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公开(公告)号：JPH04184963A
公开(公告)日：1992-07-01
申请号：JP31291090
申请日：1990-11-20
Applicant: TOSHIBA CORP
Inventor： KUNO KATSUMI , SASAKI TOMIYA , IWASAKI HIDEO , ISHIZUKA MASARU
IPC: H01L23/36
Abstract: PURPOSE:To make it possible to connect reliably heating units to a heat dissipation means regardless of the sizes and inclination of the heating units by a method wherein with particles having a heat conductivity encapsulated between the heating units and the heat dissipation means, one part of an enclosure is formed into a flexible structure. CONSTITUTION:A heat sink 25 of a semiconductor package 15 is constituted of an insulating film 17, whose one part is flexible, and metallic particles 21, whose diameters are different from each other, and a heat transfer fluid 23 is filled in spaces 19 between the particles 21 between the film 17 and a cap 9. Heats of chips 1 are transferred to the particles 21 via the film 17 and after being transferred to the fellow particles 21, the heats are emitted to the outside through heat dissipation fins 11 via the cap 9. In this constitution, as one part of the film 17 is flexible, while an irregularity in the heights of the chips 1 above a substrate 3 and the inclination of the chips 1 are absorbed, the sink 25 can reliably come into contact to the back surfaces of the chips 1 and the heats of the chips 1 can be efficiently transferred to the sink 25.
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公开(公告)号：JPH01189573A
公开(公告)日：1989-07-28
申请号：JP1269788
申请日：1988-01-25
Applicant: TOSHIBA CORP
Inventor： SASAKI TOMIYA , MIYAZAKI YOSHIRO , MIYAZAKI TSUTOMU
Abstract: PURPOSE:To make it possible to increase a cooling efficiency, by integrating a cooling air channel from an intake port of a circuit board accommodating element through between the circuit boards and from a discharge port provided in the vicinity of the center to a blower. CONSTITUTION:Cooling air is taken, through a blower 20, from an intake port 8 provided on the lateral side of an outer cover 17 of circuit board accommodating element 3 into a test head 2. Then it flows through between circuit boards 13 and then to a ventilation hole 15 provided in the central part of a connector board 6. Next, it passes through a duct 14 joined to this ventilation hole 15 and is discharged outside by the blower 20 through a stretch hose. In this way, the board 13 can be cooled uniformly.
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公开(公告)号：JPS6414804A
公开(公告)日：1989-01-19
申请号：JP17019487
申请日：1987-07-08
Applicant: TOSHIBA CORP
Inventor： YOSHIKAWA YUKIO , TANAKA TOSHIYA , UEDA AKIHIRO , KIMURA MITSUTOSHI , OGISHI KAZUHISA , MISONO KATSUHIDE , SASAKI TOMIYA
IPC: F21S2/00
Abstract: PURPOSE: To forcibly discharge the air heated in a heat insulating air layer by providing a vent pipe communicating the heat insulating air layer formed on a closing member with the outside of a cover through the chamber of the cover. CONSTITUTION: A cylinder section 2 is formed at one end of a cover 1, and a base 3 is fitted to the cylinder section 2. A closing member is fitted to the other end opening of the cover 1. The member 4 is formed with a pair of partition boards 5, 6, and a heat insulating air layer 8 is formed between the boards 5, 6. A lighting circuit component storage chamber 11 is formed in the cover 1, and a lighting circuit component 13 is stored in the chamber 11. A vent pipe 17 is provided through the chamber 11 in the axial direction, one end of the vent pipe 17 is connected to the board 5 and opened to the layer 8, and the other end is connected to a partition wall 10 and communicated with an atmosphere open chamber 12. The air heated in the layer 8 flows out into the chamber 12 through the vent pipe 17 and is discharged to the outside from the chamber 12.
