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    41.
    发明专利
    未知

    公开(公告)号：DK0678124T3

    公开(公告)日：2000-09-25

    申请号：DK94902244

    申请日：1993-11-15

    Applicant: PPG INDUSTRIES INC ,  MACDERMID INC

    Inventor： LARSON GARY B ,  JOBSON BRIAN ,  JOHNSON JAMES A ,  STURNI LANCE C

    IPC: G03F7/09 ,  C23C22/07 ,  C23C22/08 ,  C23C22/42 ,  G03F7/11 ,  H05K3/00 ,  H05K3/06 ,  H05K3/38 ,  C23F1/18

    Abstract: Composition and methods for providing a phosphate conversion coating on a metal surface, particularly a copper surface, characterized in that the phosphating composition includes at least one composition-soluble compound containing vanadium, niobium, tungsten or tantalum. The phosphate conversion coatings so produced are thicker, more durable and more uniform than those produced by known phosphating compositions. The compositions and processes are especially useful for providing a passivating/uniformizing coating layer on copper surfaces to which organic resin is thereafter deposited to serve as a resist in printed circuit fabrication sequences, particularly when the organic resin is an electrophoretically deposited organic resin. Also described is the microetching of copper surfaces with a phosphoric acid/peroxide microetchant preparatory to deposit thereon (or after a further provision of a phosphate conversion coating) of a photoresist which is then imagewise exposed and developed to provide a patterned resist.

    42.
    发明专利
    未知

    公开(公告)号：AT195560T

    公开(公告)日：2000-09-15

    申请号：AT94902244

    申请日：1993-11-15

    Applicant: MACDERMID INC ,  PPG INDUSTRIES INC

    Inventor： LARSON GARY B ,  JOBSON BRIAN ,  JOHNSON JAMES A ,  STURNI LANCE C

    IPC: G03F7/09 ,  C23C22/07 ,  C23C22/08 ,  C23C22/42 ,  G03F7/11 ,  H05K3/00 ,  H05K3/06 ,  H05K3/38 ,  C23F1/18

    Abstract: Composition and methods for providing a phosphate conversion coating on a metal surface, particularly a copper surface, characterized in that the phosphating composition includes at least one composition-soluble compound containing vanadium, niobium, tungsten or tantalum. The phosphate conversion coatings so produced are thicker, more durable and more uniform than those produced by known phosphating compositions. The compositions and processes are especially useful for providing a passivating/uniformizing coating layer on copper surfaces to which organic resin is thereafter deposited to serve as a resist in printed circuit fabrication sequences, particularly when the organic resin is an electrophoretically deposited organic resin. Also described is the microetching of copper surfaces with a phosphoric acid/peroxide microetchant preparatory to deposit thereon (or after a further provision of a phosphate conversion coating) of a photoresist which is then imagewise exposed and developed to provide a patterned resist.

    44.
    发明专利
    未知

    公开(公告)号：NO952739L

    公开(公告)日：1995-09-01

    申请号：NO952739

    申请日：1995-07-10

    Applicant: MACDERMID INC ,  PPG INDUSTRIES INC

    Inventor： LARSON GARY B ,  JOBSON BRIAN ,  JOHNSON JAMES A ,  STURNI LANCE C

    IPC: C23C22/07 ,  C23C22/08 ,  C23C22/42 ,  G03F7/09 ,  G03F7/11 ,  H05K3/00 ,  H05K3/06 ,  H05K3/38 ,  C23F1/18

    Abstract: Composition and methods for providing a phosphate conversion coating on a metal surface, particularly a copper surface, characterized in that the phosphating composition includes at least one composition-soluble compound containing vanadium, niobium, tungsten or tantalum. The phosphate conversion coatings so produced are thicker, more durable and more uniform than those produced by known phosphating compositions. The compositions and processes are especially useful for providing a passivating/uniformizing coating layer on copper surfaces to which organic resin is thereafter deposited to serve as a resist in printed circuit fabrication sequences, particularly when the organic resin is an electrophoretically deposited organic resin. Also described is the microetching of copper surfaces with a phosphoric acid/peroxide microetchant preparatory to deposit thereon (or after a further provision of a phosphate conversion coating) of a photoresist which is then imagewise exposed and developed to provide a patterned resist.

    46.
    发明专利
    未知

    公开(公告)号：AT82529T

    公开(公告)日：1992-12-15

    申请号：AT87906862

    申请日：1987-09-10

    Applicant: MACDERMID INC

    Inventor： RUSZCZYK STANLEY J ,  FERRIER DONALD R ,  LARSON GARY B ,  GALLEGOS DANIEL ,  CASTALDI STEVEN A

    IPC: B05D3/04 ,  B05D3/10 ,  B05D5/12 ,  H05K1/00 ,  H05K3/18 ,  H05K3/46

    Abstract: Multilayer printed circuit boards are fabricated by preparing a first layer in conventional manner by forming a resist image on a copper clad substrate, etching away unwanted copper, removing the resist from the circuit pattern and optionally applying a dielectric mask such as conventional solder mask to selected portions of the circuit pattern. A second layer, and optionally one or more subsequent layers, are fabricated by providing an image of a second circuit pattern in a predetermined location on said first layer, the image being formed using a suspension of cuprous oxide in a curable resin material. The image is cured at least partially and subjected to chemical reduction to convert at least a portion of the cuprous oxide to metallic copper such that the unreduced cuprous oxide in resin serves as a dielectric layer. The image is then electrolessly plated with copper to build up the circuit pattern and the latter is selectively coated with a dielectric mask before repeating the cycle to build up one or more additional layers. Solder can be applied to selected areas of any of said printed circuit layers at any appropriate time during fabrication. The above method of fabrication has advantages of economy of time, materials and labor as compared with methods hitherto employed to prepare multilayer boards in which a plurality of single boards are fabricated individually and then assembled as a sandwich or laminate by application of heat and pressure.

    PROCESS FOR MANUFACTURING PRINTED CIRCUITS EMPLOYING SELECTIVE PROVISION OF SOLDERABLE COATING
    47.
    发明专利
    PROCESS FOR MANUFACTURING PRINTED CIRCUITS EMPLOYING SELECTIVE PROVISION OF SOLDERABLE COATING 未知

    公开(公告)号：CA2067710A1

    公开(公告)日：1992-12-06

    申请号：CA2067710

    申请日：1992-04-30

    Applicant: MACDERMID INC

    Inventor： LARSON GARY B

    IPC: H05K3/06 ,  H05K3/10 ,  H05K3/24 ,  H05K3/28 ,  H05K3/34 ,  H05K3/42

    Abstract: The areas of a printed circuit where electrical components are to be solder connected, such as throughholes, surrounding pads and surface mount areas, are selectively provided with a metal coating (e.g., tinlead) which preserves and promotes solderability thereat, by a process in which a photoimageable electrophoretically deposited organic resin is used to provide, on an already patterned surface, an additional resist pattern which selectively exposes areas on which the solderable metal coating is to be provided and in which the resist serves also as an etch resist for metal areas over which it is arranged.

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