Ultrasonic imaging compression methods and apparatus

    公开(公告)号:AU2019201147B2

    公开(公告)日:2021-01-28

    申请号:AU2019201147

    申请日:2019-02-19

    Abstract: An ultrasound device, comprising: at least one ultrasonic transducer element integrated on a semiconductor die; an analog receive circuit integrated on the semiconductor die, the analog receive circuit arranged to receive an output signal from the at least one ultrasonic transducer element; and a receive compression circuit integrated on the semiconductor die and configured to generate a compressed digital signal prior to any image reconstruction process being performed, the receive compression circuit comprising: a data reduction circuit having an input connected to an output of the analog receive circuit, the data reduction circuit configured to generate the compressed digital signal; and a digital signal processing block in communication with the data reduction circuit, the digital signal processing block arranged to receive the compressed digital signal and perform at least a portion of an image reconstruction process; wherein an output of the digital signal processing block is configured to be transmitted from the semiconductor die as a data stream. 00 0o -oo co L N + N + N + N + rn m xx

    Ultrasonic imaging compression methods and apparatus

    公开(公告)号:AU2019201147A1

    公开(公告)日:2019-03-07

    申请号:AU2019201147

    申请日:2019-02-19

    Abstract: An ultrasound device, comprising: at least one ultrasonic transducer element integrated on a semiconductor die; an analog receive circuit integrated on the semiconductor die, the analog receive circuit arranged to receive an output signal from the at least one ultrasonic transducer element; and a receive compression circuit integrated on the semiconductor die and configured to generate a compressed digital signal prior to any image reconstruction process being performed, the receive compression circuit comprising: a data reduction circuit having an input connected to an output of the analog receive circuit, the data reduction circuit configured to generate the compressed digital signal; and a digital signal processing block in communication with the data reduction circuit, the digital signal processing block arranged to receive the compressed digital signal and perform at least a portion of an image reconstruction process; wherein an output of the digital signal processing block is configured to be transmitted from the semiconductor die as a data stream. co a.,a 4-' 4-' C c -o L r4 0 + + + + r-U No N L +N+ kN xx

    Ultrasonic imaging compression methods and apparatus

    公开(公告)号:AU2015247501B2

    公开(公告)日:2018-11-29

    申请号:AU2015247501

    申请日:2015-04-17

    Abstract: To implement a single-chip ultrasonic imaging solution, on-chip signal processing may be employed in the receive signal path to reduce data bandwidth and an output data module may be used to move data for all received channels off-chip as a digital data stream. The digitization of received signals on-chip allows advanced digital signal processing to be performed on-chip, and thus permits the full integration of an entire ultrasonic imaging system on a single semiconductor substrate. The on-chip digitization of received signals also enables the on-chip integration of ultrasound processing and/or pre-processing to reduce the burden on off-chip computing. Data compression architectures are disclosed to facilitate the transfer of data off-chip as a digital data stream in accordance with the bandwidth requirements of standard commercially- available output interfaces.

    Ultrasonic imaging compression methods and apparatus

    公开(公告)号:AU2015247501A1

    公开(公告)日:2016-11-10

    申请号:AU2015247501

    申请日:2015-04-17

    Abstract: To implement a single-chip ultrasonic imaging solution, on-chip signal processing may be employed in the receive signal path to reduce data bandwidth and an output data module may be used to move data for all received channels off-chip as a digital data stream. The digitization of received signals on-chip allows advanced digital signal processing to be performed on-chip, and thus permits the full integration of an entire ultrasonic imaging system on a single semiconductor substrate. The on-chip digitization of received signals also enables the on-chip integration of ultrasound processing and/or pre-processing to reduce the burden on off-chip computing. Data compression architectures are disclosed to facilitate the transfer of data off-chip as a digital data stream in accordance with the bandwidth requirements of standard commercially- available output interfaces.

    ULTRASONIC IMAGING COMPRESSION METHODS AND APPARATUS

    公开(公告)号:CA2946137A1

    公开(公告)日:2015-10-22

    申请号:CA2946137

    申请日:2015-04-17

    Abstract: To implement a single-chip ultrasonic imaging solution, on-chip signal processing may be employed in the receive signal path to reduce data bandwidth and an output data module may be used to move data for all received channels off-chip as a digital data stream. The digitization of received signals on-chip allows advanced digital signal processing to be performed on-chip, and thus permits the full integration of an entire ultrasonic imaging system on a single semiconductor substrate. The on-chip digitization of received signals also enables the on-chip integration of ultrasound processing and/or pre-processing to reduce the burden on off-chip computing. Data compression architectures are disclosed to facilitate the transfer of data off-chip as a digital data stream in accordance with the bandwidth requirements of standard commercially- available output interfaces.

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