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公开(公告)号：JPH11261195A
公开(公告)日：1999-09-24
申请号：JP7666698
申请日：1998-03-10
Applicant: TORAY INDUSTRIES
Inventor： MIYAJI SHINICHIRO , NAGASE NORIMASA , KUROME TAIICHI
Abstract: PROBLEM TO BE SOLVED: To improve the print workability of solder and make it best suited to a high-accuracy circuit board by a means such that the solder printing masking material is a plastic film having specified content of grains of specified mean size as well as specified mean breakdown elongation, heat shrinkage ratio and surface tension. SOLUTION: To a plastic film for a solder printing masking material, a polyphenylene suphide film is best suited in view of characteristics, such as heat resistance and mechanical characteristic and workability, an contains grains of a mean grain size of 2 μm or less, 1.5 wt.% or less. The grain may use a metal compd. such as metal oxides, silica compound, etc., mineral powder, F compd. or So compd., etc. The plastic film has a mean breakdown elongation of 20-110% (preferable 25-100%), heated shrinkage ratio of ±1.5% or less at 150 deg.C and a surface tension (measured in accordance with JISK6768) of 40 mN/m or less.
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公开(公告)号：JPH06136152A
公开(公告)日：1994-05-17
申请号：JP28312692
申请日：1992-10-21
Applicant: TORAY INDUSTRIES
Inventor： KIDA KENJI , MIYAJI SHINICHIRO , UEDA TOMOAKI
Abstract: PURPOSE:To obtain a biaxially oriented polyphenylene sulfide film having excellent heat resistance and mechanical properties and bondability made of a composition comprising a polyphenylene sulfide and a specified amount of a polyalkylene glycol. CONSTITUTION:The film is made of a composition comprising 100 pts.wt. polyphenylene sulfide desirably one having a melt viscosity of 500-12000 P under an apparent shear rate of 200/sec at 300 deg.C more desirably one comprising at least 80mol%, based on the total repeating units, p-phenylene sulfide units and 0.01-30 pts.wt. polyalkylene glycol (e.g. polyethylene glycol).
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公开(公告)号：JPH06126900A
公开(公告)日：1994-05-10
申请号：JP28312792
申请日：1992-10-21
Applicant: TORAY INDUSTRIES
Inventor： KIDA KENJI , MIYAJI SHINICHIRO , UEDA TOMOAKI
Abstract: PURPOSE:To provide a film having excellent adhesive properties and balanced mechanical properties and heat resistance. CONSTITUTION:A laminated polyphenylene sulfide film is obtained by laminating a surface layer made of thermoplastic resin film containing 0.01-30 pts.wt. of polyalkylene glycol to 100 pts.wt. of thermoplastic resin at least one side of a central part of a biaxially oriented polyphenylene sulfide film.
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公开(公告)号：JPH05338084A
公开(公告)日：1993-12-21
申请号：JP34338591
申请日：1991-12-25
Applicant: TORAY INDUSTRIES
Inventor： MIYAJI SHINICHIRO , DEGUCHI YUKICHI , KOBAYASHI HIROAKI
Abstract: PURPOSE:To obtain a laminated film excellent in both heat resistance and impact resistance by a method wherein biaxially-oriented poly-p-phenylene sulfide films are laminated with each other through an adhesive, and the hardness index of the adhesive layer is set to be within a speficied range. CONSTITUTION:A laminated film is obtained by laminating biaxially-oriented poly-p-phenylene sulfide films with each other through an adhesive. The hardness index of the adhesive layer is set to range 1-3000. In this invention, the biaxially- oriented poly-p-phenylene sulfide film is prepared by a method in which a resin composition mainly composed of poly-p-phenylene sulfide is melted, molded into a sheet form, biaxially oriented, and thermally treated. The resin composition contains 90wt.% or more poly-p-phenylene sulfide. The poly-p-phenylene sulfide is a polymer in which 70mol% or more of repeating units are made of a structural unit separately shown by a structural formula.
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公开(公告)号：JPH05286084A
公开(公告)日：1993-11-02
申请号：JP9077492
申请日：1992-04-10
Applicant: TORAY INDUSTRIES
Inventor： KIDA KENJI , MIYAJI SHINICHIRO , UEDA TOMOAKI
Abstract: PURPOSE:To obtain a release film applied as a carrier sheet at the time of cast molding such as a ceramic sheet by forming a coating layer composed of a silicone resin onto one surface, etc., of a polyphenylene sulfide film while specifying a heat shrinkage factor. CONSTITUTION:A release film is constituted by forming a coating layer consisting of a silicone resin onto at least one surface of a poly-phenylene sulfide film. A heat shrinkage factor for thirty min at 100 deg.C is set in 0.3% or less. Consequently, the release film constituted is particularly applied as a carrier sheet at the time of cast molding such as a ceramic sheet. On the other hand, poly-p-phenylene sulfide is used as the main object of polyphenylene sulfide, and a substance, in which there is a not less than 70mol% p-phenylene sulfide unit, is favorable. The partial crosslinked body of organic polysiloxane is employed as the silicone resin, and an alkyl group, etc., are used as an organic chain bonded with a siloxane unit.
