公开(公告)号：KR1020120039212A

公开(公告)日：2012-04-25

申请号：KR1020100100780

申请日：2010-10-15

Applicant: 한국과학기술원

Inventor： 김승우 ,  김영진 ,  김윤석 ,  김승만 ,  유준호 ,  한승회 ,  박상욱

IPC: B23K26/70 ,  G01N21/63 ,  H01S3/10

Abstract: PURPOSE: Laser processing condition monitoring apparatus and method using plasma are provided to effectively monitor and analyze the processed condition of objects using the plasma generated from the processed objects. CONSTITUTION: A laser processing condition monitoring method comprises the following steps: irradiating an object(102) with a pulse laser(107) for processing; and detecting light(200) transmitted from the plasma(106) generated from the object for monitoring the processed condition of the object. The peak power of the pulse laser is controlled to process the object with a nonlinear optic phenomenon.

Abstract translation: 目的：提供使用等离子体的激光加工状态监测装置和方法，以有效地监测和分析使用从被处理物体产生的等离子体的物体的处理状态。 构成：激光加工状态监测方法包括以下步骤：用脉冲激光器（107）照射物体（102）进行处理; 以及检测从所述对象产生的等离子体（106）发送的光（200），用于监视对象的处理状态。 控制脉冲激光器的峰值功率以用非线性光学现象来处理物体。

公开(公告)号：KR1020110137031A

公开(公告)日：2011-12-22

申请号：KR1020100057008

申请日：2010-06-16

Applicant: 한국과학기술원

Inventor： 김승우 ,  김영진 ,  김윤석 ,  유준호 ,  김승만 ,  박상욱 ,  한승회

IPC: B23K26/382 ,  H01S3/10

Abstract: PURPOSE: A cutting method through control of light intensity depending on the time of femtosecond pulse laser is provided to maximize the effect of a processing mechanism, which bases on multi photon ionization and avalanche ionization. CONSTITUTION: A cutting method through control of light intensity depending on the time of femtosecond pulse laser comprises next steps. At least two femtosecond laser pulses are generated separately to have a time interval using pulse delay(120). Each pulse excites electrons on a target(200) based on multi photon Ionization. The electrons excited from the multi photon ionization through avalanche ionization are used as seeds to increase the ionization of a material. Each of at least two femtosecond laser pulses is output, wherein one or more of their pulse width, pulse energy threshold, and inter-pulse interval are different.

Abstract translation: 目的：提供根据飞秒脉冲激光器的时间控制光强度的切割方法，以最大化基于多光子电离和雪崩电离的处理机制的影响。 构成：根据飞秒脉冲激光器的时间控制光强度的切割方法包括以下步骤。 至少两个飞秒激光脉冲被分开产生以具有使用脉冲延迟的时间间隔（120）。 每个脉冲基于多光子电离在靶（200）上激发电子。 通过雪崩电离从多光子电离激发的电子被用作种子以增加材料的电离。 输出至少两个飞秒激光脉冲中的每一个，其中它们的脉冲宽度，脉冲能量阈值和脉冲间间隔中的一个或多个是不同的。

公开(公告)号：KR1020110132004A

公开(公告)日：2011-12-07

申请号：KR1020100051774

申请日：2010-06-01

Applicant: 한국과학기술원

Inventor： 김승우 ,  김영진 ,  김윤석 ,  유준호 ,  김승만 ,  박상욱 ,  한승회

IPC: B26F3/00 ,  B23K26/38 ,  H01L21/304

CPC classification number: B23K26/36 ,  H01L21/304

Abstract: PURPOSE: A processed-surface cutting method using a PZT(piezoelectric) element applying femtosecond pulse laser is provided to enhance the cutting speed since the temtosecond pulse laser is used for a bendable or expandable PZT element, and the modified area of a target is separated along a cutting line quickly. CONSTITUTION: A processed-surface cutting method using a PZT(piezoelectric) element applying femtosecond pulse laser is as follows. A transparent material, a wafer, and a target(101) like a substrate are attached to an expanding tape(103), and the expanding tape is attached onto a bendable PZT element(102). The femtosecond pulse laser is irradiated to the cut part of the target for several tens of femtosecond, and modified areas are formed in the cut part of the target. Voltage is supplied to the bendable PZT element, and the middle part of the PZT element is protruded to generate bending stress.

Abstract translation: 目的：提供使用飞秒脉冲激光器的PZT（压电）元件的加工面切割方法，以提高切割速度，因为立体脉冲激光器用于可弯曲或可扩展的PZT元件，并且目标的修改区域被分离 沿着切割线很快。 构成：使用使用飞秒脉冲激光器的PZT（压电）元件的加工面切割方法如下。 将透明材料，晶片和像基板的靶（101）连接到扩张带（103）上，将扩张带附接到可弯曲的PZT元件（102）上。 飞秒脉冲激光被照射到目标的切割部分数十飞秒，并且在靶的切割部分中形成改质区域。 电压被提供给可弯曲的PZT元件，并且PZT元件的中间部分突出以产生弯曲应力。