公开(公告)号：US20140001579A1

公开(公告)日：2014-01-02

申请号：US14004816

申请日：2012-02-23

Applicant: Lianjun Liu

Inventor： Lianjun Liu

IPC: B81B3/00 ,  B81C1/00

CPC classification number: B81B3/0018 ,  B81B2201/0264 ,  B81C1/00158 ,  B81C1/00182 ,  G01L9/0073

Abstract: A Micro Electromechanical System (MEMS) pressure sensor may include a first substrate provided with a sensitive diaphragm of a capacitive pressure sensing unit, an electrical connecting layer and a first bonding layer on a surface of the first substrate; and a second substrate provided with an inter-conductor dielectric layer, a conductor connecting layer in the inter-conductor dielectric layer and/or a second bonding layer on a surface of the second substrate. The second substrate is arranged opposite to the first substrate, and the second substrate is fixedly coupled to the first substrate via the first bonding layer and the second bonding layer; a pattern of the first bonding layer is corresponding to a pattern of the second bonding layer, and both the first bonding layer and the second bonding layer are formed of a conductive material.

Abstract translation: 微机电系统（MEMS）压力传感器可以包括设置有电容式压力感测单元的敏感隔膜的第一基板，电连接层和在第一基板的表面上的第一接合层; 以及设置有导体间介电层的第二基板，导体间电介质层中的导体连接层和/或第二基板的表面上的第二接合层。 第二基板与第一基板相对设置，第二基板经由第一接合层和第二接合层固定地耦合到第一基板; 第一接合层的图案对应于第二接合层的图案，并且第一接合层和第二接合层都由导电材料形成。

公开(公告)号：US08461656B2

公开(公告)日：2013-06-11

申请号：US12827848

申请日：2010-06-30

Applicant: Woo Tae Park ,  Lisa H. Karlin ,  Lianjun Liu ,  Heinz Loreck ,  Hemant D. Desai

Inventor： Woo Tae Park ,  Lisa H. Karlin ,  Lianjun Liu ,  Heinz Loreck ,  Hemant D. Desai

IPC: H04R23/00

CPC classification number: B81C1/00182 ,  B81B2201/0235 ,  B81C2203/0792 ,  G01P15/0802 ,  G01P15/125 ,  H01L29/84

Abstract: A device structure is made using a first conductive layer over a first wafer. An isolated conductive region is formed in the first conductive layer surrounded by a first opening in the conductive layer. A second wafer has a first insulating layer and a conductive substrate, wherein the conductive substrate has a first major surface adjacent to the first insulating layer. The insulating layer is attached to the isolated conductive region. The conductive substrate is thinned to form a second conductive layer. A second opening is formed through the second conductive layer and the first insulating layer to the isolated conductive region. The second opening is filled with a conductive plug wherein the conductive plug contacts the isolated conductive region. The second conductive region is etched to form a movable finger over the isolated conductive region. A portion of the insulating layer under the movable finger is removed.

Abstract translation: 使用第一晶片上的第一导电层制造器件结构。 在由导电层中的第一开口包围的第一导电层中形成隔离的导电区域。 第二晶片具有第一绝缘层和导电衬底，其中导电衬底具有与第一绝缘层相邻的第一主表面。 绝缘层附接到隔离导电区域。 导电基板被薄化以形成第二导电层。 通过第二导电层和第一绝缘层形成第二开口到隔离的导电区域。 第二开口填充有导电插头，其中导电插头接触隔离的导电区域。 蚀刻第二导电区域以在隔离的导电区域上形成可移动的手指。 去除可动指状物下面的绝缘层的一部分。

公开(公告)号：US08445978B2

公开(公告)日：2013-05-21

申请号：US13128035

申请日：2009-11-25

Applicant: Francois Perruchot ,  Emmanuel Defay ,  Patrice Rey ,  Lianjun Liu ,  Sergio Pacheco

Inventor： Francois Perruchot ,  Emmanuel Defay ,  Patrice Rey ,  Lianjun Liu ,  Sergio Pacheco

IPC: G01P15/08

CPC classification number: B81B3/0072 ,  B81B2201/032 ,  H01L41/0933 ,  H01L41/094

Abstract: A micro or nano electromechanical transducer device formed on a semiconductor substrate comprises a movable structure which is arranged to be movable in response to actuation of an actuating structure. The movable structure comprises a mechanical structure comprising at least one mechanical layer having a first thermal response characteristic and a first mechanical stress response characteristic, at least one layer of the actuating structure, the at least one layer having a second thermal response characteristic different to the first thermal response characteristic and a second mechanical stress response characteristic different to the first mechanical stress response characteristic, a first compensation layer having a third thermal response characteristic and a third mechanical stress characteristic, and a second compensation layer having a fourth thermal response characteristic and a fourth mechanical stress response characteristic. The first and second compensation layers are arranged to compensate a thermal effect produced by the different first and second thermal response characteristics of the mechanical structure and the at least one layer of the actuating structure such that movement of the movable structure is substantially independent of variations in temperature and to adjust a stress effect produced by the different first and second stress response characteristics of the mechanical structure and the at least one layer of the actuating structure such that the movable structure is deflected a predetermined amount relative to the substrate when the electromechanical transducer device is in an inactive state.

