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公开(公告)号：US20150062834A1
公开(公告)日：2015-03-05
申请号：US14469675
申请日：2014-08-27
Applicant: YAZAKI CORPORATION
Inventor： Takanori KITAJO , Masaki SUGIYAMA , Masayuki NAOHARA
CPC classification number: H05K1/111 , H01R12/526 , H01R29/00 , H05K1/029 , H05K1/14 , H05K1/182 , H05K3/222 , H05K2201/042 , H05K2201/09209 , H05K2201/10363 , H05K2201/10954
Abstract: A jumper module mounting circuit board includes: a circuit board; and a jumper module having an insulator main body provided with conductive electrical connection parts for connecting between connection patterns so as to provide electrical continuity therebetween by connecting each of contact parts on both ends of the conductive electrical connection parts to the connection patterns which are formed to be spaced apart from each other on the circuit board. The jumper module is mounted onto the circuit board so as to connect between the contact parts and the connection patterns that are formed to be spaced apart from each other. The circuit board includes a connection pattern concentrated section that is formed by concentrating the connection patterns depending on a plurality of wiring specifications at a mount position of the jumper module.
Abstract translation: 跳线模块安装电路板包括：电路板; 以及跳线模块，其具有绝缘体主体，该绝缘体主体设置有用于连接连接图案之间的导电电连接部件，以便通过将导电电连接部件的两端上的每个接触部分连接到形成为 在电路板上彼此间隔开。 跳线模块安装在电路板上，以便在接触部分和形成为彼此间隔开的连接图案之间连接。 电路板包括通过在跳线模块的安装位置根据多个布线规格聚集连接图案形成的连接图案集中部分。
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公开(公告)号：US20150060395A1
公开(公告)日：2015-03-05
申请号：US14012240
申请日：2013-08-28
Applicant: RONALD STEVEN COK
Inventor： RONALD STEVEN COK
IPC: H05K3/12
CPC classification number: H05K1/0274 , H05K1/0298 , H05K1/097 , H05K3/0041 , H05K3/12 , H05K3/1258 , H05K3/1275 , H05K3/1283 , H05K3/1291 , H05K3/465 , H05K3/4685 , H05K2201/09209 , H05K2201/09281 , H05K2201/0979 , H05K2201/09845 , H05K2203/0108
Abstract: A method of making an imprinted micro-wire structure includes providing a substrate having an edge area and a central area separate from the edge area and providing a first stamp and a multi-level second stamp. A curable bottom layer and multi-layer are provided on the substrate. A bottom-layer micro-channel is imprinted in the bottom layer. A multi-layer micro-channel and a top-layer micro-channel are imprinted in the multi-layer. Micro-wires are formed in each micro-channel. The bottom-layer micro-wire extends from the central area into the edge area. The multi-layer micro-wire contacts the bottom-layer micro-wire in the edge area. The top-layer micro-wire is over the central area and is separate from the multi-layer micro-wire and the bottom-layer micro-channel. The bottom-layer micro-wire is electrically connected to the multi-layer micro-wire and is electrically isolated from the top-layer micro-wire.
