Abstract:
본 발명은, SiC MOSFET의 오믹 접합 형성방법에 있어서, SiC에 n형 도핑영역과 p형 도핑영역을 형성하는 제 1단계와; 상기 n형 도핑영역과 p형 도핑영역에 Ti와 Ni의 박막을 연속적으로 동시에 형성하는 제 2단계와; 상기 Ti와 Ni의 박막이 형성된 SiC를 열처리하여 n형 도핑영역과 p형 도핑영역에 오믹접합을 동시에 형성하는 제 3단계;를 포함하여 구성되는 SiC MOSFET의 오믹 접합 형성방법을 기술적 요지로 한다. 이에 따라, p형 영역과 n형 영역에 오믹 전극을 형성하기 위한 공정에 있어서 동일한 물질을 사용하여 p형 영역과 n형 영역에 대하여 동시에 오믹 전극을 형성함으로써 제작공정을 단순화하고, 또한 접촉저항을 낮춰서 SiC MOSFET 소자의 특성을 개선시키는 이점이 있다.
Abstract:
The present invention relates to an SiC MOSFET having a trench and a manufacturing method thereof. According to one embodiment of the present invention, the SiC MOSFET having a trench and the manufacturing method thereof include a first step of etching a trench in a SiC substrate; a second step of vertically ion-injecting vanadium into the SiC substrate; a third step of ion-injecting nitrogen into a trench sidewall; and a forth step of forming a trench gate structure.
Abstract:
The present invention relates to a method for manufacturing a silicon oxide gate insulating film in a low temperature process comprising a first step for forming silica solution by distributing a silica particle to water and reforming the surface of the silica particle by using organosilane; a second step for replacing the water of the first step with an organic solvent; a third step for forming mixed solution by mixing solution that epoxy resin is dissolved and the silica solution; a fourth step for coating the mixed solution on a substrate; and a fifth step for performing heat processing in a 120-300 temperature. The present invention is provided to manufacture silicon oxide for a gate insulating film by forming the silicon oxide and performing the heat processing below a 300 temperature, thereby applying the silicon oxide to a polymer material substrate. [Reference numerals] (AA) Manufacture a silicon oxide gate insulating film in a low temperature process; (BB) Reform silica surface; (CC,DD) Reform the silica surface with organosilane; (EE) Replace a solvent with an organic solvent; (FF) Dissolve epoxy resin; (GG) Mix and respond the reformed silica and epoxy solution; (HH) Form a coating film and perform heat processing
Abstract:
PURPOSE: A method for forming a graphene thin film and a graphene manufactured by the same method are provided to grow a single crystal metal film easily and inexpensively by growing a single crystal metal film on a single crystal substrate and forming a graphene thin film on a single crystal metal film. CONSTITUTION: A method for forming a graphene thin film includes following steps: A single crystal substrate(10) is prepared. A single crystal metal film(20) is grown on a single crystal substrate. A graphene film(30) is formed on a single crystal metal film. The single crystal substrate is sapphire(α-Al_2O_3). The single crystal metal film is a transition metal. In a single crystal metal film formation step, a thermal evaporation technique and an e-beam evaporation technique are used in order to grow a single crystal metal film.
Abstract:
본 발명은 실리콘 카바이드 표면에 인위적으로 표면거칠기를 유발할 수 있는 새로운 방법을 제시한다. 본 발명에 의하면, 표면에 특정한 패턴을 형성하기 위한 별도의 공정이 전혀 필요하지 않으며, 실리콘 카바이드 상부에 플라즈마 건식식각에 의하여 자연적으로 표면거칠기가 유발되는 물질(예를 들어 실리콘)을 적층하거나, 또는 각종 금속 성분이나 산화물, 질화물 등의 재질을 갖는 나노분말(nano powder)을 실리콘 카바이드 표면에 뿌린 후 플라즈마 건식식각 공정을 거쳐서 반사도가 0에 가까운 블랙 실리콘 카바이드를 손쉽게 얻을 수 있다. 상기 블랙 실리콘 카바이드는 광소자, 생체소자, 각종 화학센서 등에 응용될 수 있다.
Abstract:
PURPOSE: A high power field emission device and a manufacturing method thereof are provided to improve device properties by controlling nano wire growth of edge, side, and rear side of a metal disc. CONSTITUTION: A metal disc(100) is used as a cathode of a field emission device. An oxidation-resistant layer(110) is formed in the rear side of the metal disc. A metallic nano wire(120) evaporates a metal layer on the side and upper side edge of the metal disc. The metallic nano wire is used as a field emitting tip of the field emission device. A metal oxide insulating layer(130) is formed with metallic nano wire at the same time. The metal oxide insulating layer is formed on the side and upper side edge part of the metal disc in which the metal layer is evaporated.
Abstract:
PURPOSE: A method for forming a terminal structure of a voltage electric field emission device is provided to improve electric field emission efficiency by concentrating electric field between an anode and a cathode. CONSTITUTION: A mask pattern is formed on a substrate(100) to define the effective electric field emission area of the electric field emission device. The cross section of the mask is reflowed to have a curvature. The substrate is dryly etched by using the reflowed mask. Catalyst metal is deposited on the substrate transferred with the section shape of the mask to grow an electric field emission tip(104). The electric field emission tip is grown by using catalyst metal or chemical vapor deposition method. A cathode electrode is formed on the rear of the substrate. An electric field emission device structure is finally obtained by cutting the substrate.