公开(公告)号：WO2011101922A1

公开(公告)日：2011-08-25

申请号：PCT/JP2010/002583

申请日：2010-04-08

Applicant: パナソニック株式会社 ,  中家俊幸 ,  房安浩嗣 ,  三村詳一 ,  雲井將文 ,  松原亮

Inventor： 中家俊幸 ,  房安浩嗣 ,  三村詳一 ,  雲井將文 ,  松原亮

IPC: H01R13/648 ,  H05K1/11

CPC classification number: H01R13/6467 ,  H01R12/724 ,  H01R13/6471 ,  H05K1/111 ,  H05K1/117 ,  H05K1/141 ,  H05K2201/09409 ,  H05K2201/09727 ,  H05K2201/1034 ,  H05K2201/10825

Abstract: 　レセプタクル（１２）は、シグナル端子（Ｔ S2- ）、グランド端子（Ｔ G1 ）、及びシグナル端子（Ｔ S1+ ）を備える。グランド端子（Ｔ G1 ）の第２部分（２０２）は、延在方向においてシグナル端子（Ｔ S2- ）の第１部分（２０１）から離間している。シグナル端子（Ｔ S1+ ）の第３部分（２０３）は、延在方向においてシグナル端子（Ｔ S2- ）の第１部分（２０１）から離間している。

Abstract translation: 插座（12）设有信号端子（TS2-），接地端子（TG1）和信号端子（TS1 +）。 接地端子（TG1）的第二部分（202）沿着延伸方向远离信号端子（TS2-）的第一部分（201）设置。 信号端子（TS1 +）的第三部分（203）在延伸方向远离信号端子（TS2-）的第一部分（201）设置。

公开(公告)号：WO2008007237A3

公开(公告)日：2008-06-05

申请号：PCT/IB2007052096

申请日：2007-06-05

Applicant: KONINKL PHILIPS ELECTRONICS NV ,  BHATTACHARYA RABIN ,  SNIJDER PIETER J ,  VAN PIETERSON LIESBETH ,  ZAINZINGER ERICH

Inventor： BHATTACHARYA RABIN ,  SNIJDER PIETER J ,  VAN PIETERSON LIESBETH ,  ZAINZINGER ERICH

IPC: H05K3/30 ,  A41D1/00

CPC classification number: H05K3/301 ,  H05K1/038 ,  H05K3/308 ,  H05K3/321 ,  H05K2201/029 ,  H05K2201/10106 ,  H05K2201/10325 ,  H05K2201/10651 ,  H05K2201/10818 ,  H05K2201/10825 ,  H05K2201/10962 ,  H05K2201/209 ,  H05K2203/1446

Abstract: A submount for arranging electronic components on a substrate is provided. The submount comprises a head member and at least one substrate-engaging member protruding from the head member. The head member comprises at least two, from each other isolated, electrically conductive portions, where each electrically conductive portion comprises a component contact, adapted for connection of electronic components thereto, and a substrate contact on arranged on said substrate side, adapted for bringing said electrically conductive portions in contact with a circuitry comprised in said substrate. The submount of the present invention may be used to attach electronic components, such as light-emitting diodes, to a textile substrate, without the need for soldering the electronic component directly on the substrate.

Abstract translation: 提供了用于在基板上布置电子组件的基板。 基台包括头部件和从头部件突出的至少一个基板接合件。 头部件包括彼此隔开的至少两个导电部分，其中每个导电部分包括适于将电子部件连接到其上的部件触点以及布置在所述衬底侧上的衬底触点，适于使所述衬底 与包含在所述衬底中的电路接触的导电部分。 本发明的基座可以用于将诸如发光二极管的电子部件附着到纺织品衬底上，而不需要将电子部件直接焊接在衬底上。

公开(公告)号：WO1995026036A1

公开(公告)日：1995-09-28

申请号：PCT/DE1995000384

申请日：1995-03-21

Applicant: SIEMENS AKTIENGESELLSCHAFT ,  DITTMANN, Michael

Inventor： SIEMENS AKTIENGESELLSCHAFT

IPC: H01H50/14

CPC classification number: H05K3/308 ,  H01H50/048 ,  H01H50/14 ,  H01R12/58 ,  H01R43/16 ,  H05K2201/1059 ,  H05K2201/10825 ,  H05K2201/10833

Abstract: In a relay, the connecting elements anchored in the base body project sideways out of the base body (1) and are bent perpendicularly to the base plane as insert pins (12). The insert pins (12) are designed as sleeve-shaped or trough-shaped rolled sections bent outwards from the contour of the relay structure following an axis perpendicular to the base plane and their top edges form insert shoulders (14).