Abstract translation: 形成在半导体衬底上的微型或纳米机电换能器装置包括可移动结构，其被布置成响应于致动结构的致动而是可移动的。 可移动结构包括机械结构，其包括具有第一热响应特性和第一机械应力响应特性的至少一个机械层，所述致动结构的至少一层，所述至少一层具有与 第一热响应特性和与第一机械应力响应特性不同的第二机械应力响应特性，具有第三热响应特性和第三机械应力特性的第一补偿层，以及具有第四热响应特性的第二补偿层和 第四机械应力响应特性。 第一和第二补偿层布置成补偿由机械结构和致动结构的至少一个层的不同的第一和第二热响应特性产生的热效应，使得可移动结构的移动基本上与 并且调节由所述机械结构和所述致动结构的所述至少一个层的不同的第一和第二应力响应特性产生的应力效应，使得当所述机电换能器装置 处于非活动状态。

公开(公告)号：US08149564B2

公开(公告)日：2012-04-03

申请号：US12391083

申请日：2009-02-23

Applicant: Lianjun Liu ,  Melvy F. Miller

Inventor： Lianjun Liu ,  Melvy F. Miller

IPC: H01G5/00 ,  H01G7/00

CPC classification number: H01G5/011 ,  B81B3/0072 ,  B81B2201/0221 ,  H01G5/18 ,  H01L28/40 ,  H01L41/0973 ,  Y10T29/435

Abstract: A MEMS capacitive device (90) includes a fixed capacitor plate (104) formed on a surface (102) of a substrate (100). A movable capacitor plate (114) is suspended above the fixed capacitor plate (104) by compliant members (116) anchored to the surface (102). A movable element (120) is positioned in spaced apart relationship from the movable capacitor plate (104) and has an actuator (130) formed thereon. Actuation of the actuator (130) causes abutment of a portion of the movable element (120) against a contact surface (136) of the movable plate (114). The abutment moves the movable plate (114) toward the fixed plate (104) to alter a capacitance (112) between the plates (104, 114). Another substrate (118) may be coupled to the substrate (100) such that a surface (126) of the substrate (118) faces the surface (102) of the substrate (100). The movable element (120) may be formed on the surface (126).

Abstract translation: MEMS电容器件（90）包括形成在衬底（100）的表面（102）上的固定电容器板（104）。 可移动电容器板（114）通过锚固到表面（102）的柔性构件（116）悬置在固定电容器板（104）的上方。 可移动元件（120）与可移动电容器板（104）间隔开并且具有形成在其上的致动器（130）。 致动器（130）的致动导致可移动元件（120）的一部分抵靠可动板（114）的接触表面（136）。 抵靠将可移动板（114）移向固定板（104）以改变板（104,114）之间的电容（112）。 衬底（118）可以耦合到衬底（100），使得衬底（118）的表面（126）面向衬底（100）的表面（102）。 可移动元件（120）可以形成在表面（126）上。

公开(公告)号：US07961063B2

公开(公告)日：2011-06-14

申请号：US12183755

申请日：2008-07-31

Applicant: Lianjun Liu ,  Jonathan K. Abrokwah ,  Olin L. Hartin ,  Qiang Li

Inventor： Lianjun Liu ,  Jonathan K. Abrokwah ,  Olin L. Hartin ,  Qiang Li

IPC: H03H7/42 ,  H01P5/12

CPC classification number: H03H7/42 ,  H01F19/08 ,  H01F2017/0046 ,  H03H7/1758 ,  H03H7/1766 ,  H03H7/1775

Abstract: A balanced-unbalanced (balun) signal transformer includes an unbalanced port, a balanced port coupled to the unbalanced port, the balanced port comprising a first terminal and a second terminal, a first capacitor coupled to the first terminal, a first inductor coupled to ground and the first capacitor, a second capacitor coupled to the second terminal, and a second inductor coupled to ground and the second capacitor. The transformer may also include a third capacitor coupled to a terminal of the unbalanced port; and a third inductor coupled to the third capacitor and the third terminal.

