-
公开(公告)号：MY137560A
公开(公告)日：2009-02-27
申请号：MYPI20043658
申请日：2004-09-08
Applicant: KAO CORP
Inventor： OSAWA KIYOTERU , KITAYAMA HIROAKI , HAGIHARA TOSHIYA
Abstract: A POLISHING KIT FOR A MAGNETIC DISK CONTAINING (A) A SLURRY CONTAINING AN ALUMINA, (B) AN OXIDIZING AGENT SOLUTION CONTAINING AN OXIDIZING AGENT, AND (C) AN ACID AGENT SOLUTION CONTAINING AN ACID; A POLISHING KIT FOR A MAGNETIC DISK CONTAINING (A) A LURRY CONTAINING AN ALUMINA, AND (D) AN ADDITIVE SOLUTION CONTAINING AN OXIDIZING AGENT AND AN INORGANIC ACID; AND A POLISHING KIT FOR A MAGNETIC DISK CONTAINING (A) A SLURRY CONTAINING AN ALUMINA, AND (C) AN ACID AGENT SOLUTION CONTAINING AN ACID, WHEREIN THE POLISHING KIT IS USED WITH AN OXIDIZING AGENT SOLUTION (B) CONTAINING AN OXIDIZING AGENT; AND A POLISHING PROCESS FOR A MAGNETIC DISK SUBSTRATE, INCLUDING THE STEPS OF FEEDING A LIQUID MIXTURE CONTAINING COMPONENTS OF A SPECIFIED POLISHING KIT TO A SPACE BETWEEN THE MAGNETIC DISK SUBSTRATE AND A POLISHING CLOTH; AND POLISHING THE MAGNETIC DISK SUBSTRATE WITH THE LIQUID MIXTURE. THE POLISHING COMPOSITION KIT CAN BE SUITABLY USED FOR THE MANUFACTURE OF HIGH-QUALITYMAGNETIC DISK SUBSTRATES SUCH AS HARD DISKS.
-
公开(公告)号：MY134679A
公开(公告)日：2007-12-31
申请号：MYPI20034644
申请日：2003-12-04
Applicant: KAO CORP
Inventor： OSHIMA YOSHIAKI , NISHIMOTO KAZUHIKO , HAGIHARA TOSHIYA
Abstract: A POLISHING COMPOSITION FOR A SUBSTRATE FOR MEMORY HARD DISK COMPRISING WATER AND SILICA PARTICLES, WHEREIN THE SILICA PARTICLES HAVE A PARTICLE SIZE DISTRIBUTION IN WHICH THE RELATIONSHIP OF A PARTICLE SIZE (R) AND A CUMULATIVE VOLUME FREQUENCY (V) IN A GRAPH OF PARTICLE SIZE – CUMULATIVE VOLUME FREQUENCY OBTAINED BY PLOTTING A CUMULATIVE VOLUME FREQUENCY (%) OF THE SILICA PARTICLES COUNTED FROM A SMALL PARTICLE SIZE SIDE AGAINST A PARTICLE SIZE (NM) OF THE SILICA PARTICLES SATISFIES THE ABOVE FORMULA (1) AND THE ABOVE FORMULA (2), AND WHEREIN A PARTICLE SIZE AT 90% OF A CUMULATIVE VOLUME FREQUENCY (D90) IS WITHIN THE RANGE OF 65 NM OR MORE AND LESS THAN 105 NM. BY USING THE POLISHING COMPOSITION OF THE PRESENT INVENTION, THERE CAN BE EFFICIENTLY MANUFACTURED AN NI-P PLATED SUBSTRATE FOR A DISK POLISHED TO HAVE AN EXCELLENT SURFACE SMOOTHNESS, IN WHICH THE MICROPITS ARE EFFECTIVELY REDUCED.(FIG 1)
-
公开(公告)号：MY129818A
公开(公告)日：2007-05-31
申请号：MYPI20042120
申请日：2004-06-02
Applicant: KAO CORP
Inventor： OSHIMA YOSHIAKI , NISHIMOTO KAZUHIKO , SUENAGA KENICHI , HAGIHARA TOSHIYA
Abstract: A METHOD FOR MANUFACTURING A SUBSTRATE, A POLISHING PROCESS FOR A SUBSTRATE, A METHOD OF REDUCING MICROWAVINESS FOR A SUBSTRATE,E ACH INCLUDING THE STEP OF POLISHING A SUBSTRATE TO BE POLISHED WITH A POLISHING COMPOSITION CONTAINING AN ABRASIVE AND WATER WITH A POLISHING PAD OF WHICH SURFACE MEMBER HAS AN AVERAGE PORE SIZE OF FROM 1 TO 35 µM;AND A METHOD OF REDUCING SCRATCHES FOR A SUBSTRATE, COMPRISING THE STEP OF POLISHING A SUBSTRATE TO BE POLISHED WITH A POLISHING COMPOSITION COMPRISING AN ABRASIVE, AN OXIDIZING AGENT, AN ACID, A SALT THEREOF, OR A MIXTURE THEREOF AND WATER, WITH A POLISHING PAD OF WHICH SURFACE MEMBER HAS AN AVERAGE PORE SIZE OF FROM 1 TO 35 µM. THE METHOD FOR MANUFACTURING A SUBSTRATE CAN BE USED FOR FINISH POLISHING OF A MEMORY HARD DISK OR FOR POLISHING OF A SEMICONDUCTOR ELEMENT.
