公开(公告)号：JP2009136114A

公开(公告)日：2009-06-18

申请号：JP2007311008

申请日：2007-11-30

Applicant: Yazaki Corp ,  矢崎総業株式会社

Inventor： IKEDA NAOYUKI

IPC: H02G3/16 ,  B60R16/02

CPC classification number: H05K7/026 ,  H05K1/0263 ,  H05K1/18 ,  H05K2201/10166 ,  H05K2201/10446 ,  H05K2201/10939

Abstract: PROBLEM TO BE SOLVED: To miniaturize a mounted circuit board and an electrical junction box housing it.
SOLUTION: Output terminals 12 are arranged outwards in one row by mounting transistors 10 with control terminals 13 protruded downwards output terminals 12 protruded sideways and input terminals 11 protruded to the side opposite to the control and output terminals on the circuit board 21 in one row, and these terminals are inserted into a connector housing 41 as connector terminals, thus configuring an external connecting connector 40. Then, the input terminals 11 are joined with power supply bus bars 30 erected at the rear of the row of transistors 10, thus configuring the electrical junction box.
COPYRIGHT: (C)2009,JPO&INPIT

Abstract translation: 要解决的问题：为了使安装的电路板和容纳它的电接线盒小型化。

解决方案：输出端子12通过安装晶体管10安装晶体管10，控制端子13向下伸出输出端子12，侧面突出，输入端子11突出到与电路板21上的控制和输出端子相反的一侧 一排，并且这些端子作为连接器端子插入连接器壳体41中，从而构成外部连接连接器40.然后，输入端子11与竖立在晶体管10的后面的电源汇流条30接合， 从而配置电接线盒。 版权所有（C）2009，JPO＆INPIT

公开(公告)号：JP2018152335A

公开(公告)日：2018-09-27

申请号：JP2018043051

申请日：2018-03-09

Applicant: 唐虞企業股▲ふん▼有限公司 ,  Tarng Yu Enterprise co.,ltd

Inventor： 黄 睦容 ,  陳 盈仲

IPC: H01R43/00 ,  H01R12/71

CPC classification number: H01R12/57 ,  H01R13/415 ,  H01R43/20 ,  H05K1/181 ,  H05K2201/10151 ,  H05K2201/10378 ,  H05K2201/10757 ,  H05K2201/10939

Abstract: 【課題】本発明は、携帯電子機器の内部の検出素子と回路基板との電気的接続のために用いられ、検出素子の配置高さを適切な高さに調整するように検出素子を嵩上げすることで、検出素子の適切な機能を確保し、携帯電子機器の歩留まりを向上可能な嵩上げコネクタ及びその製造方法を提供する。 【解決手段】嵩上げコネクタは、複数の導電端子を有し、各導電端子は、検出素子を半田付けするために用いられる第1パッドと、回路基板を半田付けするために用いられる第2パッドとを有し、各第1パッドと各第2パッドとの半田付け面の間の距離が一定であるため、検出素子と回路基板との電気接点間の相対的な距離が一定となる。 【選択図】図1

公开(公告)号：JP4575381B2

公开(公告)日：2010-11-04

申请号：JP2006527647

申请日：2004-07-08

Applicant: 富士通株式会社

Inventor： 英一 森

IPC: F21V23/00 ,  F21S2/00 ,  H02M7/48

CPC classification number: H05K1/181 ,  H05K1/0231 ,  H05K1/0254 ,  H05K3/3426 ,  H05K2201/1003 ,  H05K2201/10189 ,  H05K2201/10462 ,  H05K2201/1053 ,  H05K2201/10636 ,  H05K2201/10651 ,  H05K2201/10757 ,  H05K2201/10939 ,  Y02P70/611

公开(公告)号：US20180331447A1

公开(公告)日：2018-11-15

申请号：US15774412

申请日：2016-11-10

Applicant: Phoenix Contact GmbH & Co. KG

Inventor： Ralf Geske

IPC: H01R13/05 ,  H01R43/16 ,  H01R12/71 ,  H05K1/18

CPC classification number: H01R13/052 ,  H01R12/585 ,  H01R12/71 ,  H01R43/16 ,  H05K1/184 ,  H05K2201/10863 ,  H05K2201/10878 ,  H05K2201/10901 ,  H05K2201/10939

Abstract: A plug contact for electrically contacting a circuit board by inserting the plug contact into a via hole in the circuit board, the plug contact having two flat contact arms that are resilient relative to each other, and a connecting region, from which the two contact arms extend in the plug-in direction of the plug contact, the plug contact being punched as a single piece from a flat metallic material. In the connection region, adjacent to the two contact arms, a recess is formed in the plug contact, the distance between the two contact arms increases from the recess towards the free ends of the contact arms, the two contact arms being spread apart relative to each other and the two contact arms together having a width which is the same as or only slightly smaller than the diameter of the corresponding via hole in the circuit board.

公开(公告)号：US20180288873A1

公开(公告)日：2018-10-04

申请号：US15920806

申请日：2018-03-14

Applicant: Delphi International Operations Luxembourg, S.A.R.L.

