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1.发明专利
公开(公告)号：JP2012224086A
公开(公告)日：2012-11-15
申请号：JP2012098116
申请日：2012-04-23
Applicant: Evonik Degussa Gmbh , エボニック デグサ ゲーエムベーハーEvonik Degussa GmbH
Inventor： ALTING KIRSTEN , BLASCHKE JOERG
CPC classification number: B32B15/08 , B32B27/06 , H05K1/0373 , H05K1/0393 , H05K3/022 , H05K2201/0209 , Y10T428/24975
Abstract: PROBLEM TO BE SOLVED: To provide an adhesive-free composite which is suitable for producing a wiring board having good dimensional stability.SOLUTION: The composite in which a foil made of a polyarylene ether ketone molding material has been bonded to a metal foil is produced by the method including: I. providing a foil of the moulding composition the molding composition comprising (a) from 60 to 96 pts.wt. of a polyarylene ether ketone, (b) from 2 to 25 pts.wt. of hexagonal boron nitride and (c) from 2 to 25 pts.wt. of talc, wherein the sum of the pts.wt. of components (a), (b) and (c) is 100, and having a thickness from 5 to 1,200 μm; II. providing the metal foil having a thickness from 10 to 150 μm; and III. pressing the foils prepared in I. and II. at a temperature from T-40 K to T+40 K and at a pressure from 4 to 5,000 bar.
Abstract translation: 解决的问题：提供适合于制造具有良好尺寸稳定性的布线基板的无粘合剂复合材料。 解决方案：通过包括以下方法制备由聚芳醚酮成型材料制成的箔已经结合到金属箔上的复合物：I.提供模制组合物的箔，所述模制组合物包含（a） 60至96磅 的聚亚芳基醚酮，（b）2〜25重量份 的六方氮化硼和（c）2〜25重量份 的滑石，其中重量 的组分（a），（b）和（c）为100，厚度为5至1,200μm; II。 提供厚度为10〜150μm的金属箔; 和III。 压制在I.和II中制备的箔。 在从T
m -40K至T m + 40K的温度下，在4至5,000巴的压力下。 版权所有（C）2013，JPO＆INPIT -
2.发明专利
公开(公告)号：BRPI0607867B1
公开(公告)日：2016-12-13
申请号：BRPI0607867
申请日：2006-01-04
Applicant: DEGUSSA , EVONIK DEGUSSA GMBH
Inventor： BAUMANN FRANZ-ERICH DR , HÄGER HARALD , ALTING KIRSTEN , WIELPÜTZ MARTIN , BEYER MICHAEL , WURSCHE ROLAND , BOLLMANN SONJA
Abstract: folha à base de uma mistura de poliamidas. a presente invenção refere-se a uma folha, cuja camada de cobertura consiste em uma massa de moldagem, que consiste essencialmente nos seguintes componentes: a) 3 até 50% em peso de uma poliamida, escolhida a partir do grupo pa11 e pa12, assim como b) 50 até 97% em peso de uma poliamida, escolhida a partir do grupo pa1012 e pa1212, sendo que as indicações de porcentagem se referem à soma dos componentes a) e b), é adequada para a decoração de artigos conformados que conservam o seu brilho durante a duração de aplicação.
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公开(公告)号：BRPI0607867A2
公开(公告)日：2009-10-20
申请号：BRPI0607867
申请日：2006-01-04
Applicant: DEGUSSA
Inventor： WURSCHE ROLAND , BOLLMANN SONJA , HOGER HARALD , WIELPUETZ MARTIN , ALTING KIRSTEN , BEYER MICHAEL , DR BAUMANN FRANZ-ERICH
Abstract: A film whose outer layer is composed of a molding composition which is in essence composed of the following components: a) from 3 to 50% by weight of a polyamide, selected from the group of PA11 and PA12, and b) from 50 to 97% by weight of a polyamide, selected from the group of PA1012 and PA1212, where the percentages are based on the entirety of components a) and b), is suitable for decoration of moldings which retain their gloss during their service time.
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公开(公告)号：DE102007003327A1
公开(公告)日：2008-07-24
申请号：DE102007003327
申请日：2007-01-17
Applicant: EVONIK DEGUSSA GMBH
Inventor： ALTING KIRSTEN , WURSCHE ROLAND , HAEGER HARALD , WIELPUETZ MARTIN
Abstract: A film comprising the following layers: I. a layer based on a polyamide whose monomer units contain an average of at least 8 carbon atoms, II. an immediately adjacent layer composed of a moulding composition comprising a polyamide as in I. and a copolymer having functional groups is used for the production of a composite with a substrate which comprises PA6, PA66, PA6/66 or PPA, giving secure adhesion.
