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公开(公告)号：KR20200125658A
公开(公告)日：2020-11-04
申请号：KR20207027444
申请日：2019-02-26
Applicant: BUTTERFLY NETWORK INC
Inventor： ZASLAVSKY MAXIM , DE JONGE MATTHEW , GAFNER TOMER , DUFFY EAMON , ROTHBERG JONATHAN M
IPC: A61B8/00 , G06F3/0482 , G06T19/00 , G16H40/67
Abstract: 본명세서에설명된기술의양태들은원격의료를이용한초음파데이터수집에관한것이다. 지시자전자디바이스는지시자증강현실인터페이스를디스플레이를위해생성하고, 지시자증강현실인터페이스상에서, 초음파이미징디바이스를이동시키기위한명령을수신할수 있다. 지시자증강현실인터페이스는초음파이미징디바이스를보여주는비디오및 비디오상의화살표들의중첩을포함할수 있고, 화살표들각각은초음파이미징디바이스를이동시키기위한가능한명령에대응한다. 사용자전자디바이스는, 지시자전자디바이스로부터, 초음파이미징디바이스를이동시키기위한명령을수신하고, 사용자전자디바이스상에서보여진사용자증강현실인터페이스상에, 초음파이미징디바이스를이동시키기위한명령을디스플레이를위해생성할수 있다. 사용자증강현실인터페이스는초음파이미징디바이스를보여주는비디오및 명령에대응하는비디오상에중첩된화살표를포함할수 있다.
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2.发明申请COMPLEMENTARY METAL OXIDE SEMICONDUCTOR (CMOS) ULTRASONIC TRANSDUCERS AND METHODS FOR FORMING THE SAME 审中-公开补充金属氧化物半导体（CMOS）超声波传感器及其形成方法
公开(公告)号：WO2014151525A3
公开(公告)日：2015-04-09
申请号：PCT/US2014025924
申请日：2014-03-13
Applicant: BUTTERFLY NETWORK INC
Inventor： ROTHBERG JONATHAN M , FIFE KEITH G , RALSTON TYLER S , CHARVAT GREGORY L , SANCHEZ NEVADA J
CPC classification number: B81C1/00301 , B06B1/02 , B06B1/0292 , B81B7/007 , B81C1/00134 , B81C1/00158 , B81C1/00246 , B81C2201/0195 , B81C2203/0735 , B81C2203/0771 , G01N29/2406 , H01L29/84 , H04R19/005
Abstract: Complementary metal oxide semiconductor (CMOS) ultrasonic transducers (CUTs) and methods for forming CUTs are described. The CUTs may include monolithically integrated ultrasonic transducers and integrated circuits for operating in connection with the transducers. The CUTs may be used in ultrasound devices such as ultrasound imaging devices and/or high intensity focused ultrasound (HIFU) devices.
Abstract translation: 描述了互补金属氧化物半导体（CMOS）超声波换能器（CUT）以及用于形成CUT的方法。 CUT可以包括用于与换能器连接的单体集成超声换能器和集成电路。 CUT可用于超声波装置，例如超声成像装置和/或高强度聚焦超声（HIFU）装置。
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公开(公告)号：WO2014134175A3
公开(公告)日：2015-01-08
申请号：PCT/US2014018696
申请日：2014-02-26
Applicant: BUTTERFLY NETWORK INC
Inventor： ROTHBERG JONATHAN M , RALSTON TYLER S , CHARVAT GREGORY L , SANCHEZ NEVADA J , MAGARY ALEXANDER
CPC classification number: A61B8/462 , A61B5/0013 , A61B5/0035 , A61B5/0077 , A61B5/01 , A61B5/02055 , A61B5/04005 , A61B5/0402 , A61B5/14542 , A61B5/7425 , A61B5/7445 , A61B8/13 , A61B8/15 , A61B8/4416 , A61B8/4427 , A61B8/463 , A61B8/5207 , A61B8/5261 , A61B8/54 , A61B8/56 , A61B8/565 , G02B27/017 , G02B2027/0138
Abstract: Ultrasound imaging devices and heads up displays, as well and systems utilizing both are described. In some embodiments, ultrasound data or images may be displayed on a heads up display, which may be a head-mounted display. One or more users may manipulate the images. Image capture devices and sensors may also be implemented.
