公开(公告)号：JP2003270263A

公开(公告)日：2003-09-25

申请号：JP2002075901

申请日：2002-03-19

Applicant: Matsushita Electric Works Ltd ,  松下電工株式会社

Inventor： YAMAMOTO MASAHIRO ,  TAKAKURA NOBUYUKI ,  YASUIKE NORIYUKI ,  YASUDA MASAHARU

IPC: G01P15/12 ,  G01P15/08 ,  H01L29/84

Abstract: PROBLEM TO BE SOLVED: To provide a semiconductor acceleration sensor improving a temperature characteristic by mitigating effect of thermal stress caused by a difference in linear expansion coefficient to a sensor chip. SOLUTION: The semiconductor acceleration sensor comprises the sensor chip 1 consisting of a thin beam 12 having a piezoresistive element 15 projecting inward of a frame consisting of a semiconductor substrate and a plummet 14 supported by hanging with the beam 12, and an upper and a lower stoppers 2 and 3 fixed to the frame 11 with a specific gap to the surface of the sensor chip 1 by way of a support 4. The support 4 is joined to a part other than 4 corners of the frame 11, and the angle of the acceleration sensor center to the neighboring support 4 is 90°. COPYRIGHT: (C)2003,JPO

Abstract translation: 要解决的问题：提供一种半导体加速度传感器，其通过减轻由于与传感器芯片的线膨胀系数的差异引起的热应力的影响来改善温度特性。 解决方案：半导体加速度传感器包括传感器芯片1，该传感器芯片1由具有从由半导体衬底构成的框架的内侧突出的压阻元件15的薄梁12和与梁12悬挂支撑的对着头14组成。 以及通过支撑件4固定到具有与传感器芯片1的表面相对的特定间隙的框架11的下止动器2和3。支撑件4接合到框架11的4个角以外的部分，并且 加速度传感器中心与相邻支架4的角度为90°。 版权所有（C）2003，JPO

公开(公告)号：JP2003156422A

公开(公告)日：2003-05-30

申请号：JP2001357083

申请日：2001-11-22

Applicant: MATSUSHITA ELECTRIC WORKS LTD

Inventor： AOKI AKIRA ,  KENO TAKUJI ,  TAKAKURA NOBUYUKI ,  YASUIKE NORIYUKI ,  YASUDA MASAHARU ,  YAMAMOTO MASAHIRO

IPC: G01N3/31 ,  H01L21/66

Abstract: PROBLEM TO BE SOLVED: To provide an impact resistance test device that can efficiently execute a test. SOLUTION: Impact resistance of a wafer 5 with a chip for an inertia sensor formed is tested in this impact resistance testing device. The impact resistance testing device is provided with an erected support shaft 11, a support base 10 for supporting the support shaft 11, an arm 1 with a mainstay side supported rotatably in a tip of the support shaft 11, a testing head 2 provided in a tip side of the arm 1 and having a wafer hold for holding the wafer 5, and a collided face 3 with which the testing head 2 is collided by bringing the arm 1 into pendulum motion.

公开(公告)号：JP2002350386A

公开(公告)日：2002-12-04

申请号：JP2001158329

申请日：2001-05-28

Applicant: MATSUSHITA ELECTRIC WORKS LTD

Inventor： ARII YASUTAKA ,  SAKAI ATSUSHI ,  SAITO HIROSHI ,  SUGIURA YOSHIYUKI ,  YAMAMOTO MASAHIRO

IPC: G01N27/414 ,  G01N27/416 ,  G01N27/49

Abstract: PROBLEM TO BE SOLVED: To provide a semiconductor ion sensor that prevents covering an ion sensitive section when covering a semiconductor substrate, and can make a covering process simple. SOLUTION: The semiconductor ion sensor includes the semiconductor substrate 2 having the ion sensitive section 5, and an insulating film 10 covering the whole surface of the semiconductor substrate 2 except the ion sensitive section 5 and covering a connection region between an electrode 6 and a lead 8. An aperture 9 corresponding to the ion sensitive section 5 is arranged on the insulating film 10 beforehand.