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公开(公告)号：JPS6414803A
公开(公告)日：1989-01-19
申请号：JP17019387
申请日：1987-07-08
Applicant: TOSHIBA CORP
Inventor： OGISHI KAZUHISA , MISONO KATSUHIDE , SASAKI TOMIYA , YOSHIKAWA YUKIO , TANAKA TOSHIYA , UEDA AKIHIRO , KIMURA MITSUTOSHI
IPC: F21S2/00
Abstract: PURPOSE: To prevent the temperature rise of a heat insulating air layer by providing vent pipe communicated with the heat insulating air layer at the base end and opened to the tip side in the axial direction than the electrode of a fluorescent lamp at the tip on a closing member. CONSTITUTION: A cylinder section 2 is formed at one end of a cover 1, and a base 3 is fitted to the cylinder section 2. The other end opening of the cover 1 is closed by a closing member 4. The closing member 4 is formed with a pair of partition boards 5, 6, and a heat insulating air layer 8 is formed between the boards 5, 6. The layer 8 is communicated with the outside over the whole periphery. A high-frequency lighting circuit component 11 is stored in the cover 1. A bent fluorescent lamp 15 is fitted to the board 6 of the member 4. A vent pipe 20 is protruded toward a lamp 15 side on the board 6, its base end is communicated with the layer 8, and its tip is opened to the atmosphere. The outside air is fed into the layer 8 through the vent pipe 20, and the air heated in the layer 8 is urged to flow out to the outside.
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公开(公告)号：JPS61218148A
公开(公告)日：1986-09-27
申请号：JP5826885
申请日：1985-03-25
Applicant: TOSHIBA CORP
Inventor： SASAKI TOMIYA , MIYAZAKI YOSHIRO , ISHIZUKA MASARU , FUKUOKA YOSHITAKA
IPC: H01L23/427 , H01L23/473
Abstract: PURPOSE:To improve the sealability by sealing grooves at least with any of a heat sink metal plate contacted with the back surface of a substrate and the substrate, providing corners in the section, and providing a coolant passage sealed with coolant, thereby readily sealing the coolant. CONSTITUTION:A substrate 1 is formed of a ceramic material for placing an IC chip A of a semiconductor device. A heat sink metal plate 2 of copper is contacted fixedly with the back surface of a chip A placing surface. Several fine grooves 4 are formed in parallel on the back surface of the substrate 1 contacted with the plate 2, and formed by sealing with the plate 2 in the coolant passage 3 of the square-sectional shape. Coolant 5 is sealed in the passage 3, and collected at the corner 3a of the passage 3 due to a capillary phenomenon at ambient temperature. Thus, since a pipe for sealing the coolant 5 can be connected with the passage 3, the sealability and the sealing of the coolant can be facilitated.
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Patent Agency Ranking
公开(公告)号：JPS59154516A
公开(公告)日：1984-09-03
申请号：JP2851083
申请日：1983-02-24
Applicant: Toshiba Corp
Inventor： SASAKI TOMIYA , ISHIZUKA MASARU
CPC classification number: G05D23/08
Abstract: PURPOSE:To obtain large capability of heat radiation through simple constitution by providing a heat insulating board for an artificial satellite with blades made of bimetals which deform by heat radiated from the heat insulating board and a frame which cuts off external radiant heat. CONSTITUTION:This controller consists of the heat insulating board 6 which radiates the heat in a satellite, blades 7 made of the bimetals which vary above some set temperature by the radiated heat, and frame 8 which cuts off external radiant heat. Then, heat generated by components, etc., in the satellite is radiated and conducted to the specularly finished blades 7 made of the bimetals through the heat insulating board 6 covered with silver ''Teflon'', etc. The blades 7 vary in limit above the set temperature by said heat to control the amount of heat radiation.