Abstract translation: 当继电器是在从基体横向锚定在基体的连接元件（1）引出并弯曲垂直于基部平面的推入帖（12）。 推入的帖子（12），通过该弯曲具有垂直轴线从中继结构到外部和形式的轮廓基平面，与它们各自的上部边缘Einpressschultern（14）套筒形或槽形轧制区段形成。

公开(公告)号：EP2538499A1

公开(公告)日：2012-12-26

申请号：EP10773527.6

申请日：2010-04-08

Applicant: Panasonic Corporation

Inventor： NAKAIE, Toshiyuki ,  FUSAYASU, Hirotsugu ,  MIMURA, Shouichi ,  KUMOI, Masafumi ,  MATSUBARA, Ryo

IPC: H01R13/648 ,  H05K1/11

CPC classification number: H01R13/6467 ,  H01R12/724 ,  H01R13/6471 ,  H05K1/111 ,  H05K1/117 ,  H05K1/141 ,  H05K2201/09409 ,  H05K2201/09727 ,  H05K2201/1034 ,  H05K2201/10825

Abstract: A receptacle (12) includes a signal terminal (T S2- ), a ground terminal (T G1 ), and a signal terminal (T S1+ ). A second portion (202) of the ground terminal (T G1 ) is distanced from a first portion (201) of the signal terminal (T S2- ) in an extension direction. A third portion (203) of the signal terminal (T S1+ ) is distanced from the first portion (201) of the signal terminal (T S2 -) in the extension direction.

Abstract translation: 插座（12）包括信号端子（T S2-），接地端子（T G1）和信号端子（T S1 +）。 接地端子（T G1）的第二部分（202）在延伸方向上远离信号端子（T S2-）的第一部分（201）。 信号端子（T S1 +）的第三部分（203）与信号端子（T S2 - ）的延伸方向的第一部分（201）间隔开。

公开(公告)号：EP2030493B1

公开(公告)日：2009-11-25

申请号：EP07825796.1

申请日：2007-06-05

Applicant: Koninklijke Philips Electronics N.V.

Inventor： BHATTACHARYA, Rabin ,  SNIJDER, Pieter, J. ,  VAN PIETERSON, Liesbeth ,  VAN DRIEL, Jacquline ,  KRANS, Martijn ,  DOUGLAS, Alexander, U. ,  ASVADI, Sima ,  HACK, Martinus, J.J. ,  ZAINZINGER, Erich

IPC: H05K3/30 ,  A41D1/00

CPC classification number: H05K3/301 ,  H05K1/038 ,  H05K3/308 ,  H05K3/321 ,  H05K2201/029 ,  H05K2201/10106 ,  H05K2201/10325 ,  H05K2201/10651 ,  H05K2201/10818 ,  H05K2201/10825 ,  H05K2201/10962 ,  H05K2201/209 ,  H05K2203/1446

公开(公告)号：EP0376924A3

公开(公告)日：1990-08-22

申请号：EP90102033.9

申请日：1988-05-16

Applicant: RAYCHEM CORPORATION (a Delaware corporation)

Inventor： Cray, Seymour R. ,  Krajewsky, Nicholas J.

IPC: H01L21/603

CPC classification number: H05K3/308 ,  B23K20/007 ,  H01L23/5384 ,  H01L24/45 ,  H01L24/49 ,  H01L24/81 ,  H01L2224/1134 ,  H01L2224/13099 ,  H01L2224/13144 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/4943 ,  H01L2224/78301 ,  H01L2224/81801 ,  H01L2224/85045 ,  H01L2224/85205 ,  H01L2225/06524 ,  H01L2225/06527 ,  H01L2225/06541 ,  H01L2225/06589 ,  H01L2225/06593 ,  H01L2225/06596 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10329 ,  H01L2924/14 ,  H05K3/368 ,  H05K2201/096 ,  H05K2201/1059 ,  H05K2201/10825 ,  H05K2201/10909 ,  H05K2201/10946 ,  H05K2203/0495 ,  H01L2924/00 ,  H01L2224/48 ,  H01L2924/20757 ,  H01L2924/01204 ,  H01L2224/05599

