公开(公告)号：EP3370823A1

公开(公告)日：2018-09-12

申请号：EP16790507.4

申请日：2016-10-27

Applicant: Medtronic, Inc.

Inventor： DAY, John K. ,  NIDELKOFF, Michael J. ,  PETERSON, Kris A. ,  RIES, Andrew J. ,  RUBEN, David A. ,  WIKLUND, Craig L.

IPC: A61N1/378 ,  A61N1/375

CPC classification number: H05K5/069 ,  A61J1/00 ,  A61N1/3758 ,  A61N1/378 ,  H01M2/30 ,  H01M2220/30 ,  H05K5/0086 ,  H05K7/1417

Abstract: Various embodiments of a sealed package and method of forming such package are disclosed. The package can include a housing having an inner surface and an outer surface, and a substrate having a first major surface and a second major surface. The package can also include an electronic device disposed on the first major surface of the substrate, and a power source disposed at least partially within the housing. The substrate can be sealed to the housing such that a non-bonded electrical connection is formed between a device contact of the electronic device and a power source contact of the power source.

公开(公告)号：EP3237060A1

公开(公告)日：2017-11-01

申请号：EP15823893.1

申请日：2015-12-22

Applicant: Medtronic, Inc.

Inventor： RUBEN, David A. ,  SANDLIN, Michael S.

IPC: A61N1/375

CPC classification number: H05K5/066 ,  A61N1/3754 ,  H05K3/32 ,  H05K3/38 ,  H05K3/42 ,  H05K7/06 ,  H05K2203/107

Abstract: Various embodiments of an implantable medical device system and methods of forming such systems are disclosed. In one or more embodiments, the implantable medical device system includes a housing, electronics disposed within the housing, and a feedthrough assembly attached to a sidewall of the housing and electrically coupled to the electronics. The feedthrough assembly can include a non-conductive substrate and a feedthrough. The feedthrough can include a via from an outer surface to an inner surface of the non-conductive substrate, a conductive material disposed in the via, and an external contact disposed over the via on the outer surface of the non-conductive substrate, where the external contact is electrically coupled to the conductive material disposed in the via. In one or more embodiments, the external contact is hermetically sealed to the outer surface of the non-conductive substrate by a laser bond surrounding the via.

Abstract translation: 公开了可植入医疗设备系统的各种实施例以及形成这种系统的方法。 在一个或多个实施例中，可植入医疗设备系统包括壳体，布置在壳体内的电子器件以及附连到壳体的侧壁并电耦合到电子器件的馈通组件。 馈通组件可以包括非导电衬底和馈通。 馈通可以包括从非导电衬底的外表面到内表面的通孔，设置在通孔中的导电材料以及设置在非导电衬底的外表面上的通孔上的外部触点，其中 外部触点电连接到布置在通孔中的导电材料。 在一个或多个实施例中，外部触点通过围绕通孔的激光键合而密封到非导电衬底的外表面。

公开(公告)号：EP1976428A1

公开(公告)日：2008-10-08

申请号：EP06840258.5

申请日：2006-12-14

Applicant: MEDTRONIC, INC.

Inventor： SCHUGT, Michael A. ,  MOTHILAL, Kamal Deep ,  LARSON, Lary R. ,  MATTES, Michael F. ,  RUBEN, David A.

IPC: A61B5/0215 ,  A61N1/05

CPC classification number: A61N1/056 ,  A61B5/0215 ,  B81B3/0072 ,  B81C2201/0167 ,  H01L21/4857 ,  H05K1/0271 ,  H05K3/4061 ,  H05K3/4092

Abstract: Media-exposed interconnects for transducer modules are disclosed. The transducers may be sensing transducers, actuating transducers, IC-only transducers, or combinations thereof, or other suitable transducers. The transducers may be used in connection with implantable medical devices and may be exposed to various media, such as body fluids. The media-exposed interconnects for transducer modules may allow transducers to communicate electrically with other components, such as implantable medical devices.