Abstract translation: 平衡不平衡（balun）信号变压器包括不平衡端口，耦合到不平衡端口的平衡端口，平衡端口包括第一端子和第二端子，耦合到第一端子的第一电容器，耦合到地的第一电感器 并且第一电容器，耦合到第二端子的第二电容器和耦合到地的第二电感器和第二电容器。 变压器还可以包括耦合到不平衡端口的端子的第三电容器; 以及耦合到所述第三电容器和所述第三端子的第三电感器。

公开(公告)号：US07829366B2

公开(公告)日：2010-11-09

申请号：US12040737

申请日：2008-02-29

Applicant: Melvy F. Miller ,  Daniel N. Koury, Jr. ,  Lianjun Liu

Inventor： Melvy F. Miller ,  Daniel N. Koury, Jr. ,  Lianjun Liu

IPC: H01L21/00

CPC classification number: B81C1/00182 ,  B81B2201/0257 ,  B81C2201/019 ,  H04R19/005 ,  H04R19/04 ,  H04R31/00

Abstract: A microelectromechanical systems (MEMS) component 20 includes a portion 32 of a MEMS structure 30 formed on a semiconductor substrate 34 and a portion 36 of the structure 30 formed in a non-semiconductor substrate 22. The non-semiconductor substrate 22 is in fixed communication with the semiconductor substrate 34 with the portion 32 of the MEMS structure 30 being interposed between the substrates 34 and 22. A fabrication method 96 entails utilizing semiconductor thin-film processing techniques to form the portion 32 on the semiconductor substrate 34, and utilizing a lower cost processing technique to fabricate the portion 36 in the non-semiconductor substrate 22. The portions 32 and 36 are coupled to yield the MEMS structure 30, and the MEMS structure 30 can be attached to another substrate as needed for additional functionality.

Abstract translation: 微机电系统（MEMS）部件20包括形成在半导体衬底34上的MEMS结构30的部分32和形成在非半导体衬底22中的结构30的部分36.非半导体衬底22处于固定通信 其中半导体衬底34与MEMS结构30的部分32插入在衬底34和22之间。制造方法96需要利用半导体薄膜处理技术在半导体衬底34上形成部分32，并且利用较低的 成本处理技术以制造非半导体衬底22中的部分36.部分32和36被耦合以产生MEMS结构30，并且可以根据需要将MEMS结构30附接到另一衬底以用于附加功能。

公开(公告)号：US20100117767A1

公开(公告)日：2010-05-13

申请号：US12689594

申请日：2010-01-19

Applicant: Lianjun Liu

Inventor： Lianjun Liu

IPC: H01P1/203

CPC classification number: B81B7/0077 ,  B81B2207/092

Abstract: An integrated passive device (20) includes a first wafer (22), a first integrated device (28) formed on a first surface (24) of the wafer (22), and a second integrated device (30) formed on a second surface (26) of the wafer (22), the second surface (26) opposing the first surface (24). A microelectromechanical (MEMS) device (72) includes a second wafer (74) having a MEMS component (76) formed thereon. The integrated passive device (20) and theMEMS device (72) are coupled to form an IPD/MEMS stacked device (70) in accordance with a fabrication process (90). The fabrication process (90) calls for forming (94) the second integrated device (30) on the second surface (26) of the wafer (22), constructing (100) the MEMS component (76) on the wafer (74), coupling (104) the wafers (22, 74), then creating the first integrated device (28) on the first surface (24) of the first wafer (22).

Abstract translation: 集成无源器件（20）包括第一晶片（22），形成在晶片（22）的第一表面（24）上的第一集成器件（28）和形成在晶片（22）的第二表面 （22）的第二表面（26），与第一表面（24）相对的第二表面（26）。 微机电（MEMS）装置（72）包括其上形成有MEMS部件（76）的第二晶片（74）。 集成无源器件（20）和MEMS器件（72）根据制造工艺（90）耦合以形成IPD / MEMS堆叠器件（70）。 制造工艺（90）要求在晶片（22）的第二表面（26）上形成（94）第二集成器件（30），在晶片（74）上构造（100）MEMS部件（76） 耦合（104）晶片（22,74），然后在第一晶片（22）的第一表面（24）上产生第一集成器件（28）。

公开(公告)号：US07630693B2

公开(公告)日：2009-12-08

申请号：US11600351

申请日：2006-11-16

Applicant: Lianjun Liu ,  Ricardo A. Uscola

Inventor： Lianjun Liu ,  Ricardo A. Uscola

IPC: H04B1/04

CPC classification number: H04B1/0458 ,  H03F1/02 ,  H03F3/24 ,  H03F3/72 ,  H03F2203/7239 ,  H03H7/38 ,  H04B2001/045

