公开(公告)号：AU2002245548A1

公开(公告)日：2002-09-12

申请号：AU2002245548

申请日：2002-02-27

Applicant: ADC TELECOMMUNICATIONS INC

Inventor： HUSOM TODD ,  SAYRES DEREK ,  BERG ROBIN JR

IPC: H04Q1/02 ,  H05K1/02 ,  H05K1/14 ,  H05K7/14 ,  H05K7/18

Abstract: A chassis and associated telecommunication circuit card are disclosed. The chassis has heat dissipation and flame containment features while accommodating a high density of the circuitry cards. Embodiments include an inner housing with a double-layer middle floor dividing the chassis into top and bottom chambers. Each layer has partially aligned slots, and an air gap is provided between the two layers. Embodiments also include a double-layer mesh cover with an air gap existing between the two mesh layers. Projections and grooves are provided on the inner surfaces of the inner housing to receive circuit cards having a guide on one edge and a fin on another. The guide includes an opening that at least partially aligns with slots on the adjacent surface of the inner housing. The circuit card includes a finger extending from a faceplate that facilitates insertion and removal of the circuit card relative to the chassis.

公开(公告)号：AU2002309889A1

公开(公告)日：2002-12-16

申请号：AU2002309889

申请日：2002-05-17

Applicant: ADC TELECOMMUNICATIONS INC

Inventor： MCCLELLAN BRIAN J ,  SAYRES DEREK ,  MADSEN DALE C ,  CZYSCON JOSEPH S ,  SKRADDE STEVEN W ,  HUSOM TODD ,  BERG ROBIN JR

IPC: G02B6/38 ,  G02B6/44 ,  H05K7/14 ,  H04Q1/10 ,  H05K7/00

Abstract: Telecommunications chassis and associated modules for use with the telecommunications chassis are disclosed. Embodiments of the telecommunications chassis include structures such as horizontal channels and/or horizontal surfaces with ridges and/or slots in one surface and slots in ridges of another for receiving edges of modules that mount within the chassis. Other structures of embodiments include divider slots in the horizontal surfaces that receive edges of divider walls to fix the divider walls in place, heat baffle surfaces included within the chassis, and/or cable guides with radius limiters. Module embodiments include structures such as faceplates with angled portions with fiber optic cable connections directed toward the fiber cable's direction of travel. Other module structures include shells that enclose the circuit board and/or provide angled portions with fiber optic cable connections. Module embodiments may also include circuitry for converting electrical signals to optical and optical signals to electrical, and the circuitry may selectively operate at multiple data rates.

公开(公告)号：AU2002309597A1

公开(公告)日：2002-12-03

申请号：AU2002309597

申请日：2002-04-23

Applicant: ADC TELECOMMUNICATIONS INC

Inventor： FRITZ GREGORY J ,  HUSOM TODD ,  ANDERSON ALEJANDRA ,  SIT ERIC K ,  BERG ROBIN JR

IPC: H04Q1/02 ,  H04Q1/10 ,  H05K1/02 ,  H05K1/14 ,  H05K1/18 ,  H05K7/14 ,  H05K7/18 ,  H04B1/036 ,  H05K7/00 ,  H05K7/20