Abstract translation: 制造压印微线结构的方法包括提供具有与边缘区域分离的边缘区域和中心区域的基板，并提供第一印模和多级第二印模。 在基板上设置有可固化的底层和多层。 底层微通道印在底层中。 多层微通道和顶层微通道印在多层中。 微线形成在每个微通道中。 底层微线从中心区域延伸到边缘区域。 多层微线接触边缘区域的底层微线。 顶层微线在中心区域之上，与多层微线和底层微通道分离。 底层微线电连接到多层微线，并与顶层微线电隔离。
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公开(公告)号：US20150060394A1
公开(公告)日：2015-03-05
申请号：US14012216
申请日：2013-08-28
Applicant: RONALD STEVEN COK
Inventor： RONALD STEVEN COK
IPC: H05K3/12
CPC classification number: H05K1/0274 , H05K1/0298 , H05K1/097 , H05K3/0041 , H05K3/12 , H05K3/1258 , H05K3/1275 , H05K3/1283 , H05K3/1291 , H05K3/465 , H05K3/4685 , H05K2201/09209 , H05K2201/09281 , H05K2201/0979 , H05K2201/09845 , H05K2203/0108
Abstract: A method of making an imprinted micro-wire structure includes providing a substrate having an edge area and a central area separate from the edge area and providing first, second, and third different stamps. A curable bottom, connecting layer, and top layer are formed on the substrate. A bottom-layer micro-channel is imprinted in the bottom layer in the central area and the edge area, a connecting-layer micro-channel is imprinted in the connecting layer in the edge area over the bottom-layer micro-channel, an edge micro-channel is imprinted in the top layer in the edge area over the connecting-layer micro-channel, and top-layer micro-channels are imprinted in the top layer over the central area. Micro-wires are formed in each micro-channel. The bottom-layer micro-wire in the central area is electrically connected to the edge micro-wire in the edge area and is electrically isolated from the top-layer micro-wire.
Abstract translation: 制造压印微线结构的方法包括提供具有与边缘区域分离的边缘区域和中心区域的基板，并提供第一，第二和第三不同的邮票。 在基板上形成可固化的底部，连接层和顶层。 底层微通道印在中心区域和边缘区域的底层中，连接层微通道被压印在底层微通道上的边缘区域中的连接层中，边缘 微通道印在连接层微通道上的边缘区域的顶层中，顶层微通道印在中心区域的顶层中。 微线形成在每个微通道中。 中心区域的底层微线电连接到边缘区域中的边缘微线，并与顶层微线电隔离。
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公开(公告)号：US20240235412A1
公开(公告)日：2024-07-11
申请号：US18560299
申请日：2022-05-05
Applicant: Epinovatech AB
Inventor： Martin Andreas OLSSON , Andreas NORELIUS
CPC classification number: H02M7/003 , H02M1/0077 , H02M7/219 , H05K1/144 , H05K2201/09209
Abstract: The present invention relates to a power converter device (1) comprising; a first circuit board (100), the first circuit board comprising a first driver (102) and at least four GaN HEMT devices (101) arranged in pairs (103, 104), said pairs connected in parallel; a second circuit board (200), the second circuit board comprising a second driver (202), and at least four MOSFET devices (201) arranged in pairs (203, 204), said pairs connected in parallel; the power converter device comprises at least two electrical connections (20) between the two circuit boards; wherein the first circuit board extends in a first plane and the second circuit board extends in a second plane, and the first and second circuit boards are arranged one above the other such that the two planes extends in parallel and the electrical connections between the two circuit boards extends in a direction substantially perpendicular to said first and second planes; and wherein said at least four GaN HEMT devices (101) are electrically connected equidistant to said first driver (102). The invention further relates to a system (2, 3) comprising such power converter device, and the use thereof.
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公开(公告)号：US20190190110A1
公开(公告)日：2019-06-20
申请号：US16272834
申请日：2019-02-11
Applicant: Cambium Networks Limited
Inventor： Paul Clark , Peter Strong , Carl Morrell , Adam Wilkins , Nigel Jonathan Richard King
CPC classification number: H01P3/081 , H01P5/028 , H05K1/0237 , H05K2201/09209 , H05K2201/10242
Abstract: A radio frequency transmission arrangement comprises a ground plate having an aperture comprising a slot with an elongate cross-section and substantially parallel sides, and a first and second transmission line. The thickness of the ground plate is greater than a width of the slot. The aperture is partially filled with a solid dielectric material and partially filled with air. The first transmission line comprises a first elongate conductor on a first side of the ground plate and has an end terminated with a first termination stub. The second transmission line comprises a second elongate conductor on the opposite side of the ground plate and has an end terminated with a second termination stub. The first transmission line is arranged to cross the slot at a point adjacent to the first termination stub, and the second transmission line is arranged to cross the slot at a point adjacent to the second termination stub.
