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公开(公告)号：US08875390B2
公开(公告)日：2014-11-04
申请号：US13663274
申请日：2012-10-29
Applicant: Kinsus Interconnect Technology Corp.
Inventor： Ting-Hao Lin , Yu-Te Lu , De-Hao Lu
IPC: H01K3/00
CPC classification number: H05K3/4682 , H05K1/0271 , H05K2201/09136 , H05K2201/2018 , H05K2203/0152 , H05K2203/0376 , Y10T29/49126 , Y10T29/49128 , Y10T29/49155 , Y10T29/4916
Abstract: A method of manufacturing a laminate circuit board which includes the sequential steps of metalizing the substrate to form the base layer, forming the first circuit metal layer, forming at least one insulation layer and at least one second circuit metal layer interleaved, removing the substrate, forming the support frame and forming the solder resist is disclosed. The laminate circuit board has a thickness less than 150 μm. The support frame which does not overlap the first circuit metal layer is formed on the edge of the base layer by the pattern transfer process after the substrate is removed. The base layer formed of at least one metal layer is not completely removed. The support frame provides enhanced physical support for the entire laminate circuit board without influence on the electrical connection of the circuit in the second circuit metal layer, thereby solving the warping problem.
Abstract translation: 一种叠层电路板的制造方法，其特征在于，包括使所述基板金属化以形成所述基底层的顺序步骤，形成所述第一电路金属层，形成至少一个绝缘层和交替插入的至少一个第二电路金属层，去除所述基板， 公开了形成支撑框架并形成阻焊剂的方法。 层叠电路板的厚度小于150μm。 在去除衬底之后，通过图案转印工艺在基层的边缘上形成不与第一电路金属层重叠的支撑框架。 由至少一个金属层形成的基底层没有被完全去除。 支撑框架对整个层叠电路板提供增强的物理支撑，而不影响第二电路金属层中的电路的电连接，从而解决翘曲问题。
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公开(公告)号：US20140290057A1
公开(公告)日：2014-10-02
申请号：US13853325
申请日：2013-03-29
Applicant: KINSUS INTERCONNECT TECHNOLOGY CORP.
Inventor： Ting-Hao Lin , Yu-Te Lu , De-Hao Lu
IPC: H05K3/46
CPC classification number: H05K3/4647 , H05K3/4038 , H05K2203/025 , H05K2203/063 , Y10T29/49155
Abstract: Disclosed is a method of manufacturing a stacked multilayer structure, including the steps of forming a first circuit layer with bumps on a substrate, punching an aluminum plate to form recesses corresponding to the bumps, forming openings in a plastic film including a glass fiber layer corresponding to the bumps, pressing the aluminum plate, the plastic film and the substrate, removing the aluminum plate, polishing to level the resulting surface, forming a second circuit layer connected to the first circuit layer, and finally removing the substrate to form the stacked multilayer structure. Because the glass fiber layer in the plastic film is not exposed after polishing, the thickness of the dielectric layer is uniform and the reliability of the circuit layer is improved so as to increase the yield.
Abstract translation: 公开了一种制造堆叠多层结构的方法，包括以下步骤：在基板上形成具有凸块的第一电路层，冲压铝板以形成与凸块相对应的凹部，在包括玻璃纤维层的塑料膜中形成开口 对铝合金板，塑料薄膜和基板进行压制，去除铝板，进行抛光以使所得表面平坦化，形成连接到第一电路层的第二电路层，最后移除基板以形成叠层多层 结构体。 由于塑料膜中的玻璃纤维层在研磨后不露出，所以介电层的厚度均匀，电路层的可靠性得以提高，从而提高产率。
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公开(公告)号：US08766102B2
公开(公告)日：2014-07-01
申请号：US13663303
申请日：2012-10-29
Applicant: Kinsus Interconnect Technology Corp.
Inventor： Ting-Hao Lin , Yu-Te Lu , De-Hao Lu
CPC classification number: H05K1/056 , H01L21/4857 , H01L21/486 , H01L23/13 , H01L23/49822 , H01L23/49827 , H01L23/49894 , H01L2924/0002 , H05K1/0204 , H05K2201/029 , H05K2201/0323 , H05K2201/09054 , H05K2203/0323 , H05K2203/0384 , H05K2203/063 , H01L2924/00
Abstract: A chip support board structure which includes at least a metal substrate, a block layer, a paddle, an insulation layer, a circuit layer and a solder resist is disclosed. The circuit layer connects with the paddle. The material of the block layer is different from that of the metal substrate and the block layer is provided between the metal substrate and the paddle such that the shape and the depth of the paddle is maintained constant and the problem of different depth and easily peeling off is avoided, thereby improving the yield rate of the chip support board.