公开(公告)号：AU2002250460A1

公开(公告)日：2002-10-21

申请号：AU2002250460

申请日：2002-03-26

Applicant: ADC TELECOMMUNICATIONS INC

Inventor： HUSOM TODD ,  ANDERSON ALEJANDRA ,  SIT ERIC K ,  BERG ROBIN JR ,  FRITZ GREGORY J

IPC: H04Q1/02 ,  H05K1/02 ,  H05K1/14 ,  H05K7/14 ,  H05K7/18 ,  H04Q1/10 ,  H04B1/036 ,  H05K7/20 ,  H05K7/00

Abstract: A chassis and associated telecommunication circuit card are disclosed. The chassis has heat dissipation and flame containment features while accommodating a high density of the circuitry cards. Embodiments include an inner housing with a double-layer middle floor dividing the chassis into top and bottom chambers. Each layer has partially aligned slots, and an air gap is provided between the two layers. Embodiments also include a double-layer mesh cover with an air gap existing between the two mesh layers. Projections and grooves are provided on the inner surfaces of the inner housing to receive circuit cards having a guide on one edge and a fin on another. The circuit card includes conductor structures such as multiple board layers with paired and segregated conductors. The circuit card also includes some components positioned to cooperate with the ventilation features of the chassis and includes some components chosen for low-power consumption or reduced flammability.

公开(公告)号：WO02069649A3

公开(公告)日：2003-05-01

申请号：PCT/US0206167

申请日：2002-02-27

Applicant: ADC TELECOMMUNICATIONS INC

Inventor： BERG ROBIN JR ,  HUSOM TODD ,  SAYRES DEREK

IPC: H04Q1/02 ,  H05K1/02 ,  H05K1/14 ,  H05K7/14 ,  H05K7/18

CPC classification number: H05K7/1425 ,  H04Q1/023 ,  H04Q1/03 ,  H04Q1/035 ,  H04Q1/116 ,  H04Q1/155 ,  H04Q2201/06 ,  H04Q2201/10 ,  H04Q2201/12 ,  H05K1/0216 ,  H05K1/14 ,  H05K2201/093 ,  H05K2201/09663

Abstract: A chassis and associated telecommunication circuit card are disclosed. The chassis has heat dissipation and flame containment features while accommodating a high density of the circuitry cards. Embodiments include an inner housing with a double-layer middle floor dividing the chassis into top and bottom chambers. Each layer has partially aligned slots, and an air gap is provided between the two layers. Embodiments also include a double-layer mesh cover with an air gap existing between the two mesh layers. Projections and grooves are provided on the inner surfaces of the inner housing to receive circuit cards having a guide on one edge and a fin on another. The guide includes an opening that at least partially aligns with slots on the adjacent surface of the inner housing. The circuit card includes a finger extending from a faceplate that facilitates insertion and removal of the circuit card relative to the chassis.

Abstract translation: 公开了一种底盘和相关通信电路卡。 底盘具有散热和阻燃特征，同时容纳高密度的电路卡。 实施例包括具有双层中间层的内壳，其将底盘分成顶部和底部室。 每个层具有部分对准的槽，并且在两层之间提供气隙。 实施例还包括在两个网格层之间具有气隙的双层网状覆盖物。 在内壳体的内表面上设置突起和凹槽，以接收在一个边缘上具有引导件的电路卡和另一个边缘上的翅片。 引导件包括至少部分地与内壳体的相邻表面上的狭槽对准的开口。 电路卡包括从面板延伸的手指，其有助于电路卡相对于底盘的插入和移除。

公开(公告)号：WO02082877A3

公开(公告)日：2003-08-14

申请号：PCT/US0209557

申请日：2002-03-26

Applicant: ADC TELECOMMUNICATIONS INC

Inventor： FRITZ GREGORY J ,  ANDERSON ALEJANDRA ,  BERG ROBIN JR ,  HUSOM TODD ,  SIT ERIC K

IPC: H04Q1/02 ,  H05K1/02 ,  H05K1/14 ,  H05K7/14 ,  H05K7/18 ,  H04Q1/10 ,  H04B1/036 ,  H05K7/00 ,  H05K7/20

CPC classification number: H05K7/1425 ,  H04Q1/03 ,  H04Q1/035 ,  H04Q1/116 ,  H04Q1/155 ,  H04Q2201/06 ,  H04Q2201/10 ,  H04Q2201/12 ,  H05K1/0216 ,  H05K1/14 ,  H05K7/186 ,  H05K2201/093 ,  H05K2201/09663

