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公开(公告)号：CN101467503A
公开(公告)日：2009-06-24
申请号：CN200780021198.X
申请日：2007-06-05
Applicant: 皇家飞利浦电子股份有限公司
CPC classification number: H05K3/301 , H05K1/038 , H05K3/308 , H05K3/321 , H05K2201/029 , H05K2201/10106 , H05K2201/10325 , H05K2201/10651 , H05K2201/10818 , H05K2201/10825 , H05K2201/10962 , H05K2201/209 , H05K2203/1446
Abstract: 提供一种次基台，用于将电子部件设置在基片上。次基台包括头部件以及从头部件伸出的至少一个基片接合件。头部件包括至少两个相互隔开的导电部分，每个导电部分包括适合与电子部件相连的部件触点和适合使所述的导电部分与包括在所述基片内的电路接触的并且设置在所述的基片侧上的基片触点。本发明的次基台可用于将电子部件如发光二极管附着到织物基片上，而不需要将电子部件直接焊接在基片上。
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公开(公告)号：CN101467503B
公开(公告)日：2011-05-18
申请号：CN200780021198.X
申请日：2007-06-05
Applicant: 皇家飞利浦电子股份有限公司
CPC classification number: H05K3/301 , H05K1/038 , H05K3/308 , H05K3/321 , H05K2201/029 , H05K2201/10106 , H05K2201/10325 , H05K2201/10651 , H05K2201/10818 , H05K2201/10825 , H05K2201/10962 , H05K2201/209 , H05K2203/1446
Abstract: 提供一种次基台，用于将电子部件设置在基片上。次基台包括头部件以及从头部件伸出的至少一个基片接合件。头部件包括至少两个相互隔开的导电部分，每个导电部分包括适合与电子部件相连的部件触点和适合使所述的导电部分与包括在所述基片内的电路接触的并且设置在所述的基片侧上的基片触点。本发明的次基台可用于将电子部件如发光二极管附着到织物基片上，而不需要将电子部件直接焊接在基片上。
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公开(公告)号：CN102341967B
公开(公告)日：2015-07-08
申请号：CN200980157866.0
申请日：2009-12-17
Applicant: 三菱电机株式会社
CPC classification number: H01R13/03 , H01R12/58 , H01R13/2421 , H05K3/247 , H05K3/308 , H05K3/325 , H05K2201/10295 , H05K2201/10757 , H05K2201/10818 , H05K2201/10825 , H05K2201/10856 , H05K2203/044
Abstract: 将不含铅的以锡为主要成分的焊料熔融涂布于与连接器端子(1)相接触的、基板(4)的电极(6)上，从而形成镀锡面(7)。
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公开(公告)号：CN102341967A
公开(公告)日：2012-02-01
申请号：CN200980157866.0
申请日：2009-12-17
Applicant: 三菱电机株式会社
CPC classification number: H01R13/03 , H01R12/58 , H01R13/2421 , H05K3/247 , H05K3/308 , H05K3/325 , H05K2201/10295 , H05K2201/10757 , H05K2201/10818 , H05K2201/10825 , H05K2201/10856 , H05K2203/044
Abstract: 将不含铅的以锡为主要成分的焊料熔融涂布于与连接器端子(1)相接触的、基板(4)的电极(6)上，从而形成镀锡面(7)。
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公开(公告)号：CN102292881A
公开(公告)日：2011-12-21
申请号：CN201080001323.2
申请日：2010-04-08
Applicant: 松下电器产业株式会社
IPC: H01R13/648 , H05K1/11
CPC classification number: H01R13/6467 , H01R12/724 , H01R13/6471 , H05K1/111 , H05K1/117 , H05K1/141 , H05K2201/09409 , H05K2201/09727 , H05K2201/1034 , H05K2201/10825
Abstract: 本发明提供一种插座。插座(12)具备信号端子(TS2-)、接地端子(TG1)以及信号端子(TS1+)。接地端子(TG1)的第二部分(202)在延伸方向上远离信号端子(TS2-)的第一部分(201)。信号端子(TS1+)的第三部分(203)在延伸方向上远离信号端子(TS2-)的第一部分(201)。
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Patent Agency Ranking
6.发明授权Connector having a terminal with a tin plated contact pressed against a hot-dip tinned face of a board 有权具有镀锡触点的端子的连接器压靠在板的热浸镀锡表面上公开(公告)号：US08403684B2
公开(公告)日：2013-03-26
申请号：US13131047
申请日：2009-12-17
Applicant: Norikazu Tateishi , Masaru Kibi
Inventor： Norikazu Tateishi , Masaru Kibi
IPC: H01R12/00
CPC classification number: H01R13/03 , H01R12/58 , H01R13/2421 , H05K3/247 , H05K3/308 , H05K3/325 , H05K2201/10295 , H05K2201/10757 , H05K2201/10818 , H05K2201/10825 , H05K2201/10856 , H05K2203/044
Abstract: A tin-plated surface 7 is formed by hot-dip coating a solder containing a lead-free tin as the main component on an electrode 6 of a board 4 with which a connector terminal 1 comes in contact.
