公开(公告)号：US20060166284A1

公开(公告)日：2006-07-27

申请号：US10512215

申请日：2003-04-30

Applicant: David Light ,  Kirk McLean

Inventor： David Light ,  Kirk McLean

IPC: A61K39/395 ,  G01N33/53 ,  C07K16/40

CPC classification number: G01N33/86 ,  A61K2039/505 ,  C07K16/36 ,  C07K16/40 ,  C07K2317/622 ,  G01N2800/224

Abstract: This invention relates to novel antibodies that bind with greater affinity to the factor VIIa/tissue factor (FVIIa/TF) complex than to tissue factor (TF) alone, do not compete for binding to TF with FVII and FX, an inhibit FX activation. The antibodies bind at the site of injury and prevent the initiation of thrombosis. The antibodies can be used to treat a variety of thrombotic conditions including but not limited to deep vein thrombosis, disseminated intravascular coagulation, and acute coronary syndrome.

Abstract translation: 本发明涉及与单独的组织因子（TF）相比，与因子VIIa /组织因子（FVIIa / TF）复合物具有更高亲和力结合的新型抗体，不竞争与FVII和FX的结合，抑制FX激活。 抗体在损伤部位结合并防止血栓形成的发生。 抗体可用于治疗各种血栓形成病症，包括但不限于深静脉血栓形成，弥散性血管内凝血和急性冠状动脉综合征。

公开(公告)号：US07067742B2

公开(公告)日：2006-06-27

申请号：US10033988

申请日：2001-12-28

Applicant: Thomas H. DiStefano ,  Joseph Fjelstad ,  Belgacem Haba ,  Owais Jamil ,  Konstantine Karavakis ,  David Light ,  John W. Smith

Inventor： Thomas H. DiStefano ,  Joseph Fjelstad ,  Belgacem Haba ,  Owais Jamil ,  Konstantine Karavakis ,  David Light ,  John W. Smith

IPC: H01R12/04 ,  H05K1/11

CPC classification number: H01L24/72 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01016 ,  H01L2924/01019 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/12042 ,  H05K3/4092 ,  Y10T29/49126 ,  Y10T29/49147 ,  Y10T29/49149 ,  H01L2924/00

Abstract: A connection component for use in making microelectronic element assemblies which has peelable leads that are formed on a dielectric support structure. One end of each lead is permanently connected to the support structure and the opposite end of the lead is releasably connected to the support structure. When the releasable end of the lead is bonded to a contact on a semiconductor chip, the releasable end of the lead can be peeled from the support structure such that the chip may be moved away from the support structure. A compliant layer may be disposed between the chip and the support structure. If a compliant material is injected between the chip and the support structure to form the compliant layer, the compliant material will lift the chip away from the support structure and facilitate the peeling of the leads from the support structure.

公开(公告)号：US20060096501A1

公开(公告)日：2006-05-11

申请号：US10518338

申请日：2003-08-15

Applicant: David Light ,  Christopher Golley ,  Ernest Gay ,  Milton Constantin

Inventor： David Light ,  Christopher Golley ,  Ernest Gay ,  Milton Constantin

IPC: C04B14/04

CPC classification number: C09C1/42 ,  C01P2004/51 ,  C01P2004/54 ,  C01P2004/61 ,  C01P2004/62 ,  C01P2006/22 ,  C01P2006/60 ,  D21H19/40 ,  D21H21/52

Abstract: A pigment product for use in a coating composition to provide a gloss coating on paper, the pigment product comprising a processed particulate kaolin having a particle size distribution such that at least about 80% by weight of the particles have an equivalent spherical diameter less than about 2 p,m and in the range of from about 10% to about 20% by weight of the particles have an equivalent spherical diameter less than about 0.25 wm, the particles have a shape factor in the range of from about 20 to about 36 and the particles have a particle steepness in the range of about greater than about 35, more preferably in the range of about 35 to about 40, and wherein the kaolin is derived from a secondary kaolin source.

公开(公告)号：US06825552B2

公开(公告)日：2004-11-30

申请号：US10139169

申请日：2002-05-06

Applicant: David Light ,  Paula Lagattuta Tostado ,  Michael Warner

Inventor： David Light ,  Paula Lagattuta Tostado ,  Michael Warner

IPC: H01L2348

CPC classification number: H01R13/2414 ,  H01L23/49816 ,  H01L23/49827 ,  H01L2924/0002 ,  H01L2924/15311 ,  H01R43/007 ,  H01L2924/00

Abstract: A connection component for a microelectronic element includes a body of dielectric material having opposing first and second surfaces. A plurality of elongated leads extend through the body between the first and second surfaces. The leads have a first end accessible at the first surface and a second end accessible at the second surface. A layer of anisotropic conductive material overlies the first ends and the first surface of the body for electrical connection of the leads to a microelectronic element.

