyl group, a methoxy group, a phenoxy group or a vinyl group; and n and m represent the number of repeating units.
Abstract translation: 提供聚碳酸酯树脂组合物，通过挤出组合物获得的颗粒，以及通过注射成型组合物获得的电子或电子产品的外部材料，以提高耐冲击性和耐化学性。 聚碳酸酯树脂组合物包含100重量份的热塑性聚碳酸酯树脂; 和0.1-10重量份由式II表示的在25℃下运动粘度为300-1,000mm 2 / s的苯基取代的硅氧烷共聚物，其中R1是甲基或苯基; R2是甲基，苯基，羟基，甲氧基，苯氧基或乙烯基; n和m表示重复单元的数目。
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公开(公告)号：KR1020110079146A
公开(公告)日：2011-07-07
申请号：KR1020090136120
申请日：2009-12-31
Applicant: 제일모직주식회사
CPC classification number: C08L77/00 , C08K3/013 , C08K3/38 , C08L23/00 , C08L33/12 , C08L77/06 , C08L81/04 , C08L2666/06 , C08L81/00 , C08L2666/04
Abstract: PURPOSE: A polyamide-based resin composition is provided to ensure excellent whiteness, thermo-conductivity, and extruding-moldability and to use as materials of a heat removal plate used for a reflector for LED. CONSTITUTION: A polyamide-based resin composition comprises a polyamide resin, thermally conductive filler, filling material, and thermoplastic resin. The thermoplastic resin has compatibility with polyamide. The average molecular weight of the thermoplastic resin is 500,000 - 5,000,000. The thermally conductive filler is one or more selected from the group consisting of boron nitride, aluminum oxide, boron nitride, boron carbide, calcium fluoride and aluminum nitride. The thermoplastic resin is one or more selected from the group consisting of an acrylic resin, a sulfide resin and a polyolefin resin.
Abstract translation: 目的：提供聚酰胺类树脂组合物，以确保优异的白度，热导率和挤出成型性，并且用作用于LED的反射器的散热板的材料。 构成：聚酰胺类树脂组合物包含聚酰胺树脂，导热填料，填充材料和热塑性树脂。 热塑性树脂与聚酰胺具有相容性。 热塑性树脂的平均分子量为500,000-5,000,000。 导热填料是选自氮化硼，氧化铝，氮化硼，碳化硼，氟化钙和氮化铝中的一种或多种。 热塑性树脂是选自丙烯酸树脂，硫化物树脂和聚烯烃树脂中的一种或多种。
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公开(公告)号：KR1020110079103A
公开(公告)日：2011-07-07
申请号：KR1020090136068
申请日：2009-12-31
Applicant: 제일모직주식회사
IPC: C08L101/00 , C08K3/08 , C08K7/02 , H05K9/00
Abstract: PURPOSE: A thermoplastic resin composition is provided to ensure high modulus, high stiffness, high strength, and excellent electromagnetic wave shielding property by comprising a thermoplastic resin, inorganic filler, and metal. CONSTITUTION: A thermoplastic resin composition with excellent electromagnetic wave shielding property comprises 20~50 weight% of a thermoplastic resin, 5~80 weight% of inorganic filler, and 5~50 weight% of metal with a low melting point of 300°C or less. The thermoplastic resin is selected from the group consisting of polyamide, polyethyleneterephthalate, polybutyleneterephthalate, polyacetal, polycarbonate, polyimide, polyphenyleneoxide, polysulfone, polyphenylenesulfide, polyamide-imide, polyethesulfone, liquid crystal polymer, polyetherketone, polyetherimide, polyolefin, acrylonitrile-butadiene-styrene, polystyrene, syndiotactic polystyrene, and mixture thereof.
Abstract translation: 目的：提供一种热塑性树脂组合物，其通过包含热塑性树脂，无机填料和金属来确保高模量，高刚度，高强度和优异的电磁波屏蔽性能。 构成：具有优异的电磁波屏蔽性的热塑性树脂组合物包含20〜50重量％的热塑性树脂，5〜80重量％的无机填料和5〜50重量％的金属，低熔点为300℃， 减。 聚酰胺，聚对苯二甲酸乙二醇酯，聚缩醛，聚碳酸酯，聚酰亚胺，聚苯醚，聚砜，聚苯硫醚，聚酰胺酰亚胺，聚醚砜，液晶聚合物，聚醚酮， 聚苯乙烯，间同立构聚苯乙烯及其混合物。
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公开(公告)号：KR100869967B1
公开(公告)日：2008-11-24
申请号：KR1020060138412
申请日：2006-12-29
Applicant: 제일모직주식회사
IPC: C08L69/00 , C08L67/03 , C08K5/5415
CPC classification number: C08L69/00 , C08K3/22 , C08K9/02 , C08K9/04 , C08L27/18 , C08L67/02 , C08L83/04 , C08L2666/02
Abstract: 본 발명의 LCD 배면광 부품에 사용하는 난연성 및 내광성이 우수한 폴리카보네이트 수지 조성물은 열가소성 폴리카보네이트 수지 60∼95 중량부와 폴리에틸렌나프탈레이트-테레프탈레이트 공중합체 5∼40 중량부로 이루어지는 기초수지 100 중량부에 대하여, 이산화티탄 5∼50 중량부, 유기 실록산 중합체 0.1∼10 중량부, 및 불소화 폴리올레핀계 수지 0.05∼5 중량부로 구성되는 것을 그 특징으로 한다.
폴리카보네이트 수지, 폴리에스테르 공중합체, 이산화티탄, 유기 실록산 중합체, 불소화 폴리올레핀계 수지, 난연성, 내광성
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