41.
    发明专利
    未知

    公开(公告)号:DE102005007034A1

    公开(公告)日:2006-08-17

    申请号:DE102005007034

    申请日:2005-02-15

    Applicant: DEGUSSA

    Abstract: Preparation of molded articles under condensation of a polyamide molded mass (A), where the polyamide portion contains at least 5 ppm of phosphorus in the form of acid compound, with a compound (I) having at least two carbonate units, comprises adding 0.001-10 wt.% of a salt of a weak acid to (A) before/during compounding, preparing a mixture of finished compounds and (I), transporting the mixture, which is optionally stored, and processing the mixture to molded articles, where the condensation is carried out first. An independent claim is included for a molded mass obtained by the process.

    TRANSPARENT MOULDING COMPOUND
    42.
    发明专利

    公开(公告)号:CA2592336A1

    公开(公告)日:2006-07-13

    申请号:CA2592336

    申请日:2005-11-09

    Applicant: DEGUSSA

    Abstract: The invention relates to the use of a molding composition which comprises at least 50% by weight of a copolyamide, which is composed of the following monomer combination: a) from 65 to 99 mol % of a substantially equimolar mixture composed of an unbranched aliphatic diamine having from 6 to 18 carbon atoms and of an unbranched aliphatic dicarboxylic acid having from 6 to 18 carbon atoms,  where the mixture composed of diamine and dicarboxylic acid comprises an average of from 8 to 12 carbon atoms, b) from 1 to 35 mol % of a substantially equimolar mixture composed of a cycloaliphatic diamine having from 8 to 20 carbon atoms and of a dicarboxylic acid having from 6 to 18 carbon atoms, for production of a printable or printed item, such as a ski topcoat.

    43.
    发明专利
    未知

    公开(公告)号:DE102004029217A1

    公开(公告)日:2006-01-05

    申请号:DE102004029217

    申请日:2004-06-16

    Applicant: DEGUSSA

    Abstract: The present invention relates to a composite part containing (i) a part composed of an ABS molding composition, and (ii) a multilayer film including at least one layer comprising a polyamide molding composition, and at least one layer comprising an adhesion promoter, wherein the adhesion promoter contains from 2 to 100% by weight of a copolymer, and wherein the copolymer contains (a) from 70 to 99.9% by weight of monomer units derived from vinyl compounds selected from the group consisting of acrylic acid derivatives, methacrylic acid derivatives, and vinylaromatics; and (b) from 0.1 to 30% by weight of monomer units comprising a functional group selected from the group consisting of a carboxylic anhydride group, an epoxy group, and an oxazoline group.

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