Abstract translation: 用于微电子元件的连接部件包括具有相对的第一和第二表面的绝缘材料体。 多个细长的引线在第一和第二表面之间延伸通过本体。 引线具有在第一表面可接近的第一端和在第二表面可接近的第二端。 一层各向异性导电材料覆盖在主体的第一端和第一表面上，用于将引线电连接到微电子元件。

公开(公告)号：US06808958B2

公开(公告)日：2004-10-26

申请号：US10093213

申请日：2002-03-07

Applicant: David Light

Inventor： David Light

IPC: H01L2144

CPC classification number: H05K3/3484 ,  H01L21/4853 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/11822 ,  H01L2924/01322 ,  H05K3/3421 ,  H05K3/3436 ,  H05K3/4007 ,  H05K2201/0367 ,  H05K2201/10984 ,  H05K2203/0338 ,  H01L2924/00 ,  H01L2224/05624 ,  H01L2924/00014 ,  H01L2224/05647

Abstract: A method of electrically interconnecting microelectronic elements comprises providing a first microelectronic element having contacts with protrusions and dipping the protrusions into a layer of bonding material. At least some of the bonding material is transferred onto the contacts. The contacts are bonded to conductive features of a second microelectronic element.

Abstract translation: 电连接微电子元件的方法包括提供具有与突起接触的第一微电子元件，并将突起浸入到粘合材料层中。 至少一些粘合材料被转移到触点上。 触点被接合到第二微电子元件的导电特征。

公开(公告)号：US06794202B2

公开(公告)日：2004-09-21

申请号：US09802834

申请日：2001-03-09

Applicant: Masud Beroz ,  David Light

Inventor： Masud Beroz ,  David Light

IPC: H01L2166

CPC classification number: H01L24/81 ,  H01L2224/13111 ,  H01L2224/13609 ,  H01L2224/81801 ,  H01L2224/81907 ,  H01L2224/9205 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01033 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/351 ,  H05K3/3436 ,  H05K2201/10674 ,  H05K2201/10992 ,  H05K2203/162 ,  H05K2203/176 ,  Y02P70/613 ,  H01L2924/00

Abstract: A method of making a microelectronic assembly includes providing a first microelectronic element having one or more conductive bumps, the conductive bumps including a first fusible material that transforms from a solid to a liquid at a first melting temperature, and providing a second microelectronic element having one or more conductive elements. The conductive bumps of the first microelectronic element are electrically interconnected with the conductive elements of the second microelectronic element using a second fusible material, the second fusible material having a second melting temperature that is lower than the first melting temperature of the first fusible material. During the electrically interconnecting step, the second fusible material is maintained at a temperature that is greater than or equal to the second melting temperature and less than the first melting temperature of the first fusible material. The method also includes testing the microelectronic assembly after the electrically interconnecting step while maintaining the second fusible material at a temperature that is greater than or equal to the second melting temperature.

Abstract translation: 一种制造微电子组件的方法包括提供具有一个或多个导电凸块的第一微电子元件，所述导电凸块包括在第一熔化温度下从固体转变为液体的第一可熔材料，以及提供具有一个 或更多导电元件。 第一微电子元件的导电凸块使用第二可熔材料与第二微电子元件的导电元件电互连，第二可熔材料具有低于第一可熔材料的第一熔化温度的第二熔化温度。 在电互连步骤期间，第二可熔材料保持在大于或等于第二熔融温度并小于第一熔融材料的第一熔化温度的温度。 该方法还包括在电互连步骤之后测试微电子组件，同时将第二可熔材料保持在大于或等于第二熔融温度的温度。

公开(公告)号：US06518160B1

公开(公告)日：2003-02-11

申请号：US09245227

申请日：1999-02-05

Applicant: Joseph Fjelstad ,  Belgacem Haba ,  David Light

Inventor： Joseph Fjelstad ,  Belgacem Haba ,  David Light

IPC: H01L2144

CPC classification number: H01L21/486 ,  H05K3/0041 ,  H05K3/061 ,  H05K3/108 ,  H05K3/421 ,  H05K2201/0394 ,  H05K2203/0554 ,  H05K2203/0585

Abstract: A connection component is made by providing an assembly comprising a base layer of a dielectric material, a metal layer overlying the base layer, and a top layer of a plasma-etchable material overlying the metal layer; forming openings in the top layer to produce a top layer mask; and forming first conductive elements from the metal layer by removing metal from regions of the metal layer aligned with the openings in the top layer mask. This method may be used to form a connection component having vias or bond windows formed therein for connection with other elements of a microelectronic device and conductive elements may be formed on either or both sides of the base layer.