Abstract: A chassis and associated telecommunication circuit card are disclosed. The chassis has heat dissipation and flame containment features while accommodating a high density of the circuitry cards. Embodiments include an inner housing with a double-layer middle floor dividing the chassis into top and bottom chambers. Each layer has partially aligned slots, and an air gap is provided between the two layers. Embodiments also include a double-layer mesh cover with an air gap existing between the two mesh layers. Projections and grooves are provided on the inner surfaces of the inner housing to receive circuit cards having a guide on one edge and a fin on another. The circuit card includes conductor structures such as multiple board layers with paired and segregated conductors. The circuit card also includes some components positioned to cooperate with the ventilation features of the chassis and includes some components chosen for low-power consumption or reduced flammability.

Abstract translation: 公开了一种底盘和相关通信电路卡。 底盘具有散热和阻燃特征，同时容纳高密度的电路卡。 实施例包括具有双层中间层的内壳，其将底盘分成顶部和底部室。 每个层具有部分对准的槽，并且在两层之间提供气隙。 实施例还包括在两个网格层之间具有气隙的双层网状覆盖物。 在内壳体的内表面上设置突起和凹槽，以接收在一个边缘上具有引导件的电路卡和另一个边缘上的翅片。 电路卡包括诸如具有配对和分离的导体的多个板层的导体结构。 电路卡还包括定位成与底盘的通风特征配合的一些组件，并且包括一些选择用于低功耗或降低可燃性的组件。

公开(公告)号：WO02096124A3

公开(公告)日：2003-07-24

申请号：PCT/US0212982

申请日：2002-04-23

Applicant: ADC TELECOMMUNICATIONS INC

Inventor： FRITZ GREGORY J ,  ANDERSON ALEJANDRA ,  BERG ROBIN JR ,  HUSOM TODD ,  SIT ERIC K

IPC: H04Q1/02 ,  H04Q1/10 ,  H05K1/02 ,  H05K1/14 ,  H05K1/18 ,  H05K7/14 ,  H05K7/18 ,  H04B1/036 ,  H05K7/00 ,  H05K7/20

CPC classification number: H05K7/1425 ,  H04Q1/03 ,  H04Q1/035 ,  H04Q1/10 ,  H04Q1/116 ,  H04Q2201/06 ,  H04Q2201/10 ,  H04Q2201/12 ,  H05K1/0216 ,  H05K1/14 ,  H05K1/18 ,  H05K7/186 ,  H05K2201/044 ,  H05K2201/093 ,  H05K2201/09354 ,  H05K2201/09663

Abstract: A chassis (100) and associated telecommunication circuit card (110) are disclosed. The chassis has heat dissipation and flame containment features while accommodating a high density of the circuitry cards. Embodiments include an inner housing with a double-layer middle floor dividing the chassis into top and bottom chambers. Each layer has partially aligned slots, and an air gap (103) is provided between the two layers. Embodiments also include a double-layer mesh cover with an air gap existing between the two mesh layers. Projections and grooves are provided on the inner surfaces of the inner housing to receive circuit cards having a guide on one edge and a fin on another. The circuit card (110) includes conductor structures such as multiple board layers with paired and segregated conductors. The circuit card also includes some components positioned to cooperate with the ventilation features of the chassis and includes some components chosen for low-power consumption or reduced flammability.

Abstract translation: 公开了一种底盘（100）和相关联的电信电路卡（110）。 底盘具有散热和阻燃特征，同时容纳高密度的电路卡。 实施例包括具有双层中间层的内壳，其将底盘分成顶部和底部室。 每个层具有部分对准的槽，并且在两层之间设置有气隙（103）。 实施例还包括在两个网格层之间具有气隙的双层网状覆盖物。 在内壳体的内表面上设置突起和凹槽，以接收在一个边缘上具有引导件的电路卡和另一个边缘上的翅片。 电路卡（110）包括诸如具有配对和分离的导体的多个板层的导体结构。 电路卡还包括定位成与底盘的通风特征配合的一些组件，并且包括一些选择用于低功耗或降低可燃性的组件。