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公开(公告)号：EP4513530A2
公开(公告)日：2025-02-26
申请号：EP24196523.5
申请日：2020-06-09
Applicant: QUALCOMM Incorporated
Inventor： KANG, Kuiwon , WANG, Zhijie , WE, Hong Bok
IPC: H01L21/48
Abstract: Some features pertain to a substrate that includes a first portion of the substrate including a first plurality of metal layers, a second portion of the substrate including a second plurality of metal layers, and a plurality of insulating layers configured to separate the first plurality of metal layers and the second plurality of metal layers. A first plurality of posts and a plurality of interconnects are coupled together such that the first plurality of posts and the plurality of interconnects couple the first portion of the substrate to the second portion of the substrate.
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42.发明公开
公开(公告)号：EP4487378A1
公开(公告)日：2025-01-08
申请号：EP23709581.5
申请日：2023-02-10
Applicant: Qualcomm Incorporated
Inventor： KANG, Kuiwon , WE, Hong Bok , KIM, Michelle, Yejin
IPC: H01L23/538 , H05K1/11
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Patent Agency Ranking
公开(公告)号：EP4460846A1
公开(公告)日：2024-11-13
申请号：EP22844403.0
申请日：2022-12-05
Applicant: QUALCOMM INCORPORATED
Inventor： CHOI, Seongryul , KANG, Kuiwon , KIM, Michelle Yejin
IPC: H01L23/522 , H01L21/48 , H01L23/498 , H01L23/538
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公开(公告)号：EP4158690A1
公开(公告)日：2023-04-05
申请号：EP21735033.9
申请日：2021-05-28
Applicant: QUALCOMM INCORPORATED
Inventor： BUOT, Joan Rey Villarba , WANG, Zhijie , PATIL, Aniket , WE, Hong Bok , KANG, Kuiwon
IPC: H01L23/498
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公开(公告)号：EP4133521A2
公开(公告)日：2023-02-15
申请号：EP21723464.0
申请日：2021-04-05
Applicant: QUALCOMM INCORPORATED
Inventor： PATIL, Aniket , WE, Hong Bok , KANG, Kuiwon
IPC: H01L23/538
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公开(公告)号：EP3143640B1
公开(公告)日：2020-01-08
申请号：EP15722828.9
申请日：2015-04-27
Applicant: Qualcomm Incorporated
Inventor： JOMAA, Houssam Wafic , BCHIR, Omar James , KANG, Kuiwon , KIM, Chin-Kwan
IPC: H01L21/48 , H01L23/538
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公开(公告)号：EP2962535B1
公开(公告)日：2020-01-01
申请号：EP14711635.4
申请日：2014-02-25
Applicant: Qualcomm Incorporated
Inventor： KIM, Chin-Kwan , KANG, Kuiwon , BCHIR, Omar James
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