Abstract translation: 目的：通过提供一种人造卫星的隔热板，通过提供由隔热板辐射的热量变形的双金属刀片和切断外部辐射热的框架，来获得大的散热能力。 构成：该控制器由辐射卫星中的热量的隔热板6和由辐射热量在一定设定温度以上变化的双金属制成的叶片7和切断外部辐射热的框架8组成。 然后，通过由银“特氟纶”等覆盖的绝热板6辐射并传导到由双金属片制成的镜面成品刀片7上，由卫星中的部件等产生的热量传播到刀片7上。刀片7的极限变化 高于所设定的温度通过所述的热量来控制散热量。
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公开(公告)号：JPS594889A
公开(公告)日：1984-01-11
申请号：JP11080482
申请日：1982-06-29
Applicant: Toshiba Corp
Inventor： SASAKI TOMIYA , MIYAZAKI YOSHIROU , ISHIZUKA MASARU
CPC classification number: A47J27/57
Abstract: PURPOSE:To contrive to maintain the hot-water temperature intact after being boiled in a kettle without necessity of transferring the excessive hot-water into another heat insulation type vessel by a method wherein a sealing space surrounded by an inner vessel and an outer vessel is evacuated to make vacuum, and a refrigerant medium is sealed into said sealing space surrounded by the bottom part at both of the inner and outer vessels, and the lower vessel after said sealing space is evacuated. CONSTITUTION:A heat insulation hot-water heater is composed of an inner vessel 1 containing a water 7, a cylindrical outer vessel 2 surrounding the periphery side of the inner vessel 1, upper and lower ends of which is connected with said inner vessel 1, and cylindrical lower vessel 4 having a bottom, while the upper end of which is connected with said outer vessel 2. The inner vessel 1 and the outer vessel 2 are thermally separated by the vacuum heat insulation, a refrigerant 5 is sealed into the sealed space surrounded by a bottom part 3 of both of the inner vessel 1 and the outer vessel 2, and the lower vessel 4. As for the heat dissipating from a boiled hot-water 7, the heat dissipation caused by the convection toward the side surface can be prevented by the vacuum existing between the inner vessel 1 and the outer vessel 2. Although the space surrounded by the inner vessel 1, the outer vessel 2 and the lower vessel 4 is filled up with the refrigerant 5 and the gas, the heat source is located at the upper part of the vessel 4, thereby the convection does not occur, accordingly, the heat dissipation toward the lower surface can be prevented.
Abstract translation: 目的：为了保证在水壶中煮沸之后保持热水温度不变，不需要通过其中由内容器和外容器包围的密封空间是过量热水转移到另一绝热型容器中的方法 抽真空以制冷，并且在所述密封空间被抽空之后，制冷剂介质被密封在由内部和外部容器两者的底部包围的所述密封空间中，下部容器被密封。 构成：隔热热水器包括内容器1，内容器1包含水7，围绕内容器1的周边的圆筒形外容器2，其内端与下容器1连接， 具有底部的圆柱形下部容器4，其上端与所述外部容器2连接。内部容器1和外部容器2通过真空隔热层热分离，制冷剂5被密封到密封空间 由内容器1和外容器2的底部3以及下容器4包围。对于从煮沸的热水7散发的热量，由朝向侧面的对流引起的散热可以 可以通过内部容器1和外部容器2之间的真空来防止。尽管由内部容器1，外部容器2和下部容器4包围的空间填充有制冷剂5和气体，但是热源 位于容器4的上部，因此不会发生对流，因此可以防止向下表面的散热。
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公开(公告)号：JPS58182085A
公开(公告)日：1983-10-24
申请号：JP6467782
申请日：1982-04-20
Applicant: Toshiba Corp
Inventor： SASAKI TOMIYA , ISHIZUKA MASARU
CPC classification number: F28D15/046
Abstract: PURPOSE:To easily and accurately insert a wick in a vessel by a structure wherein the part to be the wick is made of a shape memory alloy. CONSTITUTION:Wire gauze 3 made of a shape memory alloy is formed in the form of a cylinder, the size of which is same as or a little larger than the inside diameter of the vessel at a temperature before the change occurs. The wire gauze 3 is inserted in the vessel in the state being rolled up to the size smaller than the inside diameter of the vessel 2 under the normal room temperature. When heated up to the temperature, at which the wire gauze 3 changes itself, under the state as just described above, the wire gauze 3 returns or about to return to its former form, resulting in tightly fixing to the inner wall of the vessel 2.