Abstract: A method of attaching flying leads to integrated circuit chips. This method comprises the steps of:
(a) forming a gold ball (106) on the end of a gold lead (101) by rapidly heating the end of the lead; (b) pressing the gold ball against the bonding pad (105) of an integrated circuit chip (104) so that the gold lead forms an electrical and mechanical bond to the bonding pad to the integrated circuit chip; (c) notching the gold lead at a height above the gold ball; and (d) stretching the gold lead so that it breaks at the notched position and straightens the gold lead forming a flying lead.

公开(公告)号：EP0376924A2

公开(公告)日：1990-07-04

申请号：EP90102033.9

申请日：1988-05-16

Applicant: RAYCHEM CORPORATION (a Delaware corporation)

Inventor： Cray, Seymour R. ,  Krajewsky, Nicholas J.

IPC: H01L21/603

CPC classification number: H05K3/308 ,  B23K20/007 ,  H01L23/5384 ,  H01L24/45 ,  H01L24/49 ,  H01L24/81 ,  H01L2224/1134 ,  H01L2224/13099 ,  H01L2224/13144 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/4943 ,  H01L2224/78301 ,  H01L2224/81801 ,  H01L2224/85045 ,  H01L2224/85205 ,  H01L2225/06524 ,  H01L2225/06527 ,  H01L2225/06541 ,  H01L2225/06589 ,  H01L2225/06593 ,  H01L2225/06596 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10329 ,  H01L2924/14 ,  H05K3/368 ,  H05K2201/096 ,  H05K2201/1059 ,  H05K2201/10825 ,  H05K2201/10909 ,  H05K2201/10946 ,  H05K2203/0495 ,  H01L2924/00 ,  H01L2224/48 ,  H01L2924/20757 ,  H01L2924/01204 ,  H01L2224/05599

Abstract: A method of attaching flying leads to integrated circuit chips. This method comprises the steps of:

(a) forming a gold ball (106) on the end of a gold lead (101) by rapidly heating the end of the lead;
(b) pressing the gold ball against the bonding pad (105) of an integrated circuit chip (104) so that the gold lead forms an electrical and mechanical bond to the bonding pad to the integrated circuit chip;
(c) notching the gold lead at a height above the gold ball; and
(d) stretching the gold lead so that it breaks at the notched position and straightens the gold lead forming a flying lead.

Abstract translation: 将飞行引线连接到集成电路芯片的方法。 该方法包括以下步骤：（a）通过快速加热引线的端部，在金引线（101）的端部上形成金球（106） （b）将金球压在集成电路芯片（104）的焊盘（105）上，使得金引线与焊盘形成电和机械结合到集成电路芯片; （c）在金球高度上切割金铅; 和（d）拉伸金铅，使其在切口位置处断裂并拉直形成飞铅的金铅。 p

公开(公告)号：KR101345353B1

公开(公告)日：2013-12-31

申请号：KR1020097000183

申请日：2007-06-05

Applicant: 코닌클리케 필립스 엔.브이.

Inventor： 바타차랴,라빈 ,  스니저,피터,제이. ,  반피에터슨,리에베스 ,  재인진거,에리히 ,  크랜스,마틴 ,  아즈바디,시마 ,  더글라스,알렉산더,유. ,  반드리엘,재클린 ,  해크,마티너스,제이.,제이.

