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    INTEGRATED CIRCUIT BOARD
    44.
    发明专利
    INTEGRATED CIRCUIT BOARD 未知

    公开(公告)号：DE3071162D1

    公开(公告)日：1985-11-14

    申请号：DE3071162

    申请日：1980-06-24

    Applicant: IBM

    Inventor： MIERSCH EKKEHARD F ,  ROMANKIW LUBOMYR T

    IPC: H05K1/05 ,  H01L21/60 ,  H01L23/12 ,  H01L23/14 ,  H01L23/52 ,  H01L23/538 ,  H05K1/11 ,  H05K3/32 ,  H05K3/46 ,  H01L23/54 ,  H05K1/00

    Abstract: The board includes two parallel power plates (10, 11) separated by a dielectric layer (not shown). The plates (10, 11) are comprised of two mating metal sheets and are each provided with integral conductive pads (42, 40) and openings (41, 43). After assembly of the two plates (10, 11) and interleaved dielectric layer (not shown), each pad (40, 42) on the two plates is inserted into the coaxial opening (41, 43) in the opposite plate so as to form on the outside surfaces of the two plates (10, 11) areas comprising connection terminals for connecting LSI chips. Each of these area is insulated from the coplanar surrounding metal plate area by the dielectric layer (not shown).

    PERMALLOY THIN FILM ELECTROPLATING SYSTEM
    46.
    发明专利
    PERMALLOY THIN FILM ELECTROPLATING SYSTEM 未知

    公开(公告)号：CA1159792A

    公开(公告)日：1984-01-03

    申请号：CA410149

    申请日：1982-08-25

    Applicant: IBM

    Inventor： CASTELLANI EUGENE E ,  POWERS JOHN V ,  ROMANKIW LUBOMYR T

    IPC: C25D3/56

    Abstract: MAGNETOSTRICTIVE ALLOY THIN FILM ELECTROPLATING METHOD A thin film of low magnetostriction Permalloy* 80% nickel - 20% iron + 1% is electroplated onto a substrate in a bath having a ratio of from 5.8:1 to 23:1 ratio of Ni to Fe ions with a plating current density from 10 ma/cm2 - 200 ma/cm2 when plating in sheet form or an Ni/Fe ratio of from 25:1 to 86:1 with a current density of from 2 ma/cm2 - 60 ma/cm2 when plating through a mask. The fluid in the system is constantly mixed, replenished with fresh iron, acid, and other reagents, is adjusted in temperature and subjected to a continuous laminar regime of mixing. The Fe++ ion concentration required is inverse to the circulation of bath fluid across the substrate. Fresh solution is added to the bath from a reservoir where the above adjustments are made. The inlet for the fresh solution is at the lower end of the plating chamber and directed at a bath mixer which includes a slot through which the fresh solution is directed to optimize mixing in the plating chamber. Complexing agents are avoided. High speed plating is obtained with about 24.4 g/l of Ni++, 1.05 g/l of Fe , 25 g/l of H3BO3, 0.2 g/l of Na saccharin and a pH of 1.5 to 3.6. * Trade Mark