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Patent Agency Ranking
公开(公告)号：US20170171972A1
公开(公告)日：2017-06-15
申请号：US15444203
申请日：2017-02-27
Applicant: FUJIFILM Corporation
Inventor： Kensuke KATAGIRI , Shin TAJIRI , Akihiko HASE
CPC classification number: H05K1/09 , G06F3/041 , G06F3/044 , G06F3/045 , G09F9/00 , H01B1/02 , H01L51/0021 , H01L51/5212 , H05K1/0296 , H05K3/027 , H05K3/10 , H05K2201/0364 , H05K2201/09209 , H05K2203/0502 , Y10T29/49155
Abstract: A transparent conductive film comprises a transparent substrate and a metal wiring portion formed thereon. A thin metal wire contained in an electrode portion in the metal wiring portion has a surface shape satisfying the condition of Ra2/Sm>0.01 μm and has a metal volume content of 35% or more. Ra represents an arithmetic average roughness in micrometers and is equal to or smaller than the thickness of a metal wiring located in a position where the surface roughness is measured. Sm represents an average distance between convex portions and is 0.01 μm or more.
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47.发明申请CONNECTING MEMBER FOR ELECTRONIC DEVICE AND ELECTRONIC DEVICE INCLUDING THE SAME 有权用于电子设备的连接组件和包括其的电子设备公开(公告)号：US20160294086A1
公开(公告)日：2016-10-06
申请号：US15037612
申请日：2015-06-18
Applicant: SAMSUNG ELECTRONICS., LTD.
Inventor： Yeon Woo KIM , Kyung Gu KIM , Gyu Sub KIM , Se Hyun PARK , Jin Woo JUNG , Jae Bong CHUN
CPC classification number: H01R12/7076 , H05K1/02 , H05K3/325 , H05K2201/09163 , H05K2201/09209 , H05K2201/10083 , H05K2201/10098 , H05K2201/10446
Abstract: A connecting member for electrically connecting a circuit board and a component in an electronic device is provided. The connecting member includes at least one bending part configured to comprise elasticity, a pad part connected to the bending part and configured to be attached to one surface of the circuit board, and a fixing part extending from the pad part and configured to fix the connecting member to the circuit board.
Abstract translation: 提供了用于电连接电路板和电子设备中的部件的连接构件。 连接构件包括构造成包括弹性的至少一个弯曲部分，连接到弯曲部分并且被构造成附接到电路板的一个表面的焊盘部分，以及从焊盘部分延伸的固定部分， 成员到电路板。
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公开(公告)号：US09414491B2
公开(公告)日：2016-08-09
申请号：US14469675
申请日：2014-08-27
Applicant: YAZAKI CORPORATION
Inventor： Takanori Kitajo , Masaki Sugiyama , Masayuki Naohara
CPC classification number: H05K1/111 , H01R12/526 , H01R29/00 , H05K1/029 , H05K1/14 , H05K1/182 , H05K3/222 , H05K2201/042 , H05K2201/09209 , H05K2201/10363 , H05K2201/10954
Abstract: A jumper module mounting circuit board includes: a circuit board; and a jumper module having an insulator main body provided with conductive electrical connection parts for connecting between connection patterns so as to provide electrical continuity therebetween by connecting each of contact parts on both ends of the conductive electrical connection parts to the connection patterns which are formed to be spaced apart from each other on the circuit board. The jumper module is mounted onto the circuit board so as to connect between the contact parts and the connection patterns that are formed to be spaced apart from each other. The circuit board includes a connection pattern concentrated section that is formed by concentrating the connection patterns depending on a plurality of wiring specifications at a mount position of the jumper module.