Abstract translation: 通过在连接器端子1接触的基板4的电极6上以含铅无铅锡为主要成分的焊料进行热浸镀，形成镀锡表面7。
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7.发明申请STRUCTURE FOR CONNECTING CONNECTOR, AND HEAD LAMP LIGHT SOURCE LIGHTING DEVICE USING THE STRUCTURE 有权使用结构连接连接器和头灯光源照明设备的结构公开(公告)号：US20110235348A1
公开(公告)日：2011-09-29
申请号：US13131047
申请日：2009-12-17
Applicant: Norikazu Tateishi , Masaru Kibi
Inventor： Norikazu Tateishi , Masaru Kibi
CPC classification number: H01R13/03 , H01R12/58 , H01R13/2421 , H05K3/247 , H05K3/308 , H05K3/325 , H05K2201/10295 , H05K2201/10757 , H05K2201/10818 , H05K2201/10825 , H05K2201/10856 , H05K2203/044
Abstract: A tin-plated surface 7 is formed by hot-dip coating a solder containing a lead-free tin as the main component on an electrode 6 of a board 4 with which a connector terminal 1 comes in contact.
Abstract translation: 通过在连接器端子1接触的基板4的电极6上以含铅无铅锡为主要成分的焊料进行热浸镀，形成镀锡表面7。
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公开(公告)号：US2352454A
公开(公告)日：1944-06-27
申请号：US40926641
申请日：1941-09-02
Applicant: CHICAGO TELEPHONE SUPPLY CO
Inventor： SCHELLENGER NEWTON C , BUDD WILBERT H
CPC classification number: H01C1/014 , H05K3/308 , H05K3/3447 , H05K2201/09418 , H05K2201/10196 , H05K2201/10787 , H05K2201/10825 , H05K2201/10878 , H05K2203/1446 , Y10T29/49922 , Y10T403/49
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公开(公告)号：WO1990013992A1
公开(公告)日：1990-11-15
申请号：PCT/US1990002456
申请日：1990-05-03
Applicant: CRAY COMPUTER CORPORATION
IPC: H05K03/36
CPC classification number: H01L24/11 , H01L21/4853 , H01L2224/05644 , H01L2224/1134 , H01L2224/13099 , H01L2224/13144 , H01L2224/45015 , H01L2224/45144 , H01L2224/45147 , H01L2224/4943 , H01L2225/06524 , H01L2225/06527 , H01L2225/06541 , H01L2225/06589 , H01L2225/06593 , H01L2225/06596 , H01L2924/00011 , H01L2924/00013 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01039 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/10329 , H01L2924/12033 , H01L2924/12042 , H01L2924/14 , H01L2924/3011 , H01R12/523 , H05K3/308 , H05K3/328 , H05K3/36 , H05K3/368 , H05K2201/096 , H05K2201/1059 , H05K2201/10825 , H05K2201/10909 , H05K2201/10946 , H05K2203/0495 , Y10T29/49126 , Y10T29/4914 , Y10T29/49144 , Y10T29/49153 , H01L2924/00 , H01L2224/48 , H01L2924/20757
Abstract: A method and apparatus for interconnecting electronic circuit boards (212, 214, 219, 221) through the use of twisted wire jumpers (231) which are formed from multifilament wire and which have enlarged bird cages (300) formed along the jumpers. The jumpers are drawn through a stack of circuit boards to position the cages in contact with plated interconnection apertures (303) located in the printed circuit boards. The frictional engagement of the cages (300) in the apertures (303) provides both electrical interconnection of, and mechanical coupling between the printed circuit boards (212, 214, 219, 221).