    SELF-BIASED MAGNETORESISTIVE SENSOR
    47.
    发明专利
    SELF-BIASED MAGNETORESISTIVE SENSOR 未知

    公开(公告)号：CA1009749A

    公开(公告)日：1977-05-03

    申请号：CA186207

    申请日：1973-11-20

    Applicant: IBM

    Inventor： BAJOREK CHRISTOPHER H ,  ROMANKIW LUBOMYR T ,  THOMPSON DAVID A

    IPC: G01R33/02 ,  G01R33/09 ,  G11B5/39 ,  G11C11/14 ,  H01F10/08 ,  H01F10/32

    Abstract: 1450204 Magnetic heads INTER. NATIONAL BUSINESS MACHINES CORP 9 Nov 1973 [29 Dec 1972] 52064/73 Heading G5R [Also in Division H3] A magnetic sensing head comprises a unitary structure of a layer of magneto-resistive material 16 for sensing a magnetic field and an adjacent biasing layer 14 of permantly magnetized material to bias the layer 16 magnetically to a required operating range, layers 14 and 16 being in direct contact with one another. The layers 14 and 16 may be co-planar or laminated, with the direction of magnetization, arrow M h , of bias layer 14 parallel or perpendicular to the easy axis and sense current direction, arrow I, of layer 16. Layer 16 is of permalloy material, e.g. Ni-Fe, Ni-Co or Ni-Fe-Co, and the bias layer 14 may be of ferrite. Layers 14,16, may be evaporated, sputtered or electroplated on a substrate 12 with thicknesses of 200 to 2000 and 50 to 400 Šngstroms respectively. The bias may be established due to exchange or epitaxially coupled layers 14, 16, there being direct atomic contact between the layers. In another form the biasing layer 14 is a composite layer comprising exchange or epitaxially coupled films with a magnetically soft film atomically coupled to a magnetically hard film, e.g. Ni-Fe deposited on a Fe 2 O 3 , a Fe 2 O 3 on Ni-Fe, Co or Co-rich Ni-Co on vanadium or chromium, or binary Co-P. In a further form, the bias layer, or two bias layers with the sensing layer therebetween, is or are formed by preferentially oxiding one or both surfaces of a permalloy sensor strip. Alternatively such surfaces may have localized zones with a raised coercivity produced by chemical reaction with chlorides or sulphates, etching to roughen the surfaces, or by selective deposition of materials which exchange couple to the sensing layer. The combined sensing and bias layers may be surrounded by a magnetic shield (8) in a record head, Fig. 1 (not shown). The head may be used for reading tapes, discs, magnetic ink, or sheets capable of generating and transporting magnetic bubble domains.

    49.
    发明专利
    未知

    公开(公告)号：FR2298845A1

    公开(公告)日：1976-08-20

    申请号：FR7540377

    申请日：1975-12-23

    Applicant: IBM

    Inventor： ROMANKIW LUBOMYR T ,  SLUSARCZUK MARKO M G ,  THOMPSON DAVID A

    IPC: G11C11/08 ,  G02F1/09 ,  G02F1/167 ,  G09F9/37 ,  G11C19/02 ,  G11C19/08 ,  G09F13/24 ,  G09X ,  G11C11/14

    Abstract: A magnetizable fluid which serves as a display liquid and which includes a suspension of colloidal magnetic particles is used in a display device. The magnetic fluid is opaque to provide optical contrast. A host liquid is substantially immiscible with the display liquid. The display liquid is carried in a reservoir section which is distributed about the periphery of a display field in the reservoir. Each propagation line of the display field is provided with a bubble generator, which passes bubbles by the input end of each line. A bubble switch coil draws selected bubbles across a gap to reach the associated propagation line in response to a signal impressed on the coil. A uniform rotating magnetic field is provided by a permanent magnet beneath the display or by orthogonal magnetic coils.

    PLATING SMALL DIAMETER THROUGH-HOLES WITH LARGE (L/UDS) LENGTH TO DIAMETER RATIO
    50.
    发明专利
    PLATING SMALL DIAMETER THROUGH-HOLES WITH LARGE (L/UDS) LENGTH TO DIAMETER RATIO 未知

    公开(公告)号：CA976667A

    公开(公告)日：1975-10-21

    申请号：CA171135

    申请日：1973-05-08

    Applicant: IBM

    Inventor： OLSEN JUDITH D ,  ROMANKIW LUBOMYR T

    IPC: H05K3/40 ,  C25D5/00 ,  C25D5/16 ,  C25D7/00 ,  C25D7/04 ,  H05K1/03 ,  H05K3/42

    Abstract: 1422466 Electro-plating fine holes INTERNATIONAL BUSINESS MACHINES CORP 15 March 1973 [9 June 1972] 12475/73 Heading C7B A method of electro-plating the surface of a hole extending through a substrate comprises providing a hole extending through the substrate which hole has a tapering cross-sectional area, and electroplating the hole, e.g. with copper whilst flowing electrolyte therethrough in the direction of decreasing cross-sectional area. Alternatively the hole may taper from both surfaces of the substrate towards the centre thereof; the direction of electrolyte through the hole being periodically reversed. Electro-deposition may be continued to substantially fill the hole with deposited metal. The initial hole may be formed using a laser or electron beam, and optionally forming an etchant through the hole so formed. A non-conductive substrate may be rendered conductive by electroless plating, or by thermal decomposition of an organo-metallic complex. The apparatus shown allows electroplating of holes 2 in substrate 17 positioned as cathode between anodes 16 of Cu or Pt mesh, electrolyte being pumped through inlet/outlet ports 14, 15 either continuously or in alternate directions according to the shape of the holes to be plated. After plating electrolyte may be removed from the hole with compressed air and rinsing with water, alcohol or acetone. The substrate coated may be of alumina or sapphire.

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