Inventor： Matthias Rieke ,  Volker Klink ,  Florin Badarau-Trescovan

IPC: H05K1/14 ,  H05K7/20 ,  H05K5/02 ,  H05K1/02 ,  H05K7/14

CPC classification number: H05K1/147 ,  H05K1/0203 ,  H05K1/184 ,  H05K5/0204 ,  H05K5/0213 ,  H05K7/1427 ,  H05K7/1434 ,  H05K7/20145 ,  H05K7/20154 ,  H05K7/20854 ,  H05K7/20863 ,  H05K2201/056 ,  H05K2201/058 ,  H05K2201/10189 ,  H05K2201/10901 ,  H05K2201/10939

Abstract: An electronic device for a motor vehicle includes a metal tubular casing extending longitudinally and opening at its two ends, and a wall having a curved profile with cooling fins on its outer surface. The electronic device includes an assembly of printed circuit boards comprising a first plurality of printed circuit boards that include heat-generating electronic components. The printed circuit boards of the assembly are connected together by flexible conductive elements. The device further comprises a first heat sink arranged inside the tubular casing comprising a curved wall generally extending parallel to the curved wall of the tubular casing. The first plurality of printed circuit boards is interposed between the curved inner surface of the wall of the casing and the curved wall of the first heat sink so heat is dissipated through the first heat sink and through the curved wall equipped with cooling fins of the tubular casing.

公开(公告)号：US09519018B2

公开(公告)日：2016-12-13

申请号：US14284451

申请日：2014-05-22

Applicant: Dell Products L.P.

Inventor： James Lewis Petivan ,  Alan R. Dellinger

IPC: G01R31/04 ,  H05K3/42 ,  H05K1/02 ,  H05K1/11 ,  H05K3/34

CPC classification number: G01R31/041 ,  G01R31/04 ,  G01R31/2813 ,  G01R31/2818 ,  H05K1/0268 ,  H05K1/0275 ,  H05K1/113 ,  H05K3/3447 ,  H05K3/42 ,  H05K2201/10022 ,  H05K2201/10151 ,  H05K2201/10651 ,  H05K2201/10939 ,  Y10T29/49156 ,  Y10T29/49167

Abstract: In accordance with embodiments of the present disclosure, a circuit board may include a connector configured to electrically couple a device to the circuit board. The connector may include a conductive element configured to be electrically coupled to a first voltage and a detection pad configured to be electrically coupled to a second voltage via a resistor, such that when a device pin of a device is electrically coupled to the conductive element, the detection pad is electrically coupled to the conductive element via the device pin.

Abstract translation: 根据本公开的实施例，电路板可以包括被配置为将设备电耦合到电路板的连接器。 连接器可以包括被配置为电耦合到第一电压的导电元件和被配置为经由电阻器电耦合到第二电压的检测焊盘，使得当器件的器件引脚电耦合到导电元件时， 检测焊盘通过器件引脚电耦合到导电元件。

公开(公告)号：US20120195009A1

公开(公告)日：2012-08-02

申请号：US13392102

申请日：2010-07-29

Applicant: Martin Brueckel ,  Haixiang He ,  Wanchun Jiang

Inventor： Martin Brueckel ,  Haixiang He ,  Wanchun Jiang

IPC: H05K7/14 ,  H05K3/34

CPC classification number: H05K1/144 ,  H01F27/06 ,  H01F2027/065 ,  H05K3/284 ,  H05K3/3447 ,  H05K7/1418 ,  H05K2201/049 ,  H05K2201/1003 ,  H05K2201/10303 ,  H05K2201/10939 ,  Y10T29/49144

Abstract: An electronic product having a double-PCB sandwich structure includes a PCB assembly, and a casing having an open side. The electronic product is configured such that a protuberance is respectively formed on the inner sides of two side walls of the casing in the longitudinal direction, the PCB assembly comprises an electronic component, a base PCB and a main PCB, the length of the base PCB and the length of the main PCB in the longitudinal direction of the casing are substantially equal to each other and slightly smaller than the length of the casing so that the PCB assembly can be installed into the casing by mating with the protuberances.

Abstract translation: 具有双PCB夹层结构的电子产品包括PCB组件和具有开口侧的壳体。 电子产品被构造成使得在纵向方向上分别在壳体的两个侧壁的内侧上形成突起，PCB组件包括电子部件，基底PCB和主PCB，基底PCB的长度 并且主PCB在壳体的纵向方向上的长度基本上彼此相等并且略小于壳体的长度，使得PCB组件可以通过与突起配合而安装到壳体中。

公开(公告)号：US06697215B2

公开(公告)日：2004-02-24

申请号：US09858108

申请日：2001-05-15

Applicant: Mikio Sekine

Inventor： Mikio Sekine

IPC: G11B1702

CPC classification number: H05K1/141 ,  H02K11/215 ,  H02K11/33 ,  H05K3/3447 ,  H05K3/366 ,  H05K2201/1003 ,  H05K2201/10651 ,  H05K2201/10939

Abstract: An index signal output device where a magnetic flux detector is moved in the direction of a relevant tangent to the circumference of a rotor yoke so that the phase difference between an index signal detected by the magnetic flux detector and an index reference signal previously recorded on a floppy disk is within a prescribed range. The lead terminals of the magnetic flux detector are connected to detection signal output terminals on a printed circuit board, and the magnetic flux detector is moved for adjustment in the direction of the tangent by flexing the lead terminals using a tool.