Abstract translation: 公开了至少包括金属基板，阻挡层，桨，绝缘层，电路层和阻焊剂的芯片支撑板结构。 电路层与桨连接。 阻挡层的材料与金属基板的材料不同，并且在金属基板和板之间设置阻挡层，使得桨的形状和深度保持恒定，并且具有不同深度并容易剥离的问题 从而提高了芯片支撑板的成品率。
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公开(公告)号：US20140116757A1
公开(公告)日：2014-05-01
申请号：US13663303
申请日：2012-10-29
Applicant: KINSUS INTERCONNECT TECHNOLOGY CORP.
Inventor： Ting-Hao Lin , Yu-Te Lu , De-Hao Lu
IPC: H05K1/05
CPC classification number: H05K1/056 , H01L21/4857 , H01L21/486 , H01L23/13 , H01L23/49822 , H01L23/49827 , H01L23/49894 , H01L2924/0002 , H05K1/0204 , H05K2201/029 , H05K2201/0323 , H05K2201/09054 , H05K2203/0323 , H05K2203/0384 , H05K2203/063 , H01L2924/00
Abstract: A chip support board structure which includes at least a metal substrate, a block layer, a paddle, an insulation layer, a circuit layer and a solder resist is disclosed. The circuit layer connects with the paddle. The material of the block layer is different from that of the metal substrate and the block layer is provided between the metal substrate and the paddle such that the shape and the depth of the paddle is maintained constant and the problem of different depth and easily peeling off is avoided, thereby improving the yield rate of the chip support board.
Abstract translation: 公开了至少包括金属基板，阻挡层，桨，绝缘层，电路层和阻焊剂的芯片支撑板结构。 电路层与桨连接。 阻挡层的材料与金属基板的材料不同，并且在金属基板和板之间设置阻挡层，使得桨的形状和深度保持恒定，并且具有不同深度并容易剥离的问题 从而提高了芯片支撑板的成品率。
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公开(公告)号：US20140115889A1
公开(公告)日：2014-05-01
申请号：US13663274
申请日：2012-10-29
Applicant: KINSUS INTERCONNECT TECHNOLOGY CORP.
Inventor： Ting-Hao Lin , Yu-Te Lu , De-Hao Lu
IPC: H05K3/10
CPC classification number: H05K3/4682 , H05K1/0271 , H05K2201/09136 , H05K2201/2018 , H05K2203/0152 , H05K2203/0376 , Y10T29/49126 , Y10T29/49128 , Y10T29/49155 , Y10T29/4916
Abstract: A method of manufacturing a laminate circuit board which includes the sequential steps of metalizing the substrate to form the base layer, forming the first circuit metal layer, forming at least one insulation layer and at least one second circuit metal layer interleaved, removing the substrate, forming the support frame and forming the solder resist is disclosed. The laminate circuit board has a thickness less than 150 μm. The support frame which does not overlap the first circuit metal layer is formed on the edge of the base layer by the pattern transfer process after the substrate is removed. The base layer formed of at least one metal layer is not completely removed. The support frame provides enhanced physical support for the entire laminate circuit board without influence on the electrical connection of the circuit in the second circuit metal layer, thereby solving the warping problem.
Abstract translation: 一种叠层电路板的制造方法，其特征在于，包括使所述基板金属化以形成所述基底层的顺序步骤，形成所述第一电路金属层，形成至少一个绝缘层和交替插入的至少一个第二电路金属层，去除所述基板， 公开了形成支撑框架并形成阻焊剂的方法。 层叠电路板的厚度小于150μm。 在去除衬底之后，通过图案转印工艺在基层的边缘上形成不与第一电路金属层重叠的支撑框架。 由至少一个金属层形成的基底层没有被完全去除。 支撑框架对整个层叠电路板提供增强的物理支撑，而不影响第二电路金属层中的电路的电连接，从而解决翘曲问题。
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Patent Agency Ranking
公开(公告)号：US20190387631A1
公开(公告)日：2019-12-19
申请号：US16555261
申请日：2019-08-29
Applicant: Kinsus Interconnect Technology Corp.
