Monolithic ultrasonic imaging devices, systems and methods

    公开(公告)号:AU2014235032B2

    公开(公告)日:2017-11-09

    申请号:AU2014235032

    申请日:2014-03-13

    Abstract: To implement a single-chip ultrasonic imaging solution, on-chip signal processing may be employed in the receive signal path to reduce data bandwidth and a high-speed serial data module may be used to move data for all received channels off-chip as digital data stream. The digitization of received signals on-chip allows advanced digital signal processing to be performed on-chip, and thus permits the full integration of an entire ultrasonic imaging system on a single semiconductor substrate. Various novel waveform generation techniques, transducer configuration and biasing methodologies, etc., are likewise disclosed. HIFU methods may additionally or alternatively be employed as a component of the "ultrasound- on- a-chip" solution disclosed herein.

    Transmissive imaging and related apparatus and methods

    公开(公告)号:AU2017203545A1

    公开(公告)日:2017-06-15

    申请号:AU2017203545

    申请日:2017-05-26

    Abstract: An apparatus, comprising: a plurality of radiation sources comprising a first radiation source, a second radiation source, and a third radiation source; a plurality of radiation sensors configured to receive radiation of wavelength A emitted by one or more of the first, second, or third radiation sources, the plurality of radiation sensors including a first radiation sensor and a second radiation sensor, wherein the plurality of radiation sensors is sparsely arranged such that a spacing between the first radiation sensor and its nearest neighboring radiation sensor of the plurality of radiation sensors is greater than A/2; and processing circuitry coupled to the first radiation sensor and the second radiation sensor and configured to receive and discriminate between, for each of the first and second radiation sensors, respective source signals emitted by the first, second, and third radiation sources, wherein the first radiation source, the second radiation source, and the first radiation sensor lie in a first plane, and wherein the second radiation source, the third radiation source, and the second radiation sensor lie in a second plane different than the first plane. cv,) x N<

    ULTRASONIC IMAGING COMPRESSION METHODS AND APPARATUS

    公开(公告)号:CA2946137A1

    公开(公告)日:2015-10-22

    申请号:CA2946137

    申请日:2015-04-17

    Abstract: To implement a single-chip ultrasonic imaging solution, on-chip signal processing may be employed in the receive signal path to reduce data bandwidth and an output data module may be used to move data for all received channels off-chip as a digital data stream. The digitization of received signals on-chip allows advanced digital signal processing to be performed on-chip, and thus permits the full integration of an entire ultrasonic imaging system on a single semiconductor substrate. The on-chip digitization of received signals also enables the on-chip integration of ultrasound processing and/or pre-processing to reduce the burden on off-chip computing. Data compression architectures are disclosed to facilitate the transfer of data off-chip as a digital data stream in accordance with the bandwidth requirements of standard commercially- available output interfaces.

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