-
公开(公告)号：GB2395486B
公开(公告)日：2006-08-16
申请号：GB0324148
申请日：2003-10-15
Applicant: KAO CORP
Inventor： HAGIHARA TOSHIYA , FUJII SHIGEO
Abstract: A polishing composition comprising an abrasive, an acid and/or a salt thereof, and water, wherein copper (Cu) is contained in an amount of 1 mg or less per kg of the polishing composition; a process for reducing a surface defect of a substrate comprising applying to a substrate or a polishing pad a polishing composition comprising an abrasive, an acid and/or a salt thereof, and water, wherein copper (Cu) is contained in an amount of 1 mg or less per kg of the polishing composition fed to the substrate or the polishing pad; and a process for manufacturing a substrate comprising a polishing step comprising applying to a substrate or a polishing pad the above polishing composition. The polishing composition of the present invention is used for polishing a substrate for precision parts such as substrates for magnetic recording media such as magnetic disks, optical disks, opto-magnetic disks, and the like; photomask substrates, optical lenses, optical mirrors, optical prisms and semiconductor substrates, concretely polishing a substrate for memory hard disks, and especially finish polishing.
-
公开(公告)号：GB2395486A
公开(公告)日：2004-05-26
申请号：GB0324148
申请日：2003-10-15
Applicant: KAO CORP
Inventor： HAGIHARA TOSHIYA , FUJII SHIGEO
IPC: C09G1/02
Abstract: A polishing composition comprising an abrasive, an acid and/or a salt thereof, and water, wherein copper (Cu) is contained in an amount of 1 mg or less per kg of the polishing composition; a process for reducing a surface defect of a substrate comprising applying to a substrate or a polishing pad a polishing composition comprising an abrasive, an acid and/or a salt thereof, and water, wherein copper (Cu) is contained in an amount of 1 mg or less per kg of the polishing composition fed to the substrate or the polishing pad; and a process for manufacturing a substrate comprising a polishing step comprising applying to a substrate or a polishing pad the above polishing composition. The polishing composition of the present invention is used for polishing a substrate for precision parts such as substrates for magnetic recording media such as magnetic disks, optical disks, opto-magnetic disks, and the like; photomask substrates, optical lenses, optical mirrors, optical prisms and semiconductor substrates, concretely polishing a substrate for memory hard disks, and especially finish polishing.
-
Patent Agency Ranking
公开(公告)号：GB2393447A
公开(公告)日：2004-03-31
申请号：GB0317224
申请日：2003-07-23
Applicant: KAO CORP
Inventor： KITAYAMA HIROAKI , FUJII SHIGEO , OSHIMA YOSHIAKI , HAGIHARA TOSHIYA
IPC: C09G1/02
Abstract: A polishing composition comprising an abrasive, water and an organic acid or a salt thereof, wherein the composition has a specified viscosity of from 1.0 to 2.0 mPa Ò s at a shearing rate of 1500 s and 25{C; and a roll-off reducing agent comprising a BrÎnsted acid or a salt thereof, having an action of lowering viscosity so that the amount of viscosity lowered is 0.01 mPa Ò s or more, wherein the amount of viscosity lowered is expressed by the following equation: (Amount of Viscosity Lowered) = (Viscosity of Standard Polishing Composition) - (Viscosity of Roll-Off Reducing Agent-Containing Polishing Composition), wherein the standard polishing composition is prepared which comprises 20 parts by weight of an abrasive, said abrasive being high-purity alumina having Al2O3 purity of 98.0% by weight or more composed of a -type co-random crystal, 1 part by weight of citric acid, and 79 parts by weight of water; the roll-off reducing agent-containing polishing composition is prepared which comprises 20 parts by weight of an abrasive, said abrasive being high-purity alumina having Al2O3 purity of 98.0% by weight or more composed of a -type co-random crystal, 1 part by weight of citric acid, 78.9 parts by weight of water and 0.1 parts by weight of a roll-off reducing agent; and the viscosity is a viscosity at a shearing rate of 1500 s and 25{C.
