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公开(公告)号:AU2014235032B2
公开(公告)日:2017-11-09
申请号:AU2014235032
申请日:2014-03-13
Applicant: BUTTERFLY NETWORK INC
Inventor: ROTHBERG JONATHAN M , FIFE KEITH G , RALSTON TYLER S , CHARVAT GREGORY L , SANCHEZ NEVADA J
Abstract: To implement a single-chip ultrasonic imaging solution, on-chip signal processing may be employed in the receive signal path to reduce data bandwidth and a high-speed serial data module may be used to move data for all received channels off-chip as digital data stream. The digitization of received signals on-chip allows advanced digital signal processing to be performed on-chip, and thus permits the full integration of an entire ultrasonic imaging system on a single semiconductor substrate. Various novel waveform generation techniques, transducer configuration and biasing methodologies, etc., are likewise disclosed. HIFU methods may additionally or alternatively be employed as a component of the "ultrasound- on- a-chip" solution disclosed herein.
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公开(公告)号:AU2017203545A1
公开(公告)日:2017-06-15
申请号:AU2017203545
申请日:2017-05-26
Applicant: BUTTERFLY NETWORK INC
Inventor: ROTHBERG JONATHAN M , SANCHEZ NEVADA , CHARVAT GREGORY , RALSTON TYLER
Abstract: An apparatus, comprising: a plurality of radiation sources comprising a first radiation source, a second radiation source, and a third radiation source; a plurality of radiation sensors configured to receive radiation of wavelength A emitted by one or more of the first, second, or third radiation sources, the plurality of radiation sensors including a first radiation sensor and a second radiation sensor, wherein the plurality of radiation sensors is sparsely arranged such that a spacing between the first radiation sensor and its nearest neighboring radiation sensor of the plurality of radiation sensors is greater than A/2; and processing circuitry coupled to the first radiation sensor and the second radiation sensor and configured to receive and discriminate between, for each of the first and second radiation sensors, respective source signals emitted by the first, second, and third radiation sources, wherein the first radiation source, the second radiation source, and the first radiation sensor lie in a first plane, and wherein the second radiation source, the third radiation source, and the second radiation sensor lie in a second plane different than the first plane. cv,) x N<
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公开(公告)号:AU2015247484A1
公开(公告)日:2016-11-10
申请号:AU2015247484
申请日:2015-04-17
Applicant: BUTTERFLY NETWORK INC
Inventor: ROTHBERG JONATHAN M , FIFE KEITH G , SANCHEZ NEVADA J , ALIE SUSAN A
IPC: H01L27/06 , A61B5/02 , A61B8/00 , B06B1/02 , B81C1/00 , H01L21/768 , H01L27/092
Abstract: Micromachined ultrasonic transducers formed in complementary metal oxide semiconductor (CMOS) wafers are described, as are methods of fabricating such devices. A metallization layer of a CMOS wafer may be removed by sacrificial release to create a cavity of an ultrasonic transducer. Remaining layers may form a membrane of the ultrasonic transducer.
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公开(公告)号:CA2946137A1
公开(公告)日:2015-10-22
申请号:CA2946137
申请日:2015-04-17
Applicant: BUTTERFLY NETWORK INC
Inventor: ROTHBERG JONATHAN M , RALSTON TYLER S , SANCHEZ NEVADA J , CASPER ANDREW J
Abstract: To implement a single-chip ultrasonic imaging solution, on-chip signal processing may be employed in the receive signal path to reduce data bandwidth and an output data module may be used to move data for all received channels off-chip as a digital data stream. The digitization of received signals on-chip allows advanced digital signal processing to be performed on-chip, and thus permits the full integration of an entire ultrasonic imaging system on a single semiconductor substrate. The on-chip digitization of received signals also enables the on-chip integration of ultrasound processing and/or pre-processing to reduce the burden on off-chip computing. Data compression architectures are disclosed to facilitate the transfer of data off-chip as a digital data stream in accordance with the bandwidth requirements of standard commercially- available output interfaces.
