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    Telecommunications chassis and card
    3.
    发明专利
    Telecommunications chassis and card 未知

    公开(公告)号：AU2002250460A1

    公开(公告)日：2002-10-21

    申请号：AU2002250460

    申请日：2002-03-26

    Applicant: ADC TELECOMMUNICATIONS INC

    Inventor： HUSOM TODD ,  ANDERSON ALEJANDRA ,  SIT ERIC K ,  BERG ROBIN JR ,  FRITZ GREGORY J

    IPC: H04Q1/02 ,  H05K1/02 ,  H05K1/14 ,  H05K7/14 ,  H05K7/18 ,  H04Q1/10 ,  H04B1/036 ,  H05K7/20 ,  H05K7/00

    Abstract: A chassis and associated telecommunication circuit card are disclosed. The chassis has heat dissipation and flame containment features while accommodating a high density of the circuitry cards. Embodiments include an inner housing with a double-layer middle floor dividing the chassis into top and bottom chambers. Each layer has partially aligned slots, and an air gap is provided between the two layers. Embodiments also include a double-layer mesh cover with an air gap existing between the two mesh layers. Projections and grooves are provided on the inner surfaces of the inner housing to receive circuit cards having a guide on one edge and a fin on another. The circuit card includes conductor structures such as multiple board layers with paired and segregated conductors. The circuit card also includes some components positioned to cooperate with the ventilation features of the chassis and includes some components chosen for low-power consumption or reduced flammability.

    TELECOMMUNICATIONS CHASSIS AND CARD
    4.
    发明申请
    TELECOMMUNICATIONS CHASSIS AND CARD 审中-公开
    电讯局和卡

    公开(公告)号：WO02082877A3

    公开(公告)日：2003-08-14

    申请号：PCT/US0209557

    申请日：2002-03-26

    Applicant: ADC TELECOMMUNICATIONS INC

    Inventor： FRITZ GREGORY J ,  ANDERSON ALEJANDRA ,  BERG ROBIN JR ,  HUSOM TODD ,  SIT ERIC K

    IPC: H04Q1/02 ,  H05K1/02 ,  H05K1/14 ,  H05K7/14 ,  H05K7/18 ,  H04Q1/10 ,  H04B1/036 ,  H05K7/00 ,  H05K7/20

    CPC classification number: H05K7/1425 ,  H04Q1/03 ,  H04Q1/035 ,  H04Q1/116 ,  H04Q1/155 ,  H04Q2201/06 ,  H04Q2201/10 ,  H04Q2201/12 ,  H05K1/0216 ,  H05K1/14 ,  H05K7/186 ,  H05K2201/093 ,  H05K2201/09663

    Abstract: A chassis and associated telecommunication circuit card are disclosed. The chassis has heat dissipation and flame containment features while accommodating a high density of the circuitry cards. Embodiments include an inner housing with a double-layer middle floor dividing the chassis into top and bottom chambers. Each layer has partially aligned slots, and an air gap is provided between the two layers. Embodiments also include a double-layer mesh cover with an air gap existing between the two mesh layers. Projections and grooves are provided on the inner surfaces of the inner housing to receive circuit cards having a guide on one edge and a fin on another. The circuit card includes conductor structures such as multiple board layers with paired and segregated conductors. The circuit card also includes some components positioned to cooperate with the ventilation features of the chassis and includes some components chosen for low-power consumption or reduced flammability.

    Abstract translation: 公开了一种底盘和相关通信电路卡。 底盘具有散热和阻燃特征，同时容纳高密度的电路卡。 实施例包括具有双层中间层的内壳，其将底盘分成顶部和底部室。 每个层具有部分对准的槽，并且在两层之间提供气隙。 实施例还包括在两个网格层之间具有气隙的双层网状覆盖物。 在内壳体的内表面上设置突起和凹槽，以接收在一个边缘上具有引导件的电路卡和另一个边缘上的翅片。 电路卡包括诸如具有配对和分离的导体的多个板层的导体结构。 电路卡还包括定位成与底盘的通风特征配合的一些组件，并且包括一些选择用于低功耗或降低可燃性的组件。

    TELECOMMUNICATIONS CHASSIS AND CARD
    5.
    发明申请
    TELECOMMUNICATIONS CHASSIS AND CARD 审中-公开
    电讯局和卡

    公开(公告)号：WO02096124A3

    公开(公告)日：2003-07-24

    申请号：PCT/US0212982

    申请日：2002-04-23

    Applicant: ADC TELECOMMUNICATIONS INC

    Inventor： FRITZ GREGORY J ,  ANDERSON ALEJANDRA ,  BERG ROBIN JR ,  HUSOM TODD ,  SIT ERIC K

    IPC: H04Q1/02 ,  H04Q1/10 ,  H05K1/02 ,  H05K1/14 ,  H05K1/18 ,  H05K7/14 ,  H05K7/18 ,  H04B1/036 ,  H05K7/00 ,  H05K7/20

    CPC classification number: H05K7/1425 ,  H04Q1/03 ,  H04Q1/035 ,  H04Q1/10 ,  H04Q1/116 ,  H04Q2201/06 ,  H04Q2201/10 ,  H04Q2201/12 ,  H05K1/0216 ,  H05K1/14 ,  H05K1/18 ,  H05K7/186 ,  H05K2201/044 ,  H05K2201/093 ,  H05K2201/09354 ,  H05K2201/09663

    Abstract: A chassis (100) and associated telecommunication circuit card (110) are disclosed. The chassis has heat dissipation and flame containment features while accommodating a high density of the circuitry cards. Embodiments include an inner housing with a double-layer middle floor dividing the chassis into top and bottom chambers. Each layer has partially aligned slots, and an air gap (103) is provided between the two layers. Embodiments also include a double-layer mesh cover with an air gap existing between the two mesh layers. Projections and grooves are provided on the inner surfaces of the inner housing to receive circuit cards having a guide on one edge and a fin on another. The circuit card (110) includes conductor structures such as multiple board layers with paired and segregated conductors. The circuit card also includes some components positioned to cooperate with the ventilation features of the chassis and includes some components chosen for low-power consumption or reduced flammability.

    Abstract translation: 公开了一种底盘（100）和相关联的电信电路卡（110）。 底盘具有散热和阻燃特征，同时容纳高密度的电路卡。 实施例包括具有双层中间层的内壳，其将底盘分成顶部和底部室。 每个层具有部分对准的槽，并且在两层之间设置有气隙（103）。 实施例还包括在两个网格层之间具有气隙的双层网状覆盖物。 在内壳体的内表面上设置突起和凹槽，以接收在一个边缘上具有引导件的电路卡和另一个边缘上的翅片。 电路卡（110）包括诸如具有配对和分离的导体的多个板层的导体结构。 电路卡还包括定位成与底盘的通风特征配合的一些组件，并且包括一些选择用于低功耗或降低可燃性的组件。

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