Abstract:
PROBLEM TO BE SOLVED: To provide an electric wire and cable using a non-halogen flame retardant resin composition having excellent flame retardancy, colorability and water resistance and yet no change in color of conductor. SOLUTION: The resin composition that is composed of a modified polyolefin-based resin composition obtained by grafting a vinyl group-containing phosphate compound onto a polyolefin-based resin and an acid acceptor doped to the modified polyolefin resin is used in an insulator or a sheath. COPYRIGHT: (C)2011,JPO&INPIT
Abstract:
The present invention relates to halogen-free flame retardant compositions essentially comprising polyamide polymers (preferred is PA6), at least an Hypophosphorous acid metal salt (preferred is Aluminium hypophosphite), at least an organic phosphinate metal salt (preferred is Aluminium Di Ethyl Phosphinate), at least a Nitrogen based flame retardant agent (preferred is Melamine Cyanurate), at least an organic polyhydric polymer (preferred is EVOH) and optionally further conventional components. Such compositions are highly flame retarded at low thickness and have high Glow Wire temperature resistance.
Abstract:
Provided in the present invention are a halogen-free epoxy resin composition, prepreg and laminate using the same, the halogen-free epoxy resin composition comprising: (A) a halogen-free epoxy resin; (B) a crosslinking agent; and (C) a phosphorous-containing phenolic resin, the phosphorous-containing phenolic resin being formed by a synthesis of phenol and formaldehyde with dicyclopentadiene phenol, and being substituted by 9,10-dihydro-9-oxa-10-phosphapheanthrene-10-oxide or a derivative thereof The prepreg and laminate prepared from the halogen-free epoxy resin composition have a high heat resistance, a low dielectric constant, a low dielectric loss factor and a low water absorption rate, and achieve halogen-free flame retardance.
Abstract:
The present invention relates to halogen-free flame retardant compositions essentially comprising polyamide polymers (preferred is PA6), at least an Hypophosphorous acid metal salt (preferred is Aluminium hypophosphite), at least an organic phosphinate metal salt (preferred is Aluminium Di Ethyl Phosphinate), at least a Nitrogen based flame retardant agent (preferred is Melamine Cyanurate), at least an organic polyhydric polymer (preferred is EVOH) and optionally further conventional components. Such compositions are highly flame retarded at low thickness and have high Glow Wire temperature resistance.
Abstract:
The present invention pertains to a fluorine-free composition for treating textile articles being water repellant, sol resistant and stain resistant, especially carpets comprising a first composition comprising an aqueous silicone emulsion, an aqueous dispersion of a silane quaternary ammonium salt and water and a second composition comprising a soil repellency component that is an aqueous dispersion of colloidal organosiloxane copolymers.
Abstract:
The present invention discloses a halogen-free resin composition, and a prepreg and a laminate used for printed circuit. The halogen-free resin composition comprises: alkyl phenol epoxy resin; benzoxazine resin; alkyl phenol novolac curing agent; phosphorus-containing flame retardant. The alkyl phenol epoxy resin used in the present invention has many alkyl branched chains in its molecular structure, making the composition have excellent dielectric properties while it has higher glass transition temperature, low water absorption and good heat resistance. Mixing benzoxazine resin into the composition can further reduce dielectric constant, dielectric loss value and water absorption of the cured product. With alkyl phenol novolac being used as curing agent, the advantages that the molecular structure thereof has many alkyls and thus the dielectric properties are excellent and the water absorption is low are fully played. A prepreg and a laminate used for printed circuit prepared using the resin composition have low dielectric constant, low dielectric loss factor, low water absorption, high dimensional stability, high thermal resistance and good flame retardancy, processability and chemical resistance.
Abstract:
The present invention relates to a halogen-free resin composition and a prepreg and a laminated board prepared therefrom. The halogen-free resin composition contains the following components in parts by weight: 50-100 parts of an epoxy resin; 20-70 parts of benzoxazine; 5-40 parts of a polyphenyl ether; 5-40 parts of allyl benzene-maleic anhydride; 10-60 parts of a halogen-free flame retardant; 0.2-5 parts of a curing accelerator, and 20-100 parts of a filler. The prepreg and laminated board prepared from the halogen-free resin composition have comprehensive performances such as a low dielectric constant, a low dielectric loss, an excellent flame retardance, heat resistance, cohesiveness and moisture resistance, etc,. and are suitable for use in a halogen-free high multilayer circuit board.
Abstract:
Disclosed are a halogen-free resin composition, and a prepreg and a laminate prepared by using the same. The halogen-free resin composition comprises the following components according to organic solid matters by weight parts: (A) 40-80 parts by weight of allyl modified benzoxazine resin; (B) 10-20 parts by weight of hydrocarbon resin; (C) 10-40 parts by weight of allyl modified polyphenylene oxide resin; (D) 0.01-3 parts by weight of initiating agent; (E) 10-100 parts by weight of filler; and (F) 0-80 parts by weight of phosphoric flame retardant. The prepreg and the laminate prepared by using the halogen-free resin composition have lower dielectric constant and lower dielectric loss tangent value, higher peeling strength, higher glass transition temperature, excellent heat resistance and good flame retardant effect.