Abstract:
A rack assembly includes a nineteen-inch sub-assembly coupled to a four-inch extension that comprises two substantially closed side panels adjacent to each other, two substantially open sides adjacent to each other, a closed top and bottom, a plurality of mounting flanges for attaching the extension to a nineteen-inch sub-assembly and a plurality of embossments for receiving mounting hardware for installing the sub-assembly and extension into a twenty-three-inch rack. The four-inch extension is formed not only to allow a nineteen-inch rack sub-assembly to be installed in a twenty-three-inch rack, but also is formed to conduct air exhausted from a side of the nineteen-inch sub-assembly towards a rear end of the twenty-three-inch rack.
Abstract:
A chassis arrangement that minimizes lateral flame spread from card to card within the chassis, and increases heat dissipation from the chassis, comprising a heat sink attached to the inside of the chassis cover to dissipate excess heat from within the chassis, and PCB shields disposed between the circuit cards of the chassis and acting in concert with the heat sink to act as physical and thermal barriers to prevent lateral flame spread from card to card due to flame and hot gas wrap-around.
Abstract:
The invention refers to a telecommunications system comprising a module rack that defines a core bay, a service plane and a rack interface plane where the service plane is transverse to the rack interface plane. The core bay is in part bounded by the service plane and the rack interface plane. The telecommunications system also comprises a series of electronics modules each defining an electronics orientation plane where each of the modules includes two opposed cooling surfaces oriented substantially parallel to the electronics orientation plane. Each of the electronics modules is removably secured within the core bay. The series of the electronics modules forms an array such that their electronics orientation planes are substantially perpendicular to both the rack interface plane and the service plane. The array also defines at least one coolant stream passage across each cooling surface. Further the telecommunications system includes a coolant movement means for moving a coolant through the coolant stream passages and across the rack interface plane. As such, the coolant convects heat away from the cooling surfaces of electronics modules more efficiently and effectively than found in the prior art as it, amongst other things, shortens the distance over which the inlet coolant is required to travel to cool the same functional density and provides a coolant to the passage at approximately a uniform temperature for each module.
Abstract:
The compact PCI cabinet includes an inlet port for receiving external air, a set of blowers for drawing the air into the cabinet and for expelling the air from an exhaust port of the cabinet after having cooled internal active circuits, and a plurality of louvers and openings that create thermal convection within a back portion of the compact PCI cabinet to cool active components coupled to the back side of the back plain of the compact PCI system. Additionally, a plurality of perforated air openings located approximately at the bottom and back side of a side panel of the compact PCI cabinet also is included to conduct an receive some air from the external environment. Openings are formed between a plurality of card guides located approximately at the top of the back side of the back portion of the PCI cabinet for conducting air in and out of the back portion of the cabinet. A pin field coupled to a heat sink is placed in the air path between the blowers and the openings through which the air may be conducted into the back portion of the compact PCI cabinet to reduce the exhaust air temperature. Finally, the invention includes a thermistor placed in the exhaust path so that the fan speed of the blowers maybe adjusted according to the temperature of the exhaust after passing through the pin field.
Abstract:
A power distribution apparatus includes an electronic chassis, a power distribution member and a first power supply. The electronic chassis includes a front wall, a back wall and first and second side walls. The power distribution member is positioned within the electronic chassis between the first and second side walls. The first power supply is mounted to an outer surface of the first side wall. Power is distributed from the first power supply to the power distribution member.
Abstract:
The disclosure describes an active network interface device (NID) enclosure having a modular construction that provides flexibility to a vendor and permits independent access to technician-accessible connections and subscriber-accessible connections while promoting resistance to environmental and security threats. The active NID enclosure includes an electronics enclosure and an access enclosure. The electronics enclosure contains active electronic components for conversion of data carried on a network signal carrier into services for delivery to subscriber devices. The access enclosure includes two separate access compartments, having separate covers, for independent access to either network terminals or subscriber terminals.
Abstract:
Die Erfindung betrifft eine Verteilereinrichtung (1) für die Kommunikations- und Datentechnik, umfassend mindestens ein Verteileranschlussmodul (7), wobei das Verteileranschlussmodul (7) ein Gehäuse (16, 17) umfasst, in dem von aussen zugänglich Eingangs- und Ausgangskontakte zum Anschliessen von Leitungen, Kabeln oder Adern angeordnet sind, wobei die Verteilereinrichtung (1) mindestens ein weiteres Anschlussmodul (2) umfasst, wobei das Anschlussmodul (2) mindestens eine SDH/SONET-Transport-Schnittstelle (6) und Ausgänge für elektrische Signale umfasst, wobei die Ausgänge des Anschlussmoduls (2) mit den Eingängen des Verteileranschlussmoduls (7) verbunden sind, wobei das Anschlussmodul (2) mindestens einen Konverter zur Umsetzung von SDH/SONET-Transport-Signalen in E1-Signale und umgekehrt umfasst, sowie ein zugehöriges Anschlussmodul (2) und ein zugehöriges Verteileranschlussmodul (7).
Abstract:
A chassis and associated telecommunication circuit card are disclosed. The chassis has heat dissipation and flame containment features while accommodating a high density of the circuitry cards. Embodiments include an inner housing with a double-layer middle floor dividing the chassis into top and bottom chambers. Each layer has partially aligned slots, and an air gap is provided between the two layers. Embodiments also include a double-layer mesh cover with an air gap existing between the two mesh layers. Projections and grooves are provided on the inner surfaces of the inner housing to receive circuit cards having a guide on one edge and a fin on another. The circuit card includes conductor structures such as multiple board layers with paired and segregated conductors. The circuit card also includes some components positioned to cooperate with the ventilation features of the chassis and includes some components chosen for low-power consumption or reduced flammability.
Abstract:
A chassis (100) and associated telecommunication circuit card (110) are disclosed. The chassis has heat dissipation and flame containment features while accommodating a high density of the circuitry cards. Embodiments include an inner housing with a double-layer middle floor dividing the chassis into top and bottom chambers. Each layer has partially aligned slots, and an air gap (103) is provided between the two layers. Embodiments also include a double-layer mesh cover with an air gap existing between the two mesh layers. Projections and grooves are provided on the inner surfaces of the inner housing to receive circuit cards having a guide on one edge and a fin on another. The circuit card (110) includes conductor structures such as multiple board layers with paired and segregated conductors. The circuit card also includes some components positioned to cooperate with the ventilation features of the chassis and includes some components chosen for low-power consumption or reduced flammability.