公开(公告)号：US20140285294A1

公开(公告)日：2014-09-25

申请号：US13907949

申请日：2013-06-02

Applicant: Texas Instruments Incorporated

Inventor： Baher Haroun ,  Juan Alejandro Herbsommer

IPC: H01P1/06

CPC classification number: H01P3/16 ,  G02B6/4416 ,  H01L2223/6677 ,  H01L2224/16227 ,  H01L2224/73204 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01P3/121 ,  H01P3/165 ,  H01P5/00 ,  H01P5/087 ,  H01P5/107 ,  H01P5/184 ,  H01P11/001 ,  H01P11/002 ,  H01Q1/50 ,  H01Q19/108 ,  H01Q19/30 ,  H04B1/40 ,  Y10T29/49016 ,  Y10T29/49826

Abstract: A rotatable coupler for dielectric wave guides is described. A first dielectric wave guide (DWG) has an interface surface at a one end of the DWG. A second DWG has a matching interface surface at an end of the second DWG. A rotatable coupling mechanism is coupled to the two DWG ends and is configured to hold the interface surface of the first DWG in axial alignment with the interface surface of the second DWG while allowing the interface surface of the first DWG to rotate axially with respect to the interface surface of the second DWG.

Abstract translation: 描述了用于介质波导的可旋转耦合器。 第一介质波导（DWG）在DWG的一端具有界面。 第二个DWG在第二个DWG的末尾具有匹配的界面。 可旋转的联接机构联接到两个DWG端部并且被配置为保持第一DWG的接口表面与第二DWG的界面表面轴向对准，同时允许第一DWG的界面相对于第二DWG轴向旋转 第二个DWG的界面。

公开(公告)号：US20240402654A1

公开(公告)日：2024-12-05

申请号：US18203741

申请日：2023-05-31

Applicant: Texas Instruments Incorporated

Inventor： Juan Herbsommer ,  Baher Haroun

IPC: G04F5/14

Abstract: In one example, a method includes placing a first glass substrate and a second glass substrate in a chamber. The first glass substrate has a first surface and the second glass substrate has a second surface. The first glass substrate and the second glass substrate are brought together in the chamber to form a junction between the first and second surfaces. The junction is sealed to form a glass container that encases a dipolar gas when the chamber is filled with the dipolar gas. An EM reflective coating is formed on an outer surface of the glass container.

公开(公告)号：US12127480B2

公开(公告)日：2024-10-22

申请号：US16932343

申请日：2020-07-17

Applicant: Texas Instruments Incorporated

Inventor： Umidjon Nurmetov ,  Ralf Peter Brederlow ,  Baher Haroun ,  Jose Antonio Vieira Formenti ,  Michael Szelong ,  Tobias Bernhard Fritz

IPC: G01L1/18 ,  G01L1/22 ,  H10N30/30 ,  H10N30/80

CPC classification number: H10N30/302 ,  G01L1/18 ,  G01L1/2268 ,  H10N30/802

Abstract: In described examples, a circuit includes an analog frontend arranged to generate an analog stress compensating signal in response to a to-be-compensated analog signal and a first-axis stress sensing signal. The analog frontend can comprise a first precision component (e.g., 220) arranged on a piezoelectric material and arranged to generate the to-be-compensated analog signal that is affected by a stress exerted in the piezoelectric material and a directional stress sensor arranged on the piezoelectric material and coupled to the first precision component. The directional stress sensor is arranged to generate the first-axis sensing signal in response to a longitudinal resultant of a stress exerted in the piezoelectric material. A compensating circuit is arranged to generate a compensated output signal in response to the compensating analog signal and to-be-compensated analog signal.

公开(公告)号：US11971476B2

公开(公告)日：2024-04-30

申请号：US17364011

申请日：2021-06-30

Applicant: Texas Instruments Incorporated

Inventor： Lei Ding ,  Srinath Mathur Ramaswamy ,  Brian Burk ,  Baher Haroun

IPC: G01S15/00 ,  G01S15/04

CPC classification number: G01S15/04

Abstract: Ultrasonic audio processing circuitry and a method useful in ultrasonic presence detection. An ultrasonic burst generator produces an ultrasonic burst signal at one or more ultrasonic frequencies, and an equalizer equalizes that ultrasonic burst signal according to frequency response characteristics of the speaker and microphone at those ultrasonic frequencies. Driver circuitry drives a speaker with the ultrasonic burst signal, which may be combined with an audible audio signal. An ultrasonic separation filter separates an ultrasonic portion from a signal received at a microphone, and processing circuitry is provided to determine a delay time of an echo corresponding to the ultrasonic burst signal in that separated ultrasonic portion of the received signal. In another aspect, the equalizer equalizes an ultrasonic portion of the signal received at a microphone, according to frequency response characteristics of the speaker and microphone at the ultrasonic frequencies of the burst.

公开(公告)号：US11885834B2

公开(公告)日：2024-01-30

申请号：US17463112

申请日：2021-08-31

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Lei Ding ,  Srinath Mathur Ramaswamy ,  Dok Won Lee ,  Baher Haroun ,  Wai Lee ,  Steven John Loveless

IPC: G01R15/20 ,  G01R19/10

CPC classification number: G01R15/202 ,  G01R19/10

Abstract: In a described example, a circuit includes a sensor circuit including multiple magnetic field sensors having respective sensor outputs. The magnetic field sensors are configured to provide magnetic field sensor signals at the respective sensor outputs representative of a measure of current flow through a conductive structure. A combiner interface has combiner inputs and a combiner output. The combiner inputs are coupled to the respective sensor outputs. The combiner interface is configured to provide an aggregate sensor measurement at the combiner output responsive to the magnetic field sensor signals, in which the aggregate sensor measurement is decoupled from magnetic fields generated responsive to the current flow through the conductive structure.