Abstract translation: 描述超声成像装置和抬头显示器以及利用两者的系统。 在一些实施例中，超声数据或图像可以显示在可以是头戴式显示器的抬头显示器上。 一个或多个用户可以操纵图像。 还可以实现图像捕获设备和传感器。
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公开(公告)号：WO2014151362A3
公开(公告)日：2014-11-13
申请号：PCT/US2014025567
申请日：2014-03-13
Applicant: BUTTERFLY NETWORK INC
Inventor： ROTHBERG JONATHAN M , FIFE KEITH G , RALSTON TYLER S , CHARVAT GREGORY L , SANCHEZ NEVADA J
CPC classification number: A61B8/4494 , A61B8/14 , A61B8/145 , A61B8/4483 , A61B8/4488 , A61B8/485 , A61B8/54 , A61N7/00 , A61N7/02 , B06B1/02 , B81C1/00246 , G01S7/52019 , G01S7/52034 , G01S7/52047 , G01S7/5208 , G01S15/02 , G01S15/8915 , G01S15/8977 , H04R1/00 , Y10T29/41
Abstract: To implement a single-chip ultrasonic imaging solution, on-chip signal processing may be employed in the receive signal path to reduce data bandwidth and a high-speed serial data module may be used to move data for all received channels off-chip as digital data stream. The digitization of received signals on-chip allows advanced digital signal processing to be performed on-chip, and thus permits the full integration of an entire ultrasonic imaging system on a single semiconductor substrate. Various novel waveform generation techniques, transducer configuration and biasing methodologies, etc., are likewise disclosed. HIFU methods may additionally or alternatively be employed as a component of the "ultrasound- on- a-chip" solution disclosed herein.
Abstract translation: 为了实现单芯片超声成像解决方案，可以在接收信号路径中采用片上信号处理来减少数据带宽，并且可以使用高速串行数据模块来将所有接收到的通道的数据移出片外作为数字 数据流。 片上接收信号的数字化允许片上执行先进的数字信号处理，从而允许将整个超声成像系统完全集成在单个半导体衬底上。 同样公开了各种新颖的波形生成技术，换能器配置和偏置方法等。 HIFU方法可以附加地或可选地用作本文公开的“片上超声波”解决方案的组件。
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5.发明申请INTERCONNECTABLE ULTRASOUND TRANSDUCER PROBES AND RELATED METHODS AND APPARATUS 审中-公开互连超声波传感器探头及相关方法和装置
公开(公告)号：WO2015013245A3
公开(公告)日：2015-04-23
申请号：PCT/US2014047553
申请日：2014-07-22
Applicant: BUTTERFLY NETWORK INC
Inventor： ROTHBERG JONATHAN M , FIFE KEITH G , SANCHEZ NEVADA J , RALSTON TYLER S , CHARVAT GREGORY L , CORTEVILLE GREGORY
CPC classification number: A61B8/4444 , A61B8/13 , A61B8/14 , A61B8/4411 , A61B8/4477 , A61B8/4483 , A61B8/4488 , A61B8/4494 , A61B8/483 , A61B8/5207 , A61B8/54 , A61B8/56 , A61N7/02 , A61N2007/0078 , B06B1/0292 , G01S7/003 , G01S7/5208 , G01S7/52084 , G01S15/8915 , G03B27/423 , G03B27/52 , Y10T29/49005
Abstract: Ultrasound devices and methods are described, including a repeatable ultrasound transducer probe having ultrasonic transducers and corresponding circuitry. The repeatable ultrasound transducer probe may be used individually or coupled with other instances of the repeatable ultrasound transducer probe to create a desired ultrasound device. The ultrasound devices may optionally be connected to various types of external devices to provide additional processing and image rendering functionality.
