Abstract:
PURPOSE:To easily control the line width of a fine dimension by increasing the content of chromium fluoride contd. in a shading film according to far departing from the main surface of a translucent substrate, thereby shortening the over-etching time of the shading film. CONSTITUTION:The content of the chromium fluoride contd. in the shading film increases according to far departing from the main surface of the translucent substrate. And, the chromium fluoride content increases stepwisely or continuously according to far departing from the main surface of said substrate. Namely, the more the chromium fluoride content of the shading film increases, the more the etching amount per unit time (an etching speed) of the shading film composed of the chromium contg. the chromium fluoride decreases. Thus, the line width of the fine dimension is easily controlled by shortening the over- etching time, and the photomask can be produced by decreasing the residual amount of the chromium.
Abstract:
PURPOSE:To permit secure formation of a pattern having desired line width by forming a thin film contg. chromium and at least one among fluoride, oxide, and nitride of chromium on a principal surface of a light transmittive substrate. CONSTITUTION:A photomask blank 1 comprises a light transmittive substrate 2 and a see-through thin film 3 coated on a principal surface of the light transmittive surface 2. The see-through thin film 3 contains chromium and nitride, oxide, or fluoride of chromium. Further, a photomask 4 comprises a light transmittive substrate 2 consisting of quartz glass and a see-through thin film pattern 3a formed on a principal surface of the light transmittive substrate 2. The see-through thin film pattern 3a is obtd. by patternizing selectively the see-through thin film 3 of a photomask blank 1 and contains chromium and nitride, oxide, or fluoride of chromium. By this constitution, the etching speed of the thin film is made slower and a pattern having a desired line width is obtd. easily.
Abstract:
PURPOSE:To obtain antistatic effect and reflection preventive effect of a photomask prepd. by plasma etching using chlorine or similar gas by providing a light shielding metallic film of a specific element on a glass base plate and forming a reflection preventive film of an oxide of a specified element thereon. CONSTITUTION:A light shielding metallic film 3 is formed on a glass base plate 1 using Si, Ge, Sb, or Au. A reflection preventive film 4 is formed further on the film 3 using an oxide of Si, Ge, or Sb. On one hand, a transparent conductive film 2 is formed using an oxide of Fe, In, Re, Pb, Zn, Ni, or Co between the base plate 1 and the film 3. The photomask in accordance with this constitution is easily etched at the film 3 and the film 4 by the plasma etching using chlorine or similar gas, but the conductive film 2 has resistance to the etching. Easily etchable films 3 and 4 serve as masking material, and hardly etchable conductive film 2 has antistatic effect, therefore, the breakage due to electric charge and multiple reflection are both prevented.
Abstract:
PROBLEM TO BE SOLVED: To provide a phase shift mask blank capable of being formed into a cross-sectional shape effectively exhibiting a phase effect by wet etching.SOLUTION: Provided is a phase shift mask blank comprising: a transparent substrate; an optical semi-permeable film formed on the main surface of the transparent substrate and composed of a metal silicide based material; and a chromium based material formed on the optical semi-permeable film and composed of a chromium based material. A composition-inclined region P is formed on the boundary between the optical semi-permeable film and the etching mask film, and, in the composition-inclined region P, the ratio of components delaying the wet etching rate of the optical semi-permeable film is stepwise and/or continuously increased toward a depth direction.
Abstract:
PROBLEM TO BE SOLVED: To provide a mask blank and a photomask suitable for processes in a large mask for a FPD (flat panel display) (for example, a resist application method, an etching method and a cleaning method). SOLUTION: The mask blank for manufacturing a FPD device includes at least one of a light-shielding film and a semi-translucent film having a function of adjusting the transmission quantity on a light-transmitting substrate. A root mean square roughness Rq on the film surface of the light-shielding film and the semi-translucent film is not more than 2.0 nm. COPYRIGHT: (C)2010,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a technique capable of easily and accurately adjusting the reflectivity and wavelength dependence of a shielding film in order to properly and rapidly carry out a redesign under transition of exposure wavelength, a resist drawing wavelength and an inspection wavelength or the like in a halftone type phase shift mask. SOLUTION: A halftone type phase shift mask includes on a transparent substrate 1: a translucent film 2 having a predetermined transmittance and phase shift amount for an exposed light; and a shielding film pattern formed on the translucent film pattern. In a method of adjusting the reflectivity and wavelength dependence of the shielding film 3 of the halftone type phase shift mask, an uppermost layer portion of the shielding film 3 is set to be a reflectivity adjusting section 3a containing chromium, carbon, oxygen and nitrogen; and the reflectivity and wavelength dependence of the whole shielding film 3 is adjusted based on a content rate of the nitrogen in the reflectivity adjusting section 3a. COPYRIGHT: (C)2009,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a mask blank and a photomask that suppress hindrance to higher quality of a large-sized mask blank and a mask for future FPD. SOLUTION: The mask blank 10 for manufacturing an FPD device has a light-transmissive substrate 12, a light-transmissive film 14 which is formed on the substrate 12 and transmits light in a wavelength range from the (i) line to the (g) line, and a light shield film 16 which is formed on the light-transmissive film 14 and made of a metal-silicide-based material containing metal and silicon. Here, the light shield film 16 is a film patterned by wet etching and the light-transmissive film 14 is a film of a material having etching selectivity with the light shield film 16. COPYRIGHT: (C)2008,JPO&INPIT