公开(公告)号：JP2002328136A

公开(公告)日：2002-11-15

申请号：JP2001133424

申请日：2001-04-27

Applicant: MATSUSHITA ELECTRIC WORKS LTD

Inventor： AKAI SUMIO ,  YAMAMOTO MASAHIRO ,  KATAOKA KAZUSHI ,  SAIJO TAKASHI

IPC: G01P15/12 ,  H01L29/84

Abstract: PROBLEM TO BE SOLVED: To accurately detect acceleration. SOLUTION: This sensor is provided with a base body 1 having a fixed face 1a, an acceleration sensor chip 2 having thin-walled part 2b provided with a recessed part 2a from one side face to be thinned locally, a connection member 3 having a prescribed thickness dimension for connection-fixing the acceleration sensor chip 2 onto the fixed face 1a to oppose the other side face of the acceleration sensor chip 2 to the fixed face 1a with a facing space corresponding to the prescribed thickness dimension, and a lid body 4 for closing the recessed part 2a of the acceleration chip 2, and the acceleration is detected based on only deflection of the thin-walled part 2b when the acceleration is received.

公开(公告)号：JP2002257846A

公开(公告)日：2002-09-11

申请号：JP2001055142

申请日：2001-02-28

Applicant: MATSUSHITA ELECTRIC WORKS LTD

Inventor： YAMAMOTO MASAHIRO ,  AKAI SUMIO

IPC: G01P15/12 ,  H01L29/84

Abstract: PROBLEM TO BE SOLVED: To provide an accelerometer by which an acceleration is detected more precisely. SOLUTION: The accelerometer is provided with a fixation member 1 comprising a fixation face 1a and an accelerometer chip 2 which faces the fixation member 1, which comprises a locally thinned thin wall part 2b and which is fixed to the fixation face 1a on the fixation member 1. The accelerometer is constituted, in such a way that the acceleration is detected on the basis of the flexure of the thin wall part 2b, when subjected to the acceleration.

公开(公告)号：JP2002257844A

公开(公告)日：2002-09-11

申请号：JP2001055141

申请日：2001-02-28

Applicant: MATSUSHITA ELECTRIC WORKS LTD

Inventor： YAMAMOTO MASAHIRO

IPC: G01P15/08

Abstract: PROBLEM TO BE SOLVED: To provide an accelerometer, in which the direction of an acceleration detected by an accelerometer chip is made surely parallel with respect to the reference plane of a base. SOLUTION: The accelerometer is provided with the base 1 comprising the reference plane 1a, the accelerometer chip 3 which detects the acceleration in a preset prescribed direction and a support member 2 which comprises a support face 22a supporting the accelerometer chip 3 and which is fixed directly to the base 1. The support face 22a is constituted to be tilted with reference to the reference plane 1a, in such a way that the prescribed direction becomes parallel to the reference plane 1a.

公开(公告)号：JP2001068797A

公开(公告)日：2001-03-16

申请号：JP24430799

申请日：1999-08-31

Applicant: MATSUSHITA ELECTRIC WORKS LTD

Inventor： YAMAMOTO MASAHIRO ,  KUZUHARA KAZUNARI ,  INOUE TOMOHIRO

IPC: H05K1/18 ,  H05K1/02 ,  H05K3/26

Abstract: PROBLEM TO BE SOLVED: To provide an electronic part mounting structure capable of preventing an electronic part and mounting sections from being damaged, by providing a wiring board or an electronic part with a detergent passage structure so as to reduce flux residues, shorten cleaning time, and reduce the intensity of ultrasonic waves and shower. SOLUTION: Through holes 5 are formed in a wiring board 1 within its area for mounting an electronic part 2, whereby the clearance between the board 1 and the part 2 can be cleaned efficiently and flux residues can be reduced during ultrasonic cleaning. Further, the cleaning time can also be shortened and the intensity of ultrasonic waves applied can be reduced, thereby preventing the part 2 and mounting sections (solder bumps 3 and electrodes 4) from being damaged due to cleaning. Since a detergent passage structure is thus provided in the board 1 or the part 2, the step of cleaning the electronic part mounting board can be performed with cleaning efficiency improved, flux residues reduced, and the damaging of the part 1 and the mounting sections prevented.