公开(公告)号：US11799184B2

公开(公告)日：2023-10-24

申请号：US17140858

申请日：2021-01-04

Applicant: Texas Instruments Incorporated

Inventor： Baher Haroun ,  Juan Alejandro Herbsommer ,  Gerd Schuppener ,  Swaminathan Sankaran

IPC: H01P5/08 ,  H01P11/00 ,  H01P3/16

CPC classification number: H01P5/087 ,  H01P3/16 ,  H01P11/001

Abstract: An interposer acts as a buffer zone between a transceiver IC and a dielectric waveguide interconnect and establishes two well-defined reference planes that can be optimized independently. The interposer includes a block of material having: a first interface region to interface with an antenna coupled to an integrated circuit (IC); and a second interface region to interface to the dielectric waveguide. An interface waveguide is formed by a defined region positioned within the block of material between the first interface region and the second interface region.

公开(公告)号：US20230184713A1

公开(公告)日：2023-06-15

申请号：US18066206

申请日：2022-12-14

Applicant: Texas Instruments Incorporated

Inventor： Sebastian Meier ,  Ernst Muellner ,  Helmut Rinck ,  Scott Summerfelt ,  Tobias Fritz ,  Baher Haroun

IPC: G01N27/414

CPC classification number: G01N27/4148 ,  G01N27/4146

Abstract: In some examples, an integrated circuit comprises: a semiconductor die including a semiconductor substrate, a dielectric layer on the semiconductor substrate, and a metallization structure encapsulated in the dielectric layer, in which the semiconductor substrate includes a transistor having a first current terminal, a second current terminal, and a channel region between the first and second current terminals, and the dielectric layer has a sensing side facing away from the semiconductor substrate; an insulation layer on the sensing side; a sensor terminal on the sensing side and over the channel region; and a restriction structure including an opening and a rigid silicon-based fluidic structure, in which the silicon-based fluidic structure is on the sensing side and encapsulates a fluid cavity on the sensing side, the sensor terminal is in the fluid cavity, and the restriction structure is configured to transport a fluid by microfluidic diffusion.

公开(公告)号：US11600581B2

公开(公告)日：2023-03-07

申请号：US17231897

申请日：2021-04-15

Applicant: Texas Instruments Incorporated

Inventor： Juan Alejandro Herbsommer ,  Hassan Omar Ali ,  Baher Haroun ,  Yigi Tang ,  Rajen Manicon Murugan

IPC: H01L23/66 ,  H01L21/48 ,  H01L23/495

Abstract: A packaged electronic device includes a multilayer lead frame having first and second trace levels, a via level therebetween, a conductive feed structure, and a conductive reflector wall. The first trace level includes a conductive coupler antenna and a conductive ground structure that extends in a plane of orthogonal first and second directions, and a portion of the conductive coupler antenna faces outward along a third direction orthogonal to the first and second directions. The conductive reflector wall has an opening and extends along the third direction between the first and second trace levels around a portion of the conductive coupler antenna. The conductive feed structure is coupled to the conductive coupler antenna and extends along the first direction through the opening of the conductive reflector wall.

公开(公告)号：US20230003880A1

公开(公告)日：2023-01-05

申请号：US17364011

申请日：2021-06-30

Applicant: Texas Instruments Incorporated

Inventor： Lei Ding ,  Srinath Mathur Ramaswamy ,  Brian Burk ,  Baher Haroun

IPC: G01S15/04

Abstract: Ultrasonic audio processing circuitry and a method useful in ultrasonic presence detection. An ultrasonic burst generator produces an ultrasonic burst signal at one or more ultrasonic frequencies, and an equalizer equalizes that ultrasonic burst signal according to frequency response characteristics of the speaker and microphone at those ultrasonic frequencies. Driver circuitry drives a speaker with the ultrasonic burst signal, which may be combined with an audible audio signal. An ultrasonic separation filter separates an ultrasonic portion from a signal received at a microphone, and processing circuitry is provided to determine a delay time of an echo corresponding to the ultrasonic burst signal in that separated ultrasonic portion of the received signal. In another aspect, the equalizer equalizes an ultrasonic portion of the signal received at a microphone, according to frequency response characteristics of the speaker and microphone at the ultrasonic frequencies of the burst.

公开(公告)号：US20220336383A1

公开(公告)日：2022-10-20

申请号：US17231897

申请日：2021-04-15

Applicant: Texas Instruments Incorporated

Inventor： Juan Alejandro Herbsommer ,  Hassan Omar Ali ,  Baher Haroun ,  Yigi Tang ,  Rajen Manicon Murugan

IPC: H01L23/66 ,  H01L23/495 ,  H01L21/48

Abstract: A packaged electronic device includes a multilayer lead frame having first and second trace levels, a via level therebetween, a conductive feed structure, and a conductive reflector wall. The first trace level includes a conductive coupler antenna and a conductive ground structure that extends in a plane of orthogonal first and second directions, and a portion of the conductive coupler antenna faces outward along a third direction orthogonal to the first and second directions. The conductive reflector wall has an opening and extends along the third direction between the first and second trace levels around a portion of the conductive coupler antenna. The conductive feed structure is coupled to the conductive coupler antenna and extends along the first direction through the opening of the conductive reflector wall.