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公开(公告)号:AU2014223521A1
公开(公告)日:2015-09-24
申请号:AU2014223521
申请日:2014-02-26
Applicant: BUTTERFLY NETWORK INC
Inventor: ROTHBERG JONATHAN M , RALSTON TYLER S , CHARVAT GREGORY L , SANCHEZ NEVADA J , MAGARY ALEXANDER
Abstract: Ultrasound imaging devices and heads up displays, as well and systems utilizing both are described. In some embodiments, ultrasound data or images may be displayed on a heads up display, which may be a head-mounted display. One or more users may manipulate the images. Image capture devices and sensors may also be implemented.
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56.
公开(公告)号:CA2905040A1
公开(公告)日:2014-09-25
申请号:CA2905040
申请日:2014-03-13
Applicant: BUTTERFLY NETWORK INC
Inventor: ROTHBERG JONATHAN M , FIFE KEITH G , RALSTON TYLER S , CHARVAT GREGORY L , SANCHEZ NEVADA J
Abstract: Complementary metal oxide semiconductor (CMOS) ultrasonic transducers (CUTs) and methods for forming CUTs are described. The CUTs may include monolithically integrated ultrasonic transducers and integrated circuits for operating in connection with the transducers. The CUTs may be used in ultrasound devices such as ultrasound imaging devices and/or high intensity focused ultrasound (HIFU) devices.
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公开(公告)号:CA2902550A1
公开(公告)日:2014-09-04
申请号:CA2902550
申请日:2014-02-26
Applicant: BUTTERFLY NETWORK INC
Inventor: ROTHBERG JONATHAN M , RALSTON TYLER S , CHARVAT GREGORY L , SANCHEZ NEVADA J , MAGARY ALEXANDER
Abstract: Ultrasound imaging devices and heads up displays, as well and systems utilizing both are described. In some embodiments, ultrasound data or images may be displayed on a heads up display, which may be a head-mounted display. One or more users may manipulate the images. Image capture devices and sensors may also be implemented.
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公开(公告)号:CA2851839A1
公开(公告)日:2013-04-25
申请号:CA2851839
申请日:2012-10-17
Applicant: BUTTERFLY NETWORK INC
Inventor: ROTHBERG JONATHAN M , SANCHEZ NEVADA , CHARVAT GREGORY , RALSTON TYLER
Abstract: Apparatus and methods are described that include ultrasound imaging devices, which may operate in a transmissive ultrasound imaging modality, and which may be used to detect properties of interest of a subject such as index of refraction, density and/or speed of sound. Devices suitable for performing high intensity focused ultrasound (HIFU), as well as HIFU and ultrasound imaging, are also described.
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59.
公开(公告)号:CA2946120C
公开(公告)日:2022-10-25
申请号:CA2946120
申请日:2015-04-17
Applicant: BUTTERFLY NETWORK INC
Inventor: ROTHBERG JONATHAN M , RALSTON TYLER S , SANCHEZ NEVADA J , CASPER ANDREW J
Abstract: Aspects of the technology described herein relate to ultrasound device circuitry as may form part of a single substrate ultrasound device having integrated ultrasonic transmission units, a delay mesh circuitry integrated with the substrate, coupled to inputs of the plurality of ultrasound transmission units and configured to output to the plurality of ultrasound transmission units a plurality of time-delayed versions of a delay mesh circuitry input signal corresponding to a waveform generated by a waveform generator.
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公开(公告)号:AU2022218473A1
公开(公告)日:2022-09-08
申请号:AU2022218473
申请日:2022-08-15
Applicant: BUTTERFLY NETWORK INC
Inventor: CRISTMAN PAUL FRANCIS , SANCHEZ NEVADA J , ALIE SUSAN A , ZAHORIAN JAIME SCOTT , DE JONGE MATTHEW , FIFE KEITH G , RALSTON TYLER S , MCNULTY CHRISTOPHER THOMAS , ROTHBERG JONATHAN M
Abstract: An ultrasound device is described configurable to operate in a variety of modes. At least some of the modes are associated with different frequencies of ultrasound signals. A system is also described, comprising a multi-modal ultrasound probe configured to operate in a plurality of operating modes associated with a respective plurality of configuration profiles .0 and a computing device coupled to the handheld multi-modal ultrasound probe and configured to, in response to receiving input indicating an operating mode selected by a user, cause the multi-modal ultrasound probe to operate in the selected operating mode.
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