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    INDUCTIVE CHARGING MODULE
    41.
    发明申请
    INDUCTIVE CHARGING MODULE 审中-公开

    公开(公告)号：US20200083745A1

    公开(公告)日：2020-03-12

    申请号：US16127898

    申请日：2018-09-11

    Applicant: Apple Inc.

    Inventor： Karl Ruben Fredrik Larsson ,  Christopher S. Graham

    IPC: H02J50/10 ,  H02J7/02 ,  G06F1/18

    Abstract: This disclosure describes a portable electronic device that includes an inductive charging receiver for receiving power wireless from a charging device. The portable electronic device includes a device housing including a wall having a channel formed in an interior-facing surface of the wall. The portable electronic device also includes an inductive coil assembly for receiving power wirelessly that is coupled to the interior facing surface. The inductive coil assembly is a flat coil that includes concentric loops of electrically conductive material that define a central opening. A first electrical lead extends away from a peripheral portion of the flat coil and a second electrical lead extends from the central opening, into the channel formed in the back wall and beneath one side of the concentric loops.

    Charging assembly for wireless power transfer
    44.
    发明授权
    Charging assembly for wireless power transfer 有权

    公开(公告)号：US10424962B2

    公开(公告)日：2019-09-24

    申请号：US14871890

    申请日：2015-09-30

    Applicant: APPLE INC.

    Inventor： Christopher S. Graham ,  Paul J. Thompson

    IPC: H02J7/02 ,  H01F27/36 ,  H02J7/00 ,  H04B5/00 ,  H02J50/10 ,  H01F38/14 ,  H01F27/02

    Abstract: A charging assembly for wireless power transfer. In embodiments, the charging assembly comprises a housing, a cap structure, a ferrimagnetic sleeve, an inductive coil, a magnet, a printed circuit board assembly (PCBA), and a four-pin connector extending from a bottom surface of the PCBA. A ridge of the cap structure can be coupled to a lip of the housing. The housing can include a bottom housing surface having an aperture, and a sidewall extending between the bottom housing surface and the lip that extends outward from the sidewall along a perimeter of the housing parallel to the bottom housing surface. The four-pin connector can extend through the aperture of the housing. Some embodiments are directed to a charging device that incorporates the charging assembly.

    Inductive charging between electronic devices
    45.
    发明授权
    Inductive charging between electronic devices 有权

    公开(公告)号：US10404089B2

    公开(公告)日：2019-09-03

    申请号：US14731280

    申请日：2015-06-04

    Applicant: Apple Inc.

    Inventor： Darshan R. Kasar ,  Christopher S. Graham ,  Eric S. Jol

    IPC: H02J7/00 ,  H01F38/00 ,  H04B7/00 ,  H04B1/38 ,  H02J7/02 ,  G06F1/26 ,  H01F38/14 ,  H02J5/00

    Abstract: An electronic device and methods for inductively charging an electronic device using another external electronic device. The electronic device may include an enclosure, a battery positioned within the enclosure, and an inductive coil coupled to the battery. The inductive coil may have two or more operational modes, including a power receiving operational mode for wirelessly receiving power and a power transmitting operational mode for wirelessly transmitting power. The electronic device may also have a controller coupled to the inductive coil for selecting one of the operational modes.

    SENSOR MODULES FOR WIRELESS CHARGING MATS
    49.
    发明申请
    SENSOR MODULES FOR WIRELESS CHARGING MATS 审中-公开

    公开(公告)号：US20190081517A1

    公开(公告)日：2019-03-14

    申请号：US16127118

    申请日：2018-09-10

    Applicant: Apple Inc.

    Inventor： Christopher S. Graham ,  Demetrios B. Karanikos ,  Eric S. Jol

    IPC: H02J50/60 ,  H02J7/02 ,  H02J50/10 ,  H01F38/14 ,  H01F27/36 ,  H01F27/40 ,  H01F27/28 ,  G01K7/22 ,  G01K13/00

    Abstract: Embodiments describe a sensor module for a wireless charging device. The sensor module includes a substrate and a plurality of thermal sensor sub-modules formed in and on the substrate, Each thermal sensor sub-module includes a first thermistor and a second thermistor, the first thermistor configured to measure a top surface of the substrate, and the second thermistor configured to measure a bottom surface of the substrate, a first sensor pad and a second sensor pad coupled to respective first and second thermistors, each sensor pad including a first portion and a second portion coupled to a respective thermistor and including a plurality of fins arranged in a fin pattern, and a first through-via and a second through-via, each through-via coupled to a respective terminal of the first thermistor.

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