Abstract translation: 目的：为了容易且准确地将灯芯插入容器中，其中作为灯芯的部件由形状记忆合金制成。 构成：由形状记忆合金制成的丝网3以气缸的形式形成，其尺寸在变化发生之前的温度下与容器的内径相同或稍大。 丝网3在正常室温下被卷起至小于容器2的内径的尺寸的状态下插入容器中。 当加热到丝网3自身变化的温度时，在如上所述的状态下，丝网3返回或返回到其前一种形式，从而紧密地固定到容器2的内壁 。
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公开(公告)号：JP2010187964A
公开(公告)日：2010-09-02
申请号：JP2009036239
申请日：2009-02-19
Applicant: Toshiba Corp , Toshiba Medical Systems Corp , 東芝メディカルシステムズ株式会社 , 株式会社東芝
Inventor： SASAKI TOMIYA
IPC: A61B6/03
Abstract: PROBLEM TO BE SOLVED: To easily increase the number of movement shafts of a bed as regards a bed device and an X-ray CT apparatus.
SOLUTION: A forward/backward movement unit 22a supports a top board 21 so as to be movable in forward/backward directions being an arrangement direction of a mount part 10 (a direction indicated by an arrow L1 and a direction indicated by an arrow L2 opposite to the direction L1 in the figure). An vertical movement unit 22b supports the top board 21 so as to be movable in vertical directions (a direction indicated by an arrow L3 and a direction indicated by an arrow L4 opposite to the direction L3 in the figure). A horizontal movement unit 23 supports the bed 22 in horizontal directions being the width direction of the top board 21 (a direction indicabed by an arrow L5 and a direction indicated by an arrow L6 opposite to the direction L5 in the figure).
COPYRIGHT: (C)2010,JPO&INPITAbstract translation: 要解决的问题：为了容易地增加关于床装置和X射线CT装置的床的移动轴的数量。 解决方案：向前/向后移动单元22a支撑顶板21，以便能够沿着安装部10的布置方向（箭头L1所示的方向和由箭头L1表示的方向）的前后方向移动 箭头L2与图中的方向L1相反）。 垂直移动单元22b支撑顶板21，以便在垂直方向（由箭头L3表示的方向和与图中的方向L3相反的箭头L4所示的方向）上可移动。 水平移动单元23在水平方向上支撑床22，即顶板21的宽度方向（由箭头L5表示的方向和与图中的方向L5相反的箭头L6所示的方向）。 版权所有（C）2010，JPO＆INPIT
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公开(公告)号：JP2008029828A
公开(公告)日：2008-02-14
申请号：JP2007166488
申请日：2007-06-25
Applicant: TOSHIBA CORP , TOSHIBA MEDICAL SYS CORP , TOSHIBA MEDICAL SYS CO LTD
Inventor： AMANOME TAKEO , SASAKI TOMIYA
Abstract: PROBLEM TO BE SOLVED: To provide a medical image diagnosis device, which may correct an influence of flexure of a top plate without any large change in hardware configuration of the device. SOLUTION: A tomographic image of the top plate 31 in the non-placing state where a subject P is not placed is previously obtained. The subject P is placed on the top plate 31 to obtain a tomographic image (a tomographic image in the placing state). This tomographic image includes the image of the top plate 31. A displacement computing part 45 obtains a vertical displacement concerning the image of the top plate 31 in the non-placing state and the image of the top plate 31 in the tomographic image in the placing state. The side surface of the top plate 31 is provided with a marker 31(i) showing the detecting position (the reference position) for displacement. A corrected image forming part 47 corrects the vertical position of the image data of the tomographic image in the placing state. COPYRIGHT: (C)2008,JPO&INPIT
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