-
公开(公告)号：DE69625088D1
公开(公告)日：2003-01-09
申请号：DE69625088
申请日：1996-09-20
Applicant: KAO CORP
Inventor： SAKAI AKIMITSU , HAGIHARA TOSHIYA
IPC: C07C69/28 , C07C69/30 , C07C69/33 , C09K5/04 , C10M105/38 , C10M171/00
Abstract: Ester compounds possessing heat stability in the presence of a metal and prepared from di- to nona- hydric hindered alcohols having 5 to 15 carbon atoms and saturated aliphatic monocarboxylic acids having 3 to 20 carbon atoms or derivatives thereof, characterized in that the proportion of the branched carboxylic acids or derivatives thereof in all the carboxylic acids or derivatives thereof is at least 50 % by mole and the ester compounds have a hydroxyl value of at most 30 mg KOH/g and an acid value after the sealed tube test of at most 10 mg KOH/g: and a lubricating oil composition characterized by containing at least 20 % by weight of the ester compounds. Thus the invention provides ester compounds possessing excellent heat stability in the presence of a metal, and a lubricating oil composition and a hydraulic fluid composition for refrigerators, each composed mainly of the ester compounds.
-
公开(公告)号：DE69329667T2
公开(公告)日：2001-03-15
申请号：DE69329667
申请日：1993-07-02
Applicant: KAO CORP
Inventor： HAGIHARA TOSHIYA , SAKAI AKIMITSU
IPC: C09K5/04 , C10M105/38 , C10M171/00 , C10N20/02 , C10N30/00 , C10N30/08 , C10N40/30
Abstract: The present invention is directed to a working fluid composition for a refrigerating machine which contains difluoromethane and a refrigeration oil. An ester formed between (a) an aliphatic polyhydric alcohol having a carbon number of 2 to 12; and (b) a saturated aliphatic monocarboxylic acid having a carbon number of 4 to 9 or a derivative thereof, the ratio of the number of acyl groups having a branched chain or branched chains to the number of the entire acyl groups in the ester being not less than 95%, is used as a base oil of the refrigeration oil. The working fluid composition for refrigerating machine of the present invention is excellent not only in compatibility, lubricity, and electric insulating property but also in thermal stability as compared to the conventional products.
-
公开(公告)号：DE69221553T2
公开(公告)日：1997-12-11
申请号：DE69221553
申请日：1992-06-25
Applicant: KAO CORP
Inventor： SAWADA HIROKI , HAGIHARA TOSHIYA , KOBAYASHI YUICHIRO , SAKAI AKIMITSU , SUZUKI HIDEO , TANAKA TOSHIHIRO , NAGUMO HIROSHI , YOKORA YUKINAGA
IPC: C09K5/04 , C10M105/20 , C10M171/00
Abstract: A working fluid composition for use in a refrigeration system which comprises a refrigerating oil comprising a compound having one or more ketone groups in the molecular structure as a base oil and a hydrofluorocarbon.
-
公开(公告)号：ES2106143T3
公开(公告)日：1997-11-01
申请号：ES92305841
申请日：1992-06-25
Applicant: KAO CORP
Inventor： SAWADA HIROKI , HAGIHARA TOSHIYA , KOBAYASHI YUICHIRO , SAKAI AKIMITSU , SUZUKI HIDEO , TANAKA TOSHIHIRO
IPC: C09K5/04 , C10M105/20 , C10M171/00
Abstract: A working fluid composition for use in a refrigeration system which comprises a refrigerating oil comprising a compound having one or more ketone groups in the molecular structure as a base oil and a hydrofluorocarbon.
-
-
-
-
-
-
-
-
-
Search Results
68
records
(took 0.024 seconds)
