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公开(公告)号：US11716055B1
公开(公告)日：2023-08-01
申请号：US17712096
申请日：2022-04-02
Applicant: SiTime Corporation
Inventor： Aaron Partridge , Sassan Tabatabaei , Lijun Chen , Kamran Souri
IPC: H03B5/36 , H03F3/04 , H03F3/70 , G01C19/5726 , G01C19/56
CPC classification number: H03B5/36 , G01C19/56 , G01C19/5726 , H03F3/04 , H03F3/70 , H03B2200/005 , H03F2200/129
Abstract: An oscillator includes a resonator, sustaining circuit and detector circuit. The sustaining circuit receives a sense signal indicative of mechanically resonant motion of the resonator generates an amplified output signal in response. The detector circuit asserts, at a predetermined phase of the amplified output signal, one or more control signals that enable an offset-reducing operation with respect to the sustaining amplifier circuit.
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公开(公告)号：US11543301B1
公开(公告)日：2023-01-03
申请号：US16565908
申请日：2019-09-10
Applicant: SiTime Corporation
Inventor： Carl Arft , Aaron Partridge , Paul M. Hagelin
Abstract: A micromachined apparatus includes micromachined thermistor having first and second ends physically and thermally coupled to a substrate via first and second anchor structures to enable a temperature-dependent resistance of the micromachined thermistor to vary according to a time-varying temperature of the substrate. The micromachined thermistor has a length, from the first end to the second end, greater than a linear distance between the first and second anchor structures.
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公开(公告)号：US20220360218A1
公开(公告)日：2022-11-10
申请号：US17824389
申请日：2022-05-25
Applicant: SiTime Corporation
Inventor： Carl Arft , Aaron Partridge , Markus Lutz , Charles I. Grosjean
Abstract: One or more heating elements are provided to heat a MEMS component (such as a resonator) to a temperature higher than an ambient temperature range in which the MEMS component is intended to operate—in effect, heating the MEMS component and optionally related circuitry to a steady-state “oven” temperature above that which would occur naturally during component operation and thereby avoiding temperature-dependent performance variance/instability (frequency, voltage, propagation delay, etc.). In a number of embodiments, an IC package is implemented with distinct temperature-isolated and temperature-interfaced regions, the former bearing or housing the MEMS component and subject to heating (i.e., to oven temperature) by the one or more heating elements while the latter is provided with (e.g., disposed adjacent) one or more heat dissipation paths to discharge heat generated by transistor circuitry (i.e., expel heat from the integrated circuit package).
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公开(公告)号：US10737934B1
公开(公告)日：2020-08-11
申请号：US15911045
申请日：2018-03-02
Applicant: SiTime Corporation
Inventor： Nicholas Miller , Ginel C. Hill , Charles I. Grosjean , Michael Julian Daneman , Paul M. Hagelin , Aaron Partridge
Abstract: A semiconductor device includes first and second exposed electrical contacts and a cavity having a microelectromechanical system (MEMS) structure therein. A conductive path extends from the first exposed electrical contact to the cavity and an over-voltage protection element electrically is coupled between the first and second exposed electrical contacts.
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公开(公告)号：US20190292043A1
公开(公告)日：2019-09-26
申请号：US16372745
申请日：2019-04-02
Applicant: SiTime Corporation
Inventor： Pavan Gupta , Aaron Partridge , Markus Lutz
IPC: B81B7/00 , H01L23/498 , H01L23/34 , B81C1/00
Abstract: A low-profile packaging structure for a microelectromechanical-system (MEMS) resonator system includes an electrical lead having internal and external electrical contact surfaces at respective first and second heights within a cross-sectional profile of the packaging structure and a die-mounting surface at an intermediate height between the first and second heights. A resonator-control chip is mounted to the die-mounting surface of the electrical lead such that at least a portion of the resonator-control chip is disposed between the first and second heights and wire-bonded to the internal electrical contact surface of the electrical lead. A MEMS resonator chip is mounted to the resonator-control chip in a stacked die configuration and the MEMS resonator chip, resonator-control chip and internal electrical contact and die-mounting surfaces of the electrical lead are enclosed within a package enclosure that exposes the external electrical contact surface of the electrical lead at an external surface of the packaging structure.
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Patent Agency Ranking
公开(公告)号：US10003320B1
公开(公告)日：2018-06-19
申请号：US15595486
申请日：2017-05-15
Applicant: SiTime Corporation
Inventor： David Raymond Pedersen , Aaron Partridge , Thor Juneau
CPC classification number: H03H9/2405 , H03H3/0072 , H03H9/02259 , H03H9/02433 , H03H9/2457 , H03H9/2468 , H03H2009/02456 , H03H2009/02496
Abstract: A microelectromechanical system (MEMS) resonator includes a resonant semiconductor structure, drive electrode, sense electrode and electrically conductive shielding structure. The first drive electrode generates a time-varying electrostatic force that causes the resonant semiconductor structure to resonate mechanically, and the first sense electrode generates a timing signal in response to the mechanical resonance of the resonant semiconductor structure. The electrically conductive shielding structure is disposed between the first drive electrode and the first sense electrode to shield the first sense electrode from electric field lines emanating from the first drive electrode.