IPC: H01R33/76 ,  H01L21/60 ,  H05K13/04

CPC classification number: H05K3/301 ,  H05K1/038 ,  H05K3/308 ,  H05K3/321 ,  H05K2201/029 ,  H05K2201/10106 ,  H05K2201/10325 ,  H05K2201/10651 ,  H05K2201/10818 ,  H05K2201/10825 ,  H05K2201/10962 ,  H05K2201/209 ,  H05K2203/1446

Abstract: 전자 부품들을 기판 상에 배열하기 위한 서브마운트가 제공된다. 이 서브마운트는 헤드 부재 및 그 헤드 부재로부터 돌출하는 적어도 하나의 기판 맞물림 부재를 포함한다. 헤드 부재는 적어도 2개의, 서로로부터 분리된, 전기 도전성 부분들을 포함하고, 각각의 전기 도전성 부분은 전자 부품들을 그것에 접속하기 위해 적응된 부품 콘택트, 및 상기 전기 도전성 부분들을 상기 기판에 포함된 회로와 접촉시키기 위해 적응된, 상기 기판 측면 상에 배열된 기판 콘택트를 포함한다. 본 발명의 서브마운트는, 발광 다이오드와 같은 전자 부품들을 직물 기판 상에 직접 납땜할 필요 없이, 그러한 전자 부품들을 직물 기판에 부착하는 데 이용될 수 있다.
직물 기판, 전자 부품, 서브마운트

公开(公告)号：KR1020090031552A

公开(公告)日：2009-03-26

申请号：KR1020097000183

申请日：2007-06-05

Applicant: 코닌클리케 필립스 엔.브이.

Inventor： 바타차랴,라빈 ,  스니저,피터,제이. ,  반피에터슨,리에베스 ,  재인진거,에리히 ,  크랜스,마틴 ,  아즈바디,시마 ,  더글라스,알렉산더,유. ,  반드리엘,재클린 ,  해크,마티너스,제이.,제이.

IPC: H01R33/76 ,  H01L21/60 ,  H05K13/04

CPC classification number: H05K3/301 ,  H05K1/038 ,  H05K3/308 ,  H05K3/321 ,  H05K2201/029 ,  H05K2201/10106 ,  H05K2201/10325 ,  H05K2201/10651 ,  H05K2201/10818 ,  H05K2201/10825 ,  H05K2201/10962 ,  H05K2201/209 ,  H05K2203/1446

Abstract: A submount for arranging electronic components on a substrate is provided. The submount comprises a head member and at least one substrate-engaging member protruding from the head member. The head member comprises at least two, from each other isolated, electrically conductive portions, where each electrically conductive portion comprises a component contact, adapted for connection of electronic components thereto, and a substrate contact on arranged on said substrate side, adapted for bringing said electrically conductive portions in contact with a circuitry comprised in said substrate. The submount of the present invention may be used to attach electronic components, such as light-emitting diodes, to a textile substrate, without the need for soldering the electronic component directly on the substrate.

Abstract translation: 提供了一种用于在基板上布置电子部件的基座。 底座包括头部构件和从头部构件突出的至少一个衬底接合构件。 头部构件包括彼此隔离的导电部分中的至少两个，其中每个导电部分包括适于将电子部件连接到其上的部件接触件和布置在所述基板侧上的基板接触件，适于使所述 与包括在所述衬底中的电路接触的导电部分。 本发明的基座可以用于将诸如发光二极管的电子部件附接到纺织品基板，而不需要将电子部件直接焊接在基板上。

公开(公告)号：US20110256739A1

公开(公告)日：2011-10-20

申请号：US12991442

申请日：2010-04-08

Applicant: Toshiyuki Nakaie ,  Hirotsugu Fusayasu ,  Shouichi Mimura ,  Masafumi Kumoi ,  Ryo Matsubara

Inventor： Toshiyuki Nakaie ,  Hirotsugu Fusayasu ,  Shouichi Mimura ,  Masafumi Kumoi ,  Ryo Matsubara

IPC: H01R12/70 ,  H05K1/11

CPC classification number: H01R13/6467 ,  H01R12/724 ,  H01R13/6471 ,  H05K1/111 ,  H05K1/117 ,  H05K1/141 ,  H05K2201/09409 ,  H05K2201/09727 ,  H05K2201/1034 ,  H05K2201/10825

Abstract: A receptacle includes a signal terminal, a ground terminal, and a signal terminal. A second portion of the ground terminal is distanced from a first portion of the signal terminal in an extension direction. A third portion of the signal terminal is distanced from the first portion of the signal terminal in the extension direction.

Abstract translation: 插座包括信号端子，接地端子和信号端子。 接地端子的第二部分在延伸方向上远离信号端子的第一部分。 信号端子的第三部分在延伸方向上远离信号端子的第一部分。