Abstract: A power amplifier (PA) line-up (210) and a method (500) for more efficiently utilizing battery power are disclosed. PA line-up (210) includes a driver (220), a matching circuit (214), and a PA (230) coupled to a matching circuit (216), wherein matching circuit (216) is configured to be coupled to a filter (260). PA line-up (210) includes a transmission line (260) coupled to matching circuit (216) and a switch (262) configured to selectively couple driver (220) to either matching circuit (214) or matching circuit (216) such that signal (205) is capable of by-passing PA (230) when signal (205) does not need to be amplified by PA (230). Furthermore, PA line-up (210) may include a second transmission line (250) so that signal (205) is capable of by-passing a driver (220) and a PA (230) when signal (205) does not need to be amplified by driver (220) and PA (230).

Abstract translation: 公开了一种用于更有效地利用电池电力的功率放大器（PA）阵容（210）和方法（500）。 PA阵列（210）包括驱动器（220），匹配电路（214）和耦合到匹配电路（216）的PA（230），其中匹配电路（216）被配置为耦合到滤波器 （260）。 PA阵列（210）包括耦合到匹配电路（216）的传输线（260）和配置成将驱动器（220）选择性地耦合到匹配电路（214）或匹配电路（216）的开关（262），使得 当信号（205）不需要被PA放大（230）时，信号（205）能够旁路PA（230）。 此外，PA阵列（210）可以包括第二传输线（250），使得当信号（205）不需要时，信号（205）能够旁路驱动器（220）和PA（230） 由驱动器（220）和PA（230）放大。

公开(公告)号：US20090085432A1

公开(公告)日：2009-04-02

申请号：US11864266

申请日：2007-09-28

Applicant: Lianjun Liu

Inventor： Lianjun Liu

IPC: H01L41/09 ,  H01L41/083 ,  H01L41/187

CPC classification number: B81B3/0086 ,  B81B2201/0235 ,  B81B2203/0118 ,  H01H57/00 ,  H01H2057/006 ,  H01L41/094 ,  H01L41/257

Abstract: A self-poling piezoelectric based MEMS device is configured for piezoelectric actuation in response to application of a device operating voltage. The MEMS device comprises a beam, a first electrode disposed on the beam, a layer of piezoelectric material having a self-poling thickness disposed overlying a portion of the first electrode, and a second electrode overlying the layer of piezoelectric material. The layer of piezoelectric material is self-poled in response to application of the device operating voltage across the first and second electrodes. In addition, the self-poled piezoelectric material has a poling direction established according to a polarity orientation of the device operating voltage as applied across the first and second electrodes.

Abstract translation: 响应于器件工作电压的应用，自极化基于压电的MEMS器件被配置为用于压电致动。 MEMS器件包括光束，设置在光束上的第一电极，具有设置在第一电极的一部分上的自极化厚度的压电材料层和覆盖在压电材料层上的第二电极。 响应于在第一和第二电极上施加器件工作电压，压电材料层是自极化的。 此外，自极化压电材料具有根据施加在第一和第二电极上的器件工作电压的极性取向而建立的极化方向。

公开(公告)号：US07479785B2

公开(公告)日：2009-01-20

申请号：US11465311

申请日：2006-08-17

Applicant: Lianjun Liu ,  Bishnu P. Gogoi

Inventor： Lianjun Liu ,  Bishnu P. Gogoi

IPC: G01R31/00

CPC classification number: H01H59/0009 ,  H01G5/18 ,  H01H9/167

Abstract: A circuit includes a micro electro mechanical switch and a detection circuit. The micro electro mechanical switch has a movable portion positioned to form an electrical connection between a first electrical contact and a second electrical contact in response to an electrostatic force provided by a top activation electrode and a bottom activation electrode. The detection circuit is electrically coupled to the top and bottom activation electrodes and is for detecting a first capacitance value between the top and bottom activation electrodes when the movable portion is in a first position and for detecting a second capacitance value when the movable portion is in a second position. By detecting a change in the capacitance, it can be determined if the switch is open or closed.

Abstract translation: 电路包括微机电开关和检测电路。 微电机械开关具有可移动部分，其被定位成响应于由顶部激活电极和底部激活电极提供的静电力而在第一电触点和第二电触头之间形成电连接。 检测电路电耦合到顶部和底部激活电极，并且用于当可移动部分处于第一位置时检测顶部和底部激活电极之间的第一电容值，并且当可移动部分处于第一位置时检测第二电容值 第二个位置 通过检测电容的变化，可以确定开关是开或关。