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公开(公告)号：US20180155186A1
公开(公告)日：2018-06-07
申请号：US15805031
申请日：2017-11-06
Applicant: SiTime Corporation
Inventor： Pavan Gupta , Aaron Partridge , Markus Lutz
IPC: B81B7/00
CPC classification number: B81B7/0083 , B81B7/007 , B81B7/0077 , B81B2201/0271 , B81B2207/07 , B81B2207/094 , B81C1/0023 , B81C1/00301 , B81C1/00333 , B81C1/00341 , B81C2201/016 , B81C2203/0118 , B81C2203/0154 , H01L23/3107 , H01L23/34 , H01L23/498 , H01L2224/48091 , H01L2224/48245 , H01L2224/48247 , H01L2224/73265 , H01L2924/01019 , H01L2924/10253 , H01L2924/1461 , H01L2924/181 , H01L2924/00 , H01L2924/00014 , H01L2924/00012
Abstract: A low-profile packaging structure for a microelectromechanical-system (MEMS) resonator system includes an electrical lead having internal and external electrical contact surfaces at respective first and second heights within a cross-sectional profile of the packaging structure and a die-mounting surface at an intermediate height between the first and second heights. A resonator-control chip is mounted to the die-mounting surface of the electrical lead such that at least a portion of the resonator-control chip is disposed between the first and second heights and wire-bonded to the internal electrical contact surface of the electrical lead. A MEMS resonator chip is mounted to the resonator-control chip in a stacked die configuration and the MEMS resonator chip, resonator-control chip and internal electrical contact and die-mounting surfaces of the electrical lead are enclosed within a package enclosure that exposes the external electrical contact surface of the electrical lead at an external surface of the packaging structure.
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公开(公告)号：US09677948B1
公开(公告)日：2017-06-13
申请号：US14681848
申请日：2015-04-08
Applicant: SiTime Corporation
Inventor： Carl Arft , Aaron Partridge , Paul M. Hagelin
Abstract: A micromachined apparatus includes micromachined thermistor having first and second ends physically and thermally coupled to a substrate via first and second anchor structures to enable a temperature-dependent resistance of the micromachined thermistor to vary according to a time-varying temperature of the substrate. The micromachined thermistor has a length, from the first end to the second end, greater than a linear distance between the first and second anchor structures.
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公开(公告)号：US20170093361A1
公开(公告)日：2017-03-30
申请号：US15186510
申请日：2016-06-19
Applicant: SiTime Corporation
Inventor： Charles I. Grosjean , Nicholas Miller , Paul M. Hagelin , Ginel C. Hill , Joseph C. Doll , Trushal Chokshi , Yi Zhang , Aaron Partridge , Markus Lutz
CPC classification number: H03H3/0077 , H03H9/02259 , H03H9/02401 , H03H9/02448 , H03H9/1057 , H03H9/17 , H03H9/2463 , H03H2003/027 , H03H2009/02307 , H03H2009/155
Abstract: In a MEMS device having a substrate and a moveable micromachined member, a mechanical structure secures the moveable micromachined member to the substrate, thermally isolates the moveable micromachined member from the substrate and provides a conduction path to enable heating of the moveable micromachined member to a temperature of at least 300 degrees Celsius.
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公开(公告)号：US09434608B2
公开(公告)日：2016-09-06
申请号：US14524986
申请日：2014-10-27
Applicant: SiTime Corporation
Inventor： Aaron Partridge , Markus Lutz , Pavan Gupta
IPC: H01L23/051 , B81C1/00 , H01L41/113 , B81B7/00
CPC classification number: B81C1/00277 , B81B7/0035 , B81B7/0058 , B81B7/007 , B81B2201/0271 , B81B2203/0315 , B81B2203/04 , B81B2207/07 , B81C1/00269 , B81C1/00301 , B81C2201/0171 , B81C2203/031 , B81C2203/036 , B81C2203/037 , B81C2203/038 , H01L23/051 , H01L41/1136 , H01L2924/0002 , H01L2924/00
Abstract: A cavity is formed within a first substrate together with trenches that separate first and second portions of the first substrate from each other and from the remainder of the first substrate. The first portion of the first substrate is disposed within the cavity and constitutes a microelectromechanical structure, while the second portion of the substrate is disposed at least partly within the cavity and constitutes a first portion of an electrical contact. A second substrate is secured to the first substrate over the cavity to define a chamber containing the microelectromechanical structure. The second substrate has a first portion that constitutes a second portion of the electrical contact and is disposed in electrical contact with the second portion of the first substrate such that the electrical contact extends from within the chamber to an exterior of the chamber.
Abstract translation: 与第一衬底的第一和第二部分彼此分开并与第一衬底的其余部分分开的沟槽在第一衬底内形成空腔。 第一衬底的第一部分设置在空腔内并构成微机电结构，而衬底的第二部分至少部分地设置在空腔内并且构成电接触的第一部分。 第二衬底在空腔上固定到第一衬底以限定包含微机电结构的腔室。 第二基板具有构成电触点的第二部分的第一部分，并且设置成与第一基板的第二部分电接触，使得电触头从腔室内延伸到腔室的外部。
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