公开(公告)号：JP2001053097A

公开(公告)日：2001-02-23

申请号：JP22696299

申请日：1999-08-10

Applicant: MATSUSHITA ELECTRIC WORKS LTD

Inventor： INOUE TOMOHIRO ,  KUZUHARA KAZUNARI ,  TANAKA YASUSHI ,  YAMAMOTO MASAHIRO

IPC: H01L21/60

Abstract: PROBLEM TO BE SOLVED: To obtain a method for forming stud bumps while preventing short- circuiting between bumps. SOLUTION: At first, forward end of a solder wire 4 inserted into a capillary 10 is thermally fused by arc discharge in the atmosphere of Ar+10% H2 gas, for example, to form a ball 5. The ball 5 is then thermo-ultrasonic bonded to an aluminum electrode (not shown) formed on a semiconductor element 1 and the recrystallized fragile part at the root of the ball 5 is broken to form a solder bump (stud bump) 3 while leaving a neck 6 at the root of the ball 5. Subsequently, the part other than that required for bonding the solder bump 3, i.e., the neck 6 left at the root of the ball 5, is cut off by means of a cutting jig 11 thus forming the solder bump 3.

公开(公告)号：JP2000077468A

公开(公告)日：2000-03-14

申请号：JP24447898

申请日：1998-08-31

Applicant: Matsushita Electric Works Ltd ,  松下電工株式会社

Inventor： TANAKA YASUSHI ,  KUZUHARA KAZUNARI ,  INOUE TOMOHIRO ,  YAMAMOTO MASAHIRO

IPC: H01L23/28 ,  H01L21/60

CPC classification number: H01L2224/16225 ,  H01L2224/27013 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/1515 ,  H01L2924/00

Abstract: PROBLEM TO BE SOLVED: To provide a semiconductor device which can obtain high reliability by reducing stresses given to bumps. SOLUTION: Electrodes 4 formed on a semiconductor element 2 are flip-chip mounted on electrodes 3 for connection formed on a mounting substrate 1 via bumps 5 and sealed with a sealing resin 6 in the peripheral edge section of the element 2. At mounting of the electrodes 4 on the electrodes 3, the electrodes 4 are flip-chip mounted on the electrodes in an area surrounded by frame-like projecting section 1a formed on the surface of the mounting substrate 1, by bringing the top of the projecting section 1a into contact with the peripheral edge section of the semiconductor element 2.

Abstract translation: 要解决的问题：提供一种半导体器件，其可以通过减少施加于凸块的应力而获得高可靠性。 解决方案：形成在半导体元件2上的电极4通过凸块5倒装安装在用于连接在安装基板1上的连接电极3上，并通过密封树脂6密封在元件2的周缘部分。在安装 电极3上的电极4，通过使突出部1a的顶部接触而将电极4倒装安装在形成在安装基板1的表面上的框状的突出部1a包围的区域中的电极上 与半导体元件2的周缘部分。

公开(公告)号：JP2000074758A

公开(公告)日：2000-03-14

申请号：JP24447698

申请日：1998-08-31

Applicant: Matsushita Electric Works Ltd ,  松下電工株式会社

Inventor： YAMAMOTO MASAHIRO ,  KUZUHARA KAZUNARI ,  TANAKA YASUSHI ,  INOUE TOMOHIRO

IPC: G01L1/18 ,  H01L21/60

Abstract: PROBLEM TO BE SOLVED: To provide a semiconductor device in which stress being generated at the time of flip-chip mounting can be detected accurately.
SOLUTION: The semiconductor device 1 related to the embodiment of this invention is formed into a rectangle where the length y of long side 1b and the length x of short side 1a satisfy a relation y≥2x and a strain detecting element 2 is arranged in the direction of the long side 1b. Consequently, a stress can be generated remarkably in the direction of long side 1b of the semiconductor device 1 and detected accurately by the strain detecting element 2 at the time of flip-chip mounting.
COPYRIGHT: (C)2000,JPO

Abstract translation: 要解决的问题：提供可以精确地检测倒装芯片安装时产生的应力的半导体装置。 解决方案：与本发明的实施例相关的半导体器件1形成为长边1b的长度y和短边1a的长度x满足y> = 2x的关系的矩形，应变检测元件2布置在 长边1b的方向。 因此，在倒装芯片安装时，能够在半导体器件1的长边1b的方向上显着地产生应力，并且由应变检测元件2精确地检测出。