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Patent Agency Ranking
公开(公告)号：JPH04232739A
公开(公告)日：1992-08-21
申请号：JP41538790
申请日：1990-12-28
Applicant: TORAY INDUSTRIES
Inventor： MIYAJI SHINICHIRO , KIDA KENJI , DEGUCHI YUKICHI
Abstract: PURPOSE:To provide a heat-resistant base material well-balanced in various characteristics such as heat resistance, the dimensional stability against heat and humidity, fire retardancy, the stability against high frequency or flexibility and especially optimum in the adaptation to a printed circuit board. CONSTITUTION:A laminate is formed by fixing a non-stretched sheet (B-layer) based on poly-p-phenylene sulfide and a biaxially oriented poly-p-phenylene sulfide (C-layer) to at least the single surface of a fiber sheet (A-layer) in this order without using an adhesive and the residual crystallization energy Ht of the B-layer is 20% or more of the crystallization energy Hq of the resin constituting the B-layer and the C-layer substantially has no heat generating peak due to crystallization within the temp. range of 20-180 deg.C. A printed circuit board is obtained by providing an electric circuit to at least the single surface of the laminate.
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公开(公告)号：JPH03227624A
公开(公告)日：1991-10-08
申请号：JP2476590
申请日：1990-02-02
Applicant: TORAY INDUSTRIES
Inventor： MUTAGUCHI YASUHIKO , DEGUCHI YUKICHI , MIYAJI SHINICHIRO
Abstract: PURPOSE:To improve adhesive properties and tear strength by fixing a non- oriented polyphenylenesulfide film layer and a biaxially oriented polyphenylenesulfide film layer, both having specific crystallization energy properties, without an adhesive, and defining the thickness ratio of both layers. CONSTITUTION:A laminated body is composed of a biaxially oriented polyphenylenesulfide film layer(B layer) fixed to at least, one side of a non- oriented polyphenylenesulfide layer(A layer) without an adhesive. The residual crystallization energy DELTAHt of the A layer is equal to 20% or more of the crystallization energy DELTAHq of a resin constituting the A layer. In addition, the B layer has no heating peak resulting from a substantial crystallization process in the temperature range of 20 to 18 deg.C. Also the thickness ratio of the B and A layers is set in the range of 0.2 or more to 5.0 or less. Thus the material has well-balanced properties at a high level in terms of resistance against heat, humidity, impact and flame retardation. Subsequently, a laminated body demonstrating high adhesive properties and high tear strength is obtained.
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公开(公告)号：JPH0390349A
公开(公告)日：1991-04-16
申请号：JP22661489
申请日：1989-08-31
Applicant: TORAY INDUSTRIES
Inventor： MIYAJI SHINICHIRO , DEGUCHI YUKICHI
Abstract: PURPOSE:To lower welding temperature and obviate the heat deterioration of PPS-BO and the lowering of a mechanical property, and improve the tearing strength as compared with a single body of PPS-BO by laminating a non- oriented polyphenylenesulfide sheet (PPS-NO) and metallic plate in this order without an adhesive at least on one surface of a biaxial oriented polyphenylenesulfide film (PPS-BO). CONSTITUTION:PPS-BO is a film of the type that a resin composition containing polyphenylenesulfide at 90wt.% or more is melted and molded into a sheet and then subjected to a biaxial orientation and heat treatment. The thickness of the film is preferred to be in the range of 3-300mum. A metallic plate used herein is metal such as copper, aluminum, iron, zinc or the like and alloy of these metal and are in the thickness of 1.2mm or less. Such laminate is made such that PPS-NO is laminated at least on one surface of PPS-BO via no adhesive, and further, metallic plate is laminated on the side of PPS-NO of the laminated film without the adhesive.
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公开(公告)号：JPH0327982A
公开(公告)日：1991-02-06
申请号：JP15315489
申请日：1989-06-15
Applicant: TORAY INDUSTRIES
Inventor： MIYAJI SHINICHIRO , DEGUCHI YUKICHI
Abstract: PURPOSE:To prevent the generation of difference in level on the surface of a laminate and to prevent the levitation of a protective layer even when the laminate is bent by providing an adhesive layer bonding the B-layer and C-layer of the laminate on the outside of the end part on the side including the projection-like body of the B-layer. CONSTITUTION:A laminate has fundamental constitution wherein a layer (A- layer) composed of a sheet-like material having a projection-like body, the spacer layer 3 (B-layer) provided so as to surround the projection-like body 2 of the A-layer and the protective layer 5 (C-layer) on the B-layer are laminated to a base material layer 1 through adhesive layers 4 in the order of A-layer/ B-layer/C-layer. Herein, it is necessary that the adhesive layer 4 bonding the B-layer and the C-layer is provided on the outside of the end part on the side including the projection-like body 2 of the B-layer 3. By this constitution, the difference in level generated at the part of the projection-like body 2 built in the laminate or at the boundary part of the spacer layer 3 and the projection- like body 2 can be eliminated and the laminate having a smooth surface prevented from the levitation of the protective layer 5 at the time of bending can be obtained.
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公开(公告)号：JPS62292432A
公开(公告)日：1987-12-19
申请号：JP13718186
申请日：1986-06-12
Applicant: TORAY INDUSTRIES
Inventor： DEGUCHI YUKICHI , MIYAJI SHINICHIRO , KOBAYASHI HIROAKI
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