Abstract translation: 一种索引信号输出装置，其中磁通检测器沿与转子轭的圆周相切的切线的方向移动，使得由磁通检测器检测到的指标信号和先前记录在转子轭上的指标参考信号之间的相位差 软盘在规定范围内。 磁通检测器的引线端子连接到印刷电路板上的检测信号输出端子，并且通过使用工具使引线端子弯曲来使磁通量检测器沿切线方向移动。

公开(公告)号：US20010053040A1

公开(公告)日：2001-12-20

申请号：US09858108

申请日：2001-05-15

Applicant: Alps Electric Co., Ltd.

Inventor： Mikio Sekine

IPC: G11B017/02

CPC classification number: H05K1/141 ,  H02K11/215 ,  H02K11/33 ,  H05K3/3447 ,  H05K3/366 ,  H05K2201/1003 ,  H05K2201/10651 ,  H05K2201/10939

Abstract: An index signal output device where a magnetic flux detector is moved in the direction of a relevant tangent to the circumference of a rotor yoke so that the phase difference between an index signal detected by the magnetic flux detector and an index reference signal previously recorded on a floppy disk is within a prescribed range. The lead terminals of the magnetic flux detector are connected to detection signal output terminals on a printed circuit board, and the magnetic flux detector is moved for adjustment in the direction of the tangent by flexing the lead terminals using a tool.

Abstract translation: 一种索引信号输出装置，其中磁通检测器沿与转子轭的圆周相切的切线的方向移动，使得由磁通检测器检测到的指标信号和先前记录在转子轭上的指标参考信号之间的相位差 软盘在规定范围内。 磁通检测器的引线端子连接到印刷电路板上的检测信号输出端子，并且通过使用工具使引线端子弯曲来使磁通量检测器沿切线方向移动。

公开(公告)号：US4882656A

公开(公告)日：1989-11-21

申请号：US258242

申请日：1988-10-14

Applicant: L. William Menzies, Jr. ,  Stephen W. Menzies

Inventor： L. William Menzies, Jr. ,  Stephen W. Menzies

IPC: H01G4/228 ,  H01G2/06 ,  H01G4/35 ,  H01G4/40 ,  H01L23/64 ,  H05K1/02 ,  H05K1/14 ,  H05K1/18 ,  H05K3/34 ,  H05K3/36 ,  H05K7/10

CPC classification number: H01G2/065 ,  H01G4/35 ,  H01G4/40 ,  H01L23/642 ,  H05K1/0231 ,  H05K1/141 ,  H05K7/1092 ,  H01L2924/0002 ,  H01L2924/3011 ,  H05K2201/049 ,  H05K2201/10333 ,  H05K2201/10515 ,  H05K2201/10636 ,  H05K2201/10689 ,  H05K2201/10939 ,  H05K3/3447 ,  H05K3/368 ,  Y02P70/611

Abstract: A decoupling capacitor is mounted on a thin auxiliary board and connected by metallization traces on the board to a single pair of plug-in contacts press-fitted into a pair of apertures in a pair of integral tabs extending from the board. The auxiliary board and capacitor height is not more than about 0.070 inches. The plug-in contacts are pluggable into a pair of sockets in a printed circuit board. The auxiliary insulative board with its attached capacitor is sandwiched between a surface of a printed circuit board having a plurality of sockets, and the underside of a dual-in-line (DIP) integrated circuit package. At least two leads of the DIP package are inserted into the pair of insertable contacts in the auxliary isulative board while the remainder of the DIP package leads are inserted directly into other sockets in the printed circuit board. In one embodiment, other DIP leads pass through clearance holes in a second pair of integral tabs. Another embodiment provides for redundant capacitors each connected to separate pairs of contacts on the auxiliary board for interconnection of two ground leads and two power leads of the DIP to respective PC board sockets.

Abstract translation: 去耦电容器安装在薄的辅助板上，并通过板上的金属化迹线连接到一对插入式触点，该插入式触点压配合到从板延伸的一对整体的一对孔中的一对孔中。 辅助板和电容器高度不超过约0.070英寸。 插入式触点可插入印刷电路板中的一对插座中。 具有附加电容器的辅助绝缘板被夹在具有多个插座的印刷电路板的表面和双列直插（DIP）集成电路封装的下侧之间。 DIP封装的至少两个引线插入辅助绝缘板中的一对可插入触点中，而其余DIP封装引线直接插入到印刷电路板的其他插槽中。 在一个实施例中，其它DIP引线通过第二对整体接头中的间隙孔。 另一个实施例提供了冗余电容器，每个冗余电容器连接到辅助板上的分离的触点对，用于将两个接地引线和DIP的两个电源引线互连到相应的PC板插槽。