Abstract translation: 通过提供包括电介质材料的基底层，覆盖在基底层上的金属层和覆盖在金属层上的等离子体可蚀刻材料的顶层的组件来制造连接部件; 在顶层中形成开口以产生顶层掩模; 以及通过从与顶层掩模中的开口对准的金属层的区域中去除金属，从金属层形成第一导电元件。 该方法可以用于形成具有形成在其中的通孔或接合窗口的连接部件，用于与微电子器件的其它元件连接，并且可以在基底层的一侧或两侧上形成导电元件。

公开(公告)号：US06357112B1

公开(公告)日：2002-03-19

申请号：US09200100

申请日：1998-11-25

Applicant: Thomas H. DiStefano ,  Joseph Fjelstad ,  Belgacem Haba ,  Owais Jamil ,  Konstantine Karavakis ,  David Light ,  John W. Smith

Inventor： Thomas H. DiStefano ,  Joseph Fjelstad ,  Belgacem Haba ,  Owais Jamil ,  Konstantine Karavakis ,  David Light ,  John W. Smith

IPC: H01R906

CPC classification number: H01L24/72 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01016 ,  H01L2924/01019 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/12042 ,  H05K3/4092 ,  Y10T29/49126 ,  Y10T29/49147 ,  Y10T29/49149 ,  H01L2924/00

Abstract: A connection component for use in making microelectronic element assemblies, has peelable leads that are formed on a dielectric support structure. One end of each lead is permanently connected to the support structure and the opposite end of the lead is releasably connected to the support structure. When the releasable end of the lead is bonded to a contact on a semiconductor chip, the releasable end of the lead can be peeled from the support structure such that the chip may be moved away from the support structure. A compliant layer may be disposed between the chip and the support structure. If a compliant material is injected between the chip and the support structure to form the compliant layer, the compliant material will lift the chip away from the support structure and facilitate the peeling of the leads from the support structure.

Abstract translation: 用于制造微电子元件组件的连接部件具有形成在电介质支撑结构上的可剥离引线。 每个引线的一端永久地连接到支撑结构，并且引线的相对端可释放地连接到支撑结构。 当引线的可释放端接合到半导体芯片上的触点时，引线的可释放端可以从支撑结构剥离，使得芯片可以从支撑结构移开。 柔性层可以设置在芯片和支撑结构之间。 如果柔性材料在芯片和支撑结构之间注入以形成顺应性层，柔性材料将使芯片从支撑结构上提升，并促进引线从支撑结构的剥离。

公开(公告)号：US06255723B1

公开(公告)日：2001-07-03

申请号：US09179273

申请日：1998-10-27

Applicant: David Light ,  John W. Smith ,  Thomas H. DiStefano ,  David R. Baker ,  Hung-Ming Wang

Inventor： David Light ,  John W. Smith ,  Thomas H. DiStefano ,  David R. Baker ,  Hung-Ming Wang

IPC: H01L23495

CPC classification number: H01L24/50 ,  H01L23/49572 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01049 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01327

Abstract: A layered lead is disclosed including a layer of structural material which has top and bottom sides, a layer of fatigue-resistant material on the top and bottom surfaces and a layer of bonding material covering the fatigue-resistant layer on the bottom surface for connection to a contact on a chip. An asymmetrical distribution of bonding material on the top and bottom sides may be used to provide reinforcement of the lead against stress. The fatigue-resistant material also acts as a barrier against diffusion between the metal layers.

Abstract translation: 公开了一种分层引线，其包括具有顶侧和底侧的结构材料层，在顶表面和底表面上的耐疲劳材料层，以及覆盖底表面上的抗疲劳层的接合材料层，用于连接到 芯片上的一个接触。 可以使用顶部和底部上的接合材料的不对称分布来提供引线抵抗应力的增强。 耐疲劳材料还用作阻挡金属层之间扩散的屏障。