41.
    发明专利
    未知

    公开(公告)号:DE69012752D1

    公开(公告)日:1994-10-27

    申请号:DE69012752

    申请日:1990-10-24

    Abstract: A polyimide having a high heat-resistance, good processability and recurring structural units of the formula (I); wherein R is a tetravalent radical selected from the group consisting of an aliphatic radical having at least two carbon atoms, alicyclic radical, monocyclic aromatic radical, fused polycyclic aromatic radical and polycyclic aromatic radical bonded through a direct bond or a bridge member.

    INSULATED WIRE AND PRODUCTION PROCESS OF THE INSULATED WIRE

    公开(公告)号:CA2000927C

    公开(公告)日:1994-09-13

    申请号:CA2000927

    申请日:1989-10-18

    Abstract: The insulated wire having excellent thermal resistance and good surface appearance is obtained by producing from specific polyamide in a temperature range of 300 .degree.C to 450 .degree.C and controlling moisture content to 200 ppm or less in the polyimide used as raw materials. The polyimide has a recurring units of the formula: (I) (wherein R is a tetravalent radical selected from the group consisting of an aliphatic radical having two or more carbon atoms, a cyclo-aliphatic radical, a monoaromatic radical, a condensed polyaromatic radical and a non-condensed polyaromatic radical wherein the aromatic radicals are mutually connected with a bond or a crosslinking function, X is a divalent radical of a single bond, sulfur atom, sulfonyl radical, carbonyl radical, isopropylidene radical or hexafluoroisopropylidene radical).

    43.
    发明专利
    未知

    公开(公告)号:DE68915407D1

    公开(公告)日:1994-06-23

    申请号:DE68915407

    申请日:1989-11-27

    Abstract: This invention provides thermosetting-resin-forming compositions which are formed of (a) a bismaleimide compound represented by the following formula: wherein R represents a divalent group of or X being a direct bond or a group selected from divalent hydrocarbon groups having 1-10 carbon atoms, hexa-fluorinated isopropylidene, carbonyl, thio, sulfinyl, sulfonyl and oxo, and (b) a specific diallylbisphenol compound. These compositions can provide thermosetting resins having high cracking resistance due to improved impact resistance and toughness and low water absorption.

    THERMOSETTING RESIN COMPOSITION
    44.
    发明专利

    公开(公告)号:CA1326319C

    公开(公告)日:1994-01-18

    申请号:CA565597

    申请日:1988-04-29

    Abstract: A thermosetting resin composition formed of a polyaminobismaleimide resin, which is prepared from a bismaleimide compound and a diamine compound, and a powdery inorganic filler. The composition has excellent heat resistance as well as superb mechanical properties at high temperature not to mention room temperature, and is expected to find wide-spread commercial utility in electric and electronic components, e.g., as a sealing material in sockets and connectors and for other applications.

    45.
    发明专利
    未知

    公开(公告)号:DE3876129T2

    公开(公告)日:1993-06-17

    申请号:DE3876129

    申请日:1988-04-20

    Abstract: A thermosetting resin composition formed of a polyaminobismaleimide resin, which is composed of a bismaleimide compound I and a diamine compound II, and a fibrous reinforcing material selected from potassium titante fibres and aromatic polyamide fibres, the fibres having an aspect ratio of from 5 to 600. The composition has excellent impact resistance and toughness while retaining conventional high heat resistance.

    HOCHTEMPERATUR-POLYIMIDKLEBSTOFF.
    47.
    发明专利

    公开(公告)号:DE3783477D1

    公开(公告)日:1993-02-25

    申请号:DE3783477

    申请日:1987-02-20

    Abstract: This invention discloses high-temperature adhesives having a good light-transmittance and excellent high-temperature flowability which comprises polyimide having recurring units represented by the following formula (I) (where R is a tetra-valent radical selected from the group consisting of aliphatic radical having not less than two carbons, cyclo-aliphatic radical, monoaromatic radical, condensed polyaromatic radical, and non condensed polyaromatic radical wherein aromatic radicals are mutally connected with a bond or a crosslinking function).The ployimide is obtained by preparing polyamic acid through the reaction of 2,2-bis[4-(3-aminophenoxy)phenyl]-1,1,1,3,3,3,-­hexafluoropropane as a diamine component with tetracarboxylic dianhydride such as pyromellitic dianhydride, 3,3ʹ,4,4ʹ-­biphenyltetracarboxylic dianhydride, bis(3,4-dicarboxyphenyl) ether dianhydride and 3,3ʹ4,4ʹ-benzophenonetetracarboxylic dianhydride, and further conducting the ring-closing reaction of resultant polyamic acid by dehydration.

    POLYIMIDE
    48.
    发明专利

    公开(公告)号:CA2028358A1

    公开(公告)日:1991-05-18

    申请号:CA2028358

    申请日:1990-10-23

    Abstract: A polyimide having a high heat-resistance, good processability and recurring structural units of the formula (I); wherein R is a tetravalent radical selected from the group consisting of an aliphatic radical having at least two carbon atoms, alicyclic radical, monocyclic aromatic radical, fused polycyclic aromatic radical and polycyclic aromatic radical bonded through a direct bond or a bridge member.

    PROCESS FOR PREPARING POLYMIMIDES
    50.
    发明专利

    公开(公告)号:AU604402B2

    公开(公告)日:1990-12-13

    申请号:AU3073489

    申请日:1989-02-24

    Abstract: A process for preparing a polyimide by reaction of a diamine and a tetracarboxylic dianhydride to obtain a polyamide acid and subjecting the polyamide acid to conversion into a polyimide thermally or chemically. The reaction in the process is carried out in the presence of at least one dicarboxylic anhydride selected from the group consisting of aliphatic dicarboxylic anhydrides and aromatic dicarboxylic anhydrides, and the amount of the tetracarboxylic dianhydride is in the range of from 0.9 to 1.0 mole per mole of the diamine and the amount of the dicarboxylic anhydride is in the range of from 0.001 to 1.0 mole per mole of the diamine. The resultant polyimides exhibit good thermal stability at high temperatures and good forming processability even at low temperatures.

Patent Agency Ranking