Inventor： Ting-Hao Lin , Chiao-Cheng Chang , Yi-Nong Lin
Abstract: A manufacturing method of a double layer circuit board comprises forming a connecting pillar on a first circuit, wherein the connecting pillar comprises a first end, connected to the first circuit, and a second end, opposite to the first end; forming a substrate on the first circuit and the connecting pillar; drilling the substrate to expose a portion of the second end of the connecting pillar, wherein the other portion of the second end of the connecting pillar is covered by the substrate; and forming a second circuit on the substrate and the portion of the second end of the connecting pillar, wherein an area of the first end connected to the first circuit layer is greater than an area of the portion of the second end connected to the second circuit layer.
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公开(公告)号：US10440836B2
公开(公告)日：2019-10-08
申请号：US15138261
申请日：2016-04-26
Applicant: Kinsus Interconnect Technology Corp.
Inventor： Ting-Hao Lin , Chiao-Cheng Chang , Yi-Nong Lin
Abstract: Provided is a double layer circuit board and a manufacturing method thereof. The double layer circuit board comprises a substrate, a first circuit layer formed on a first surface of the substrate, a second circuit layer formed on a second surface of the substrate, and at least one connecting pillar formed in and covered by the substrate. Each one of the at least one connecting pillar includes a first end connected to the first circuit layer and a second end connected to the second circuit layer. A terminal area of the second end is greater than a terminal area of the first end. Therefore, the second circuit layer is firmly connected to the first circuit layer through the at least one connecting pillar. A yield rate of the double layer circuit board may be increased.
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公开(公告)号：US20190189335A1
公开(公告)日：2019-06-20
申请号：US16285138
申请日：2019-02-25
Applicant: KINSUS INTERCONNECT TECHNOLOGY CORP.
Inventor： Ting-Hao Lin , Chiao-Cheng Chang , Yi-Nong Lin
CPC classification number: H01F27/2804 , H01F2027/2809 , H05K1/0393 , H05K1/113 , H05K1/118 , H05K1/165 , H05K3/4617 , H05K3/4644
Abstract: A buildup board structure incorporating magnetic induction coils and flexible boards is disclosed. The buildup board structure includes at least one first buildup unit or at least one second buildup unit. The first buildup unit includes at least one first buildup body, the second buildup unit includes at least one second buildup body. Any two adjacent buildup bodies are separated by a covering layer provided with a central hole for electrical insulation. All central holes are aligned. Each buildup body includes a plurality of flexible boards, and each flexible board is embedded with a plurality of magnetic induction coils surrounding the corresponding central hole and connected through connection pads. The first and/or second buildup bodies are easily laminated in any order by any number as desired such that the effect of magnetic induction provided by the magnetic induction coils embedded in the buildup board structure are addable to greatly enhance the overall effect of magnetic induction.
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公开(公告)号：US10256028B2
公开(公告)日：2019-04-09
申请号：US15086333
申请日：2016-03-31
Applicant: KINSUS INTERCONNECT TECHNOLOGY CORP.
Inventor： Ting-Hao Lin , Chiao-Cheng Chang , Yi-Nong Lin
Abstract: A buildup board structure incorporating magnetic induction coils and flexible boards is disclosed. The buildup board structure includes at least one first, second and third buildup bodies modular and stackable. Any two adjacent buildup bodies are separated by a covering layer provided with a central hole for electrical insulation. All central holes are aligned. Each buildup body includes a plurality of flexible boards, and each flexible board is embedded with a plurality of magnetic induction coils surrounding the corresponding central hole and connected through connection pads. The first, second and third buildup bodies are easily laminated in any order by any number as desired such that the effect of magnetic induction provided by the magnetic induction coils embedded in the buildup board structure are addable to greatly enhance the overall effect of magnetic induction.
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公开(公告)号：US10039185B2
公开(公告)日：2018-07-31
申请号：US15130724
申请日：2016-04-15
Applicant: Kinsus Interconnect Technology Corp.
Inventor： Ting-Hao Lin , Chiao-Cheng Chang , Yi-Nong Lin
CPC classification number: H05K1/115 , H05K1/113 , H05K3/0047 , H05K3/0079 , H05K3/0094 , H05K3/108 , H05K3/18 , H05K3/429 , H05K3/4644 , H05K3/4647 , H05K2203/054 , Y10T29/49165
Abstract: Provided is a landless multilayer circuit board and a manufacturing method thereof. The manufacturing method includes steps of forming a first circuit on a first substrate, patterning a photoresist layer to form at least one via between the first circuit and a second circuit, forming at least one connecting pillar in the at least one via, removing the photoresist layer, forming a second substrate to cover the at least one connect pillar, and forming the second circuit on the second substrate. The second circuit is connected to the first circuit through the at least one connecting pillar. When the second circuit is formed, the at least one via does not need to be filled, thereby making the second circuit flat.
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