公开(公告)号：US10334762B2

公开(公告)日：2019-06-25

申请号：US15545745

申请日：2015-01-29

Applicant: Hewlett Packard Enterprise Development LP

Inventor： John Franz

IPC: H05K7/20 ,  H05K7/14 ,  F16L3/16

Abstract: The present disclosure relates to a movable rack. For example, the movable rack includes an umbilical connection to deliver a fluid, an electrical current, or a network connection to the movable rack. The present disclosure further relates to the movable rack to include a translating frame to move the umbilical connection to correspond with a movement of the movable rack.

公开(公告)号：US20190059178A1

公开(公告)日：2019-02-21

申请号：US16078224

申请日：2016-02-23

Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP

Inventor： David A. Moore ,  John Franz ,  Jonathon Hughes ,  Rahul V. Joshi ,  John Vijil

IPC: H05K7/20

Abstract: Examples herein disclose a multi-channel apparatus include a first channel and a second channel. The first channel receives heated air from an electrical component. The first channel deflects the heated air from a posterior electrical component. The deflection of the heated air is caused by a curvature of an internal partition. The second channel, which is segmented from the first channel via the internal partition, provides cool air to the posterior electrical component.

公开(公告)号：US10031041B2

公开(公告)日：2018-07-24

申请号：US15185872

申请日：2016-06-17

Applicant: Hewlett Packard Enterprise Development LP

Inventor： John Franz ,  Phi A Nguyen

IPC: G01M3/16 ,  G01N27/04 ,  G01N27/22 ,  G01R27/26

Abstract: Example implementations relate to a rope leak sensor holder segment. For example, in an implementation, a rope leak sensor holder segment includes an elongated track and a channel to accept a rope leak sensor. The rope leak sensor holder segment includes a retainer to secure the rope leak sensor within the channel.

公开(公告)号：US20180188133A1

公开(公告)日：2018-07-05

申请号：US15397798

申请日：2017-01-04

Applicant: Hewlett Packard Enterprise Development LP

Inventor： Tahir Cader ,  Zhiyong Li ,  John Franz

IPC: G01M3/40

CPC classification number: G01M3/40

Abstract: Examples herein relate to detecting a coolant leak. For example, a system includes a nanosensor coupled to an airflow channel in a server. The nanosensor provides a resistance measurement to a controller. The system includes the controller coupled to the nanosensor. The controller detects the coolant leak based on the resistance measurement from the nanosensor.

公开(公告)号：US20170363501A1

公开(公告)日：2017-12-21

申请号：US15185872

申请日：2016-06-17

Applicant: Hewlett Packard Enterprise Development LP

Inventor： John Franz ,  Phi A Nguyen

IPC: G01M3/16

CPC classification number: G01M3/16 ,  G01M3/165 ,  G01M3/181 ,  G01N27/048 ,  G01R27/2605

Abstract: Example implementations relate to a rope leak sensor holder segment. For example, in an implementation, a rope leak sensor holder segment includes an elongated track and a channel to accept a rope leak sensor. The rope leak sensor holder segment includes a retainer to secure the rope leak sensor within the channel.

公开(公告)号：US20170354051A1

公开(公告)日：2017-12-07

申请号：US15534933

申请日：2014-12-09

Applicant: Hewlett Packard Enterprise Development LP

Inventor： John Franz ,  Alan Doerr

IPC: H05K7/14

CPC classification number: H05K7/1404 ,  H05K7/1489

Abstract: An example bracket unit to control installation of an electronic module is provided herein. The bracket unit includes a bracket body, a bracket plate, and a fastener. The bracket plate includes a receiving member and an alignment indicator. The receiving member to engage with a rail unit and move between an equilibrium position and a displaced position based on a movement of the rail unit. The alignment indicator connected to the receiving member, such that movement of the alignment indicator corresponds to the movement of the receiving member. The fastener to slideably connect the bracket plate and the bracket body together.

公开(公告)号：US12245401B2

公开(公告)日：2025-03-04

申请号：US18330599

申请日：2023-06-07

Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP

Inventor： John Franz ,  Harvey Lunsman

IPC: F16L37/28 ,  F16L37/34 ,  G06F1/20 ,  H05K7/20

Abstract: A non-circular disconnect, comprising: a male body to insert into a non-circular female disconnect; a male poppet, wherein: when the non-circular disconnect is not inserted into the non-circular female disconnect, the male poppet is held in place, via spring force, at an opening of the non-circular male body to create a seal to prevent leakage; and when the non-circular disconnect is inserted into the non-circular female disconnect, the male poppet is pushed inwards, to allow for liquid to flow through the non-circular disconnect, by a plunger in the non-circular female disconnect.

公开(公告)号：US11974414B2

公开(公告)日：2024-04-30

申请号：US17604827

申请日：2019-08-23

Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP

Inventor： Ernesto Ferrer Medina ,  Harvey J. Lunsman ,  Tahir Cader ,  John Franz

IPC: H05K7/20 ,  G06F1/20 ,  H05K1/02

CPC classification number: H05K7/20509 ,  G06F1/20 ,  H05K1/0203

Abstract: A circuit board cooling apparatus is disclosed having a heat spreader device to be thermally coupled with a surface of the circuit board to be cooled. Also, a conforming heat transfer device is disclosed that is thermally and physically coupled with the heat spreader device to conform to a surface contour of the heat spreader device on a first side of the heat transfer device. The cooling apparatus also includes a heat transport device physically attached and thermally coupled with a second side of the heat transfer device.

公开(公告)号：US20230345668A1

公开(公告)日：2023-10-26

申请号：US18345213

申请日：2023-06-30

Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP

Inventor： Harvey J. Lunsman ,  Ernesto Ferrer ,  John Franz

IPC: H05K7/20

CPC classification number: H05K7/20254 ,  H05K7/20336

Abstract: Example implementations relate to an electronic system providing thermal management of a removable device when connected to a host device of the electronic system including a receptacle, and a heat transfer device having first and second portions. The host device has a cooling component. The removable device having a heat spreader, is detachably coupled to the host device. The receptacle having spring fingers, is coupled to one of the cooling component or the heat spreader. The first portion is coupled to one of the cooling component or the heat spreader, and the second portion is protruded outwards. When the removable device is connected to the host device, the second portion extends through the receptacle such that the spring fingers establish direct thermal interface with the second portion to allow waste-heat to transfer between the heat transfer device and one of the cooling component or the heat spreader via the receptacle.

公开(公告)号：US11662126B2

公开(公告)日：2023-05-30

申请号：US17350493

申请日：2021-06-17

Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP

Inventor： John Franz ,  Harvey J. Lunsman ,  Benjamin Kufahl

IPC: F25B45/00 ,  H05K7/20 ,  F25B41/24 ,  F25B41/31 ,  F25B49/00

CPC classification number: F25B45/00 ,  F25B41/24 ,  F25B41/31 ,  F25B49/005 ,  H05K7/20272 ,  F25B2345/002 ,  F25B2345/003 ,  F25B2500/222 ,  F25B2600/2513

Abstract: Example implementations relate to a leak mitigation (LM) system. The LM system may include a collection tank, a first valve unit coupled to the collection tank, a second valve unit coupled to a cooling loop carrying a coolant, and an LM pump coupled between the first valve unit and the second valve unit. Moreover, the leak mitigation system may also include a controller operatively coupled to the first valve unit, the second valve unit, and the LM pump to operate, in an event of a leak of the coolant from the cooling loop, the first valve unit, the second valve unit, and the LM pump to transfer at least a portion of the coolant to the collection tank from the cooling loop via the second valve unit and the first valve unit.