Abstract translation: 一种用于通过使用由多丝线形成并具有沿着跳线形成的扩大的鸟笼（300）的双绞线跳线（231）来互连电子电路板（212,214,219,221）的方法和装置。 跳线穿过电路板堆叠以将网格定位成与位于印刷电路板中的电镀互连孔（303）接触。 保持架（300）在孔（303）中的摩擦接合提供印刷电路板（212,214,219,221）之间的电互连和机械耦合。
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公开(公告)号：WO8809599A3
公开(公告)日：1988-12-29
申请号：PCT/US8801668
申请日：1988-05-16
Applicant: CRAY RESEARCH INC
Inventor： CRAY SEYMOUR R , KRAJEWSKY NICHOLAS J
IPC: H01L21/48 , H01L21/60 , H01L21/607 , H01L23/50 , H01R12/52 , H05K3/30 , H05K3/32 , H05K3/36 , H01R9/09
CPC classification number: H01L24/11 , H01L21/4853 , H01L2224/05644 , H01L2224/1134 , H01L2224/13099 , H01L2224/13144 , H01L2224/45144 , H01L2224/4943 , H01L2224/78301 , H01L2225/06524 , H01L2225/06527 , H01L2225/06541 , H01L2225/06589 , H01L2225/06593 , H01L2225/06596 , H01L2924/00013 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01039 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/10329 , H01L2924/12033 , H01L2924/14 , H01R12/523 , H05K3/308 , H05K3/328 , H05K3/368 , H05K2201/096 , H05K2201/1059 , H05K2201/10825 , H05K2201/10909 , H05K2201/10946 , H05K2203/0495 , Y10T29/49135 , Y10T29/4914 , Y10T29/49153 , H01L2924/00 , H01L2224/29099 , H01L2224/48
Abstract: A method and apparatus for interconnecting electronic circuits (104) using nearly pure soft annealed gold mechanically compressed within through-plated holes (111). The invention has its application in attaching integrated circuit dice (104) directly to circuit boards (110) by ball bonding gold wires (101) to the bonding pads (105) of the integrated circuit dice (104) in a substantially perpendicular relationship to the surfaces of the dice (104) and inserting the gold leads (101) into through-plated holes (111) of circuit boards (110) which provide an electrical and a mechanical connection once the leads (101) are compressed within the through-plated holes (111). The present invention also finds its application in the interconnection of sandwiched circuit board assemblies (200) where soft gold lead wires are inserted into axially aligned through-plated holes of the circuit boards (212, 214, 216, 217, 219, 221) and compressed so that the gold lead wires compress and buckle within the through-plated holes, forming an electrical connection between the circuit boards (212, 214, 216, 217, 219, 221).
Abstract translation: 一种使用几乎纯粹的软退火金在互穿电镀孔内机械压缩的互连电子电路的方法和装置。 本发明的应用是将集成电路小片直接连接到电路板，方法是将金线球焊到集成电路小片的焊盘上，使其与小片表面基本垂直，并将金导线插入到 一旦引线在贯通的镀孔内被压缩，电路板提供电连接和机械连接。 本发明还发现其应用于夹层电路板组件的互连，其中软金引线被插入电路板的轴向对齐的通孔电镀孔中并且被压缩，使得保持引线在通孔电镀孔内压缩和弯曲 ，在电路板之间形成电连接。
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