Abstract translation: 描述了超声装置和方法，包括具有超声换能器和相应电路的可重复的超声换能器探头。 可重复的超声换能器探针可以单独使用或与可重复的超声换能器探头的其它实例相结合以产生所需的超声波装置。 超声设备可以可选地连接到各种类型的外部设备以提供额外的处理和图像呈现功能。
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Patent Agency Ranking
公开(公告)号：AU2017281280B2
公开(公告)日：2022-01-06
申请号：AU2017281280
申请日：2017-06-19
Applicant: BUTTERFLY NETWORK INC
Inventor： ROTHBERG JONATHAN M , ALIE SUSAN A , ZAHORIAN JAIME SCOTT , CRISTMAN PAUL FRANCIS , FIFE KEITH G
Abstract: An ultrasound-on-a-chip device has an ultrasonic transducer substrate with plurality of transducer cells, and an electrical substrate. For each transducer cell, one or more conductive bond connections are disposed between the ultrasonic transducer substrate and the electrical substrate. Examples of electrical substrates include CMOS chips, integrated circuits including analog circuits, interposers and printed circuit boards.
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公开(公告)号：AU2019201147B2
公开(公告)日：2021-01-28
申请号：AU2019201147
申请日：2019-02-19
Applicant: BUTTERFLY NETWORK INC
Inventor： ROTHBERG JONATHAN M , RALSTON TYLER S , SANCHEZ NEVADA J , CASPER ANDREW J
Abstract: An ultrasound device, comprising: at least one ultrasonic transducer element integrated on a semiconductor die; an analog receive circuit integrated on the semiconductor die, the analog receive circuit arranged to receive an output signal from the at least one ultrasonic transducer element; and a receive compression circuit integrated on the semiconductor die and configured to generate a compressed digital signal prior to any image reconstruction process being performed, the receive compression circuit comprising: a data reduction circuit having an input connected to an output of the analog receive circuit, the data reduction circuit configured to generate the compressed digital signal; and a digital signal processing block in communication with the data reduction circuit, the digital signal processing block arranged to receive the compressed digital signal and perform at least a portion of an image reconstruction process; wherein an output of the digital signal processing block is configured to be transmitted from the semiconductor die as a data stream. 00 0o -oo co L N + N + N + N + rn m xx
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公开(公告)号：AU2019251103A1
公开(公告)日：2020-10-15
申请号：AU2019251103
申请日：2019-04-09
Applicant: BUTTERFLY NETWORK INC
Inventor： ROTHBERG JONATHAN M , RALSTON TYLER S , SANCHEZ NEVADA J , MARTIN JOHN , PEYTON GRAHAM , SOLEIMANI HAMID
IPC: G01S7/52
Abstract: Aspects of the technology described herein relate to wirelessly offloading, from a wearable ultrasound device, ultrasound data sufficient for forming one or more ultrasound images therefrom. The wearable ultrasound device may include an ultrasound patch. Indications that may be monitored with such a device, and therapeutic uses that may be provided by such a device, are also described. Methods and apparatuses are also described for compounding multilines of ultrasound data on an ultrasound device configured to collect the ultrasound data. Additionally, certain aspects of the technology relate to non-uniform grouping of ultrasound transducers that share a transmit/receive circuit in an ultrasound device.
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公开(公告)号：CA2851839C
公开(公告)日：2020-09-15
申请号：CA2851839
申请日：2012-10-17
Applicant: BUTTERFLY NETWORK INC
Inventor： ROTHBERG JONATHAN M , SANCHEZ NEVADA , CHARVAT GREGORY , RALSTON TYLER
Abstract: Apparatus and methods are described that include ultrasound imaging devices, which may operate in a transmissive ultrasound imaging modality, and which may be used to detect properties of interest of a subject such as index ofrefraction, density and/or speed of sound. Devices suitable for performing high intensity focused ultrasound (HIFU), as well as HIFU and ultrasound imaging, are also described.
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公开(公告)号：AU2015247484B2
公开(公告)日：2020-05-14
申请号：AU2015247484
申请日：2015-04-17
Applicant: BUTTERFLY NETWORK INC
Inventor： ROTHBERG JONATHAN M , FIFE KEITH G , SANCHEZ NEVADA J , ALIE SUSAN A
IPC: H01L27/06 , A61B5/02 , A61B8/00 , B06B1/02 , B81C1/00 , H01L21/768 , H01L27/092
Abstract: Micromachined ultrasonic transducers formed in complementary metal oxide semiconductor (CMOS) wafers are described, as are methods of fabricating such devices. A metallization layer of a CMOS wafer may be removed by sacrificial release to create a cavity of an ultrasonic transducer. Remaining layers may form a membrane of the ultrasonic transducer.
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