Abstract translation: 跳线模块安装电路板包括：电路板; 以及跳线模块，其具有绝缘体主体，该绝缘体主体设置有用于连接连接图案之间的导电电连接部件，以便通过将导电电连接部件的两端上的每个接触部分连接到形成为 在电路板上彼此间隔开。 跳线模块安装在电路板上，以便在接触部分和形成为彼此间隔开的连接图案之间连接。 电路板包括通过在跳线模块的安装位置根据多个布线规格聚集连接图案形成的连接图案集中部分。
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49.发明申请Electronic Component, Manufacturing Method for Electronic Component, Electronic Apparatus, and Moving Object 有权电子元件，电子元件制造方法，电子设备和移动物体公开(公告)号：US20160029484A1
公开(公告)日：2016-01-28
申请号：US14806960
申请日：2015-07-23
Applicant: SEIKO EPSON CORPORATION
Inventor： Manabu KONDO
CPC classification number: H05K1/11 , H01L23/49811 , H01L24/32 , H01L24/48 , H01L2224/32225 , H01L2224/48227 , H01L2224/73265 , H01L2924/00014 , H01L2924/15312 , H01L2924/161 , H01L2924/16195 , H01L2924/163 , H01L2924/1904 , H03B5/32 , H03H9/0528 , H03H9/0547 , H03H9/09 , H03H9/1021 , H05K1/111 , H05K1/181 , H05K3/4015 , H05K2201/09209 , H05K2201/10083 , H01L2224/45099 , H01L2924/00
Abstract: In order to prevent deformation or damage of a base of a lead terminal by alleviating stress which concentrates on the base of the lead terminal protruding from an electronic component main body, the lead terminal includes a connection pad connected to a connection terminal provided on a first substrate, and a lead portion extending from the connection pad, and the lead terminal also includes a first surface connected to the connection terminal, a second surface that is a rear surface thereof, and a third surface that is a side surface, and in which the lead portion includes a first bent section and a third bent section that are bent in a direction intersecting the first surface or the second surface, a second bent section that is bent in a direction intersecting the third surface between the first bent section and the third bent section.
Abstract translation: 为了通过减轻集中在从电子部件主体突出的引线端子的基部的应力来防止引线端子的基座的变形或损坏，引线端子包括连接到连接端子的连接焊盘，连接焊盘设置在第一 基板和从连接焊盘延伸的引线部分，引线端子还包括连接到连接端子的第一表面，作为其后表面的第二表面和作为侧表面的第三表面，其中 引导部分包括沿与第一表面或第二表面相交的方向弯曲的第一弯曲部分和第三弯曲部分，在与第一弯曲部分和第三弯曲部分之间的第三表面相交的方向上弯曲的第二弯曲部分 弯曲部分。
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公开(公告)号：US20150060111A1
公开(公告)日：2015-03-05
申请号：US14012195
申请日：2013-08-28
Applicant: RONALD STEVEN COK
Inventor： RONALD STEVEN COK
IPC: H05K1/02
CPC classification number: H05K1/0274 , H05K1/0298 , H05K1/097 , H05K3/0041 , H05K3/12 , H05K3/1258 , H05K3/1275 , H05K3/1283 , H05K3/1291 , H05K3/465 , H05K3/4685 , H05K2201/09209 , H05K2201/09281 , H05K2201/0979 , H05K2201/09845 , H05K2203/0108
Abstract: An imprinted micro-structure includes a substrate having a first layer in relation thereto. First, second, and third micro-channels are imprinted in the first layer and have first, second, and third micro-wires respectively located therein. A second layer is adjacent to and in contact with the first layer. Imprinted first and second connecting micro-channels including first and second connecting micro-wires are in contact with the first and second micro-wires respectively and are isolated from the third micro-wire. A third layer is adjacent to and in contact with the second layer and has an imprinted bridge micro-channel with a bridge micro-wire contacting the first and second connecting micro-wires and separate from the third micro-wire so that the first and second micro-wires are electrically connected and electrically isolated from the third micro-wire.
Abstract translation: 压印的微结构包括具有与之相关的第一层的衬底。 第一，第二和第三微通道印在第一层中，并且分别位于其中的第一，第二和第三微细线。 第二层与第一层相邻并与第一层接触。 包括第一和第二连接微线的印刷的第一和第二连接微通道分别与第一和第二微线接触并与第三微线隔离。 第三层与第二层相邻并与第二层接触，并且具有印刷桥微通道，桥接微线与第一和第二连接微线接触并与第三微线分离，使得第一和第二 微线电连接并与第三微线电隔离。
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