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公开(公告)号：DE102006040113A1
公开(公告)日：2008-03-06
申请号：DE102006040113
申请日：2006-08-26
Applicant: EVONIK DEGUSSA GMBH
Inventor： ALTING KIRSTEN , HUELSMANN KLAUS , WIELPUETZ MARTIN , LORENZ FRANK
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Patent Agency Ranking
公开(公告)号：DE102008002599A1
公开(公告)日：2009-12-31
申请号：DE102008002599
申请日：2008-06-24
Applicant: EVONIK DEGUSSA GMBH
Inventor： WURSCHE ROLAND , BOLLMANN SONJA , BAUMANN FRANZ-ERICH , KUETING BEATRICE , ALTING KIRSTEN , PAWLIK ANDREAS , WIELPUETZ MARTIN
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公开(公告)号：ES2314673T3
公开(公告)日：2009-03-16
申请号：ES05756778
申请日：2005-06-09
Applicant: EVONIK DEGUSSA GMBH
Inventor： WURSCHE ROLAND , BOLLMANN SONJA , WIELPUTZ MARTIN , ALTING KIRSTEN , HAGER HARALD
IPC: B32B27/34 , B32B7/12 , B32B27/08 , B32B27/30 , B60R13/00 , C09J133/06 , C09J133/14 , C09J145/00
Abstract: Utilización de un agente mediador de adhesión para la producción de una unión entre I. una capa a base de una masa de moldeo de poliamida, y II. una pieza a base de una masa de moldeo de ABS, caracterizada porque el agente mediador de adhesión contiene de 2 a 100% en peso de un copolímero, que contiene las siguientes unidades monoméricas: a) de 70 a 99,9% en peso de unidades monoméricas, que se derivan de unos compuestos vinílicos, los cuales se seleccionan entre derivados de ácido acrílico y derivados de ácido metacrílico, así como b) de 0,1 a 30% en peso de unidades monoméricas, que contienen un grupo funcional, el cual se selecciona entre un grupo de anhídrido de ácido carboxílico, un grupo epóxido y un grupo de oxazolina.
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公开(公告)号：DE502006001747D1
公开(公告)日：2008-11-20
申请号：DE502006001747
申请日：2006-01-04
Applicant: EVONIK DEGUSSA GMBH
Inventor： WURSCHE ROLAND , BOLLMANN SONJA , HAEGER HARALD , WIELPUETZ MARTIN , ALTING KIRSTEN , BEYER MICHAEL , BAUMANN FRANZ-ERICH
Abstract: A film whose outer layer is composed of a molding composition which is in essence composed of the following components: a) from 3 to 50% by weight of a polyamide, selected from the group of PA11 and PA12, and b) from 50 to 97% by weight of a polyamide, selected from the group of PA1012 and PA1212, where the percentages are based on the entirety of components a) and b), is suitable for decoration of moldings which retain their gloss during their service time.
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公开(公告)号：DE102006040112A1
公开(公告)日：2008-03-06
申请号：DE102006040112
申请日：2006-08-26
Applicant: EVONIK DEGUSSA GMBH
Inventor： ALTING KIRSTEN , WIELPUETZ MARTIN , LORENZ FRANK , HUELSMANN KLAUS , WURSCHE ROLAND
Abstract: A composite part is composed of I. a multilayer film, which comprises the following layers: a) a layer composed of a polyamide moulding composition and b) following in the inwards direction, a layer composed of an adhesion promoter, which comprises from 5 to 100% by weight of a copolymer, which contains the following monomer units: from 70 to 99.9% by weight of monomer units which derive from vinyl compounds selected from acrylic acid derivatives, methacrylic acid derivatives, alpha-olefins and vinylaromatics, and from 0.1 to 30% by weight of monomer units which contain a functional group selected from a carboxylic anhydride group, an epoxide group and an oxazoline group, and II. a substrate composed of a polycarbonate moulding composition.
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公开(公告)号：SG128542A1
公开(公告)日：2007-01-30
申请号：SG200601512
申请日：2006-03-08
Applicant: DEGUSSA
Inventor： ALTING KIRSTEN , BAUMANN FRANZ-ERICH , BOLLMANN SONJA , DOWE ANDREAS , WURSCHE ROLAND , SCHAFER GEORG
Abstract: The invention relates to the use of a polyamide molding composition which comprises the following components: a) at most 90 parts by weight of a polyamide obtainable from a lactam or from an amino carboxylic acid having at least 10 carbon atoms; and b) from 10 to 100 parts by weight of PAT1010, where components a) and b) give a total of 100 parts by weight, for production of a printable or printed item, for example a ski topcoat or a decorated composite component of a motor vehicle.
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