Copolymer and radiation-sensitive resin composition using the same
    41.
    发明专利
    Copolymer and radiation-sensitive resin composition using the same 有权
    使用该共聚物和辐射敏感性树脂组合物

    公开(公告)号:JP2005232396A

    公开(公告)日:2005-09-02

    申请号:JP2004045830

    申请日:2004-02-23

    Abstract: PROBLEM TO BE SOLVED: To provide a radiation-sensitive resin composition which, when used for a chemically amplified resist sensitive to a radiation, especially electron beams, exhibits excellence in resolution, sensitivity, and line edge roughness and to provide a novel copolymer useful as the resin composition of the composition.
    SOLUTION: The copolymer has as a copolymer component repeating units containing a protective group represented by formula (1) and has a polystyrene-equivalent weight-average molecular weight of 3,000 to 100,000. In formula (1), R
    1 is a hydrogen atom or a 1 to 4C alkyl group; R
    2 and R
    3 are each a hydrogen atom or a monovalent organic group, provided that at least either of them is a monovalent organic group; and l is an integer of 1 to 3.
    COPYRIGHT: (C)2005,JPO&NCIPI

    Abstract translation: 要解决的问题:提供一种辐射敏感性树脂组合物,当用于对辐射敏感的化学放大抗蚀剂,特别是电子束时,表现出优异的分辨率,灵敏度和线边缘粗糙度,并提供一种新颖的 共聚物可用作组合物的树脂组合物。 解决方案:共聚物具有作为共聚物组分的重复单元,其含有由式(1)表示的保护基,其聚苯乙烯换算的重均分子量为3,000至100,000。 在式(1)中,R 1是氢原子或1至4个烷基; R 2 和R 3 各自为氢原子或一价有机基团,条件是它们中的至少一个为一价有机基团; 并且l为1〜3的整数。(C)2005,JPO&NCIPI

    RADIATION SENSITIVE COMPOSITION
    42.
    发明专利

    公开(公告)号:JP2002099088A

    公开(公告)日:2002-04-05

    申请号:JP2000292672

    申请日:2000-09-26

    Abstract: PROBLEM TO BE SOLVED: To provide a radiation sensitive composition effectively responding to electronic beams and excellent in roughness, etching resistance, and sensitivity and capable of forming a minute pattern highly accurately and stably. SOLUTION: This radiation sensitive composition contains the following (A) and (B): (A) a compound represented by formula (1) (Wherein, R1, R2 and R3 each independently represent an acid-dissociable functional group selected from the group consisting of hydrogen atom or a substituted methyl group, a 1-substituted ethyl group, a 1-substituted-n-propyl group, a 1-branched alkyl group, a silyl group, an acyl group, a 1-substituted alkoxymethyl group and a cyclic acid-dissociable group. At least one of R1, R2 and R3 is an acid- dissociable functional group). (B) a compound generating an acid by irradiation with radioactive rays.

    NEGATIVE TYPE RADIATION SENSITIVE RESIN COMPOSITION

    公开(公告)号:JP2001324811A

    公开(公告)日:2001-11-22

    申请号:JP2000142750

    申请日:2000-05-16

    Applicant: JSR CORP

    Abstract: PROBLEM TO BE SOLVED: To provide a negative type radiation sensitive resin composition suitable for use as a chemical amplification type negative type resist developable with an alkali developing solution having the conventional concentration, capable of forming a high resolution rectangular resist pattern in an ordinary line-and- space pattern (1L1S) and excellent also in focus latitude. SOLUTION: The negative type radiation sensitive resin composition contains (A) an alkali-soluble resin having a phenolic hydroxyl group, (B) a radiation sensitive acid generating agent and (C) a compound having an α- hydroxyisopropyl group and/or an acid dissociable derivative of an α- hydroxyisopropyl group. The component (C) is typified by 1,3-bis(α- hydroxyisopropyl)benzene, 4,4'-bis(α-hydroxyisopropyl)biphenyl or 2,6-bis(α- hydroxyisopropyl)naphthalene, and the like.

    NEGATIVE TYPE RADIATION SENSITIVE RESIN COMPOSITION

    公开(公告)号:JP2001183832A

    公开(公告)日:2001-07-06

    申请号:JP36757599

    申请日:1999-12-24

    Applicant: JSR CORP

    Abstract: PROBLEM TO BE SOLVED: To provide a negative type radiation sensitive resin composition developable with an alkali developing solution having a normal concentration, capable of forming a resist pattern having high resolution and a rectangular cross-sectional shape as an ordinary line-and-space pattern and excellent also in sensitivity, developability, dimensional faithfulness, etc. SOLUTION: The negative type radiation sensitive resin composition contains (A) an alkali-soluble resin containing at least one copolymer selected from a hydroxystyrene/styrene copolymer having 65-90 mol% hydroxystyrene unit content and a hydroxystyrene/α-methylstyrene copolymer having 65-90 mol% hydroxystyrene unit content, (B) a radiation sensitive acid generating agent containing a hydroxyl-containing onium salt compound and (C) a crosslinking agent containing an N-(alkoxymethyl)glycol uryl compound.

    RESIST PATTERN FORMING METHOD
    45.
    发明专利

    公开(公告)号:JP2000258912A

    公开(公告)日:2000-09-22

    申请号:JP5980899

    申请日:1999-03-08

    Applicant: JSR CORP

    Abstract: PROBLEM TO BE SOLVED: To reduce film thickness after wet development by a relatively large value and to form a resist pattern free from development defects. SOLUTION: The composition of a chemically amplified positive radiation sensitive resin composition is controlled in such a way that the film thickness of the unexposed part of a resist film comprising the radiation sensitive resin composition is reduced after wet development from the film thickness before wet development by 100-400 Å.

    RADIOSENSITIVE RESIN COMPOSITION
    46.
    发明专利

    公开(公告)号:JPH11352677A

    公开(公告)日:1999-12-24

    申请号:JP16225698

    申请日:1998-06-10

    Applicant: JSR CORP

    Abstract: PROBLEM TO BE SOLVED: To provide a radiosensitive resin composition containing a radiosensitive acid generating agent which has high transmissivity to far ultraviolet ray particularly such as KRF excimer laser, is excellent in sensitivity, resolution performance and pattern shape and low in sublimation, and a resin having a specific acetal group. SOLUTION: The composition contains (A) the radiosensitive acid generating agent expressed by formula (1) (in the formula, X represents an aliphatic, alicyclic or aromatic 2-valent group and R represents a (cyclo) alkyl group or aryl group) and (B) the resin represented by 4-hydroxystyrene/4-(1'-ethoxy ethoxy) styrene copolymer or 4-hydroxystyrene/4-(1'-ethoxyethoxy) styrene/4-t-butoxy styrene copolymer or another resin represented by 4-hydroxystyrene/4-t-butoxy styrene copolymer.

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