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公开(公告)号:US20190135611A1
公开(公告)日:2019-05-09
申请号:US16241014
申请日:2019-01-07
Applicant: 3M INNOVATIVE PROPERTIES COMPANY
Inventor: Phillip J. Bergeron , Brent D. Lunceford , John D. Geissinger , Douglas B. Gundel , Justine A. Mooney , Ravi Palaniswamy , Siang Sin Foo
Abstract: A Micro Electrical Mechanical Systems (MEMS) article including a non-planar surface and a continuous film conforming to the non-planar surface is described. The continuous film includes a polymer layer disposed between two metal layers and is patterned to define one or more MEMS elements.
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公开(公告)号:US10207916B2
公开(公告)日:2019-02-19
申请号:US15306569
申请日:2015-05-11
Applicant: 3M INNOVATIVE PROPERTIES COMPANY
Inventor: Phillip J. Bergeron , Brent D. Lunceford , John D. Geissinger , Douglas B. Gundel , Justine A. Mooney , Ravi Palaniswamy , Siang Sin Foo
Abstract: A flexible film including one or more MEMS elements and articles including the flexible film are described. The flexible film includes a polymer layer between two metal layers with one of the metal layers containing a perforation. The polymer layer includes voided regions that allow for relative movement of the two metal layers.
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公开(公告)号:US20180219136A1
公开(公告)日:2018-08-02
申请号:US15748663
申请日:2016-08-30
Applicant: 3M INNOVATIVE PROPERTIES COMPANY
Inventor: Alejandro Aldrin A. Narag, II , Ravi Palaniswamy
CPC classification number: H01L33/486 , H01L33/62 , H05K1/189 , H05K2201/10106
Abstract: A flexible dielectric substrate (102) defines a LESD mounting region (120) including two conductive filled vias (105, 106) extending through the flexible dielectric substrate (102) and the LESD mounting region is substantially surrounded by two conductive frame portions (112, 116). The frame portions are in electrical connection with the conductive filled vias (105, 106), respectively. The conductive filled vias (105, 106) form conductive features in the mounting region (120) that are co-planar with each other.
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公开(公告)号:US10014456B2
公开(公告)日:2018-07-03
申请号:US15128500
申请日:2015-03-17
Applicant: 3M INNOVATIVE PROPERTIES COMPANY
Inventor: Ravi Palaniswamy , Alejandro Aldrin Agcaoili Narag, II , Dong-Soo Lee , Dominic M. Travasso
CPC classification number: H01L33/62 , H01L21/4846 , H01L21/486 , H01L23/49827 , H01L23/4985 , H01L33/46 , H01L33/48 , H01L33/483 , H01L33/486 , H01L33/60 , H01L33/64 , H01L33/647 , H01L2224/48091 , H01L2224/48137 , H01L2933/0033 , H01L2933/0066 , H01L2924/00014
Abstract: Flexible LED assemblies that have coplanar integrated conductive features upon which an LED can be mounted, and methods of making such LED assemblies are described. The flexible LED assembly includes a flexible polymer substrate, a first conductive feature, a second conductive feature and an LED. The first conductive feature is positioned both within the flexible substrate and on a surface of the flexible substrate. The second conductive feature is positioned both within the flexible substrate and on a surface of the flexible substrate. The first and second conductive features are separated by a gap therebetween. The LED is mounted on both the first and second conductive features, and the first and second conductive features are substantially coplanar with one another.
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公开(公告)号:US20170164462A1
公开(公告)日:2017-06-08
申请号:US15327397
申请日:2015-08-05
Applicant: 3M INNOVATIVE PROPERTIES COMPANY
Inventor: Jian Xia Gao , Ravi Palaniswamy , Muthu Sebastian , Dominic M. Travasso , Augusto A. Noronha, III , Woo-Young Ahn , Moses M. David , Nathan P. Kreutter , Kihoon Sung
CPC classification number: H05K1/03 , C23C14/022 , C23C14/025 , C23C14/205 , C23C14/34 , C23C28/021 , H05K1/028 , H05K3/02
Abstract: A reflection sheet and a method of manufacturing a reflection sheet are disclosed. The reflection sheet comprises a substrate layer and a reflective layer formed on the substrate layer, wherein the reflective layer comprises an alloy consisting of silver (Ag), palladium (Pd) and neodymium (Nd).
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公开(公告)号:US20170073215A1
公开(公告)日:2017-03-16
申请号:US15306569
申请日:2015-05-11
Applicant: 3M INNOVATIVE PROPERTIES COMPANY
Inventor: Phillip J. Bergeron , Brent D. Lunceford , John D. Geissinger , Douglas B. Gundel , Justine A. Mooney , Ravi Palaniswamy , Siang Sin Foo
IPC: B81B3/00
CPC classification number: B81B3/0021 , B81B2201/0235 , B81B2207/053 , B81C1/00182
Abstract: A flexible film including one or more MEMS elements and articles including the flexible film are described. The flexible film includes a polymer layer between two metal layers with one of the metal layers containing a perforation. The polymer layer includes voided regions that allow for relative movement of the two metal layers.
Abstract translation: 描述了包括一个或多个MEMS元件和包括柔性膜的制品的柔性膜。 柔性膜包括在两个金属层之间的聚合物层,其中一个金属层包含穿孔。 聚合物层包括允许两个金属层的相对运动的空隙区域。
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