公开(公告)号：DE69937416D1

公开(公告)日：2007-12-06

申请号：DE69937416

申请日：1999-06-30

Applicant: FORMFACTOR INC

Inventor： PEDERSEN DAVID V ,  ELDRIDGE BENJAMIN N ,  KHANDROS IGOR Y

IPC: H05K1/18 ,  H05K3/32 ,  B23K1/00 ,  B23K20/00 ,  C23C18/16 ,  C25D5/08 ,  C25D5/22 ,  C25D7/12 ,  C25D21/02 ,  G01R1/04 ,  G01R1/067 ,  G01R1/073 ,  G01R31/01 ,  G01R31/28 ,  H01L21/00 ,  H01L21/48 ,  H01L21/56 ,  H01L21/60 ,  H01L21/603 ,  H01L21/66 ,  H01L23/04 ,  H01L23/12 ,  H01L23/13 ,  H01L23/32 ,  H01L23/48 ,  H01L23/485 ,  H01L23/49 ,  H01L23/498 ,  H01L23/538 ,  H01L25/065 ,  H01L25/16 ,  H05K1/14 ,  H05K3/20 ,  H05K3/34 ,  H05K3/36 ,  H05K3/40

Abstract: Products and assemblies are provided for socketably receiving elongate interconnection elements, such as spring contact elements, extending from electronic components, such as semiconductor devices. Socket substrates are provided with capture pads for receiving ends of elongate interconnection elements extending from electronic components. Various capture pad configurations are disclosed. Connections to external devices are provided via conductive traces adjacent the surface of the socket substrate. The socket substrate may be supported by a support substrate. In a particularly preferred embodiment the capture pads are formed directly on a primary substrate such as a printed circuit board.

公开(公告)号：DE69533336D1

公开(公告)日：2004-09-09

申请号：DE69533336

申请日：1995-11-13

Applicant: FORMFACTOR INC

Inventor： KHANDROS IGOR Y ,  MATHIEU GAETAN L ,  ELDRIDGE BENJAMIN N ,  GRUBE GARY W

IPC: B23K1/00 ,  B23K20/00 ,  G01R1/073 ,  B23K31/02 ,  C23C18/16 ,  C25D5/08 ,  C25D5/16 ,  C25D5/22 ,  C25D7/12 ,  C25D21/02 ,  G01R1/04 ,  G01R1/06 ,  G01R1/067 ,  G01R31/26 ,  G01R31/28 ,  H01L21/00 ,  H01L21/48 ,  H01L21/56 ,  H01L21/58 ,  H01L21/60 ,  H01L21/603 ,  H01L21/607 ,  H01L21/66 ,  H01L21/68 ,  H01L23/02 ,  H01L23/12 ,  H01L23/32 ,  H01L23/48 ,  H01L23/485 ,  H01L23/49 ,  H01L23/498 ,  H01L23/538 ,  H01L25/065 ,  H01L25/07 ,  H01L25/16 ,  H01L25/18 ,  H01R9/00 ,  H01R12/16 ,  H01R12/71 ,  H01R13/05 ,  H01R13/24 ,  H01R29/00 ,  H01R33/74 ,  H01R33/76 ,  H01R107/00 ,  H05H1/18 ,  H05K1/14 ,  H05K1/18 ,  H05K3/20 ,  H05K3/24 ,  H05K3/30 ,  H05K3/32 ,  H05K3/34 ,  H05K3/36 ,  H05K3/40 ,  H05K7/10

Abstract: The probe card assembly (500) includes a probe card (502), and a space transformer (506) having resilient contact structures (524) mounted to and extending from terminals (522) on its surface. An interposer (504) is disposed between the space transformer and the probe card. The space transformer and interposer are stacked on the probe card and the resilient contact structures can be arranged to optimise probing of entire wafer.

公开(公告)号：DE69531996T2

公开(公告)日：2004-07-22

申请号：DE69531996

申请日：1995-11-13

Applicant: FORMFACTOR INC

Inventor： KHANDROS IGOR Y ,  MATHIEU GAETAN L ,  ELDRIDGE BENJAMIN N ,  GRUBE GARY W

IPC: B23K1/00 ,  B23K20/00 ,  B23K31/02 ,  C23C18/16 ,  C25D5/08 ,  C25D5/16 ,  C25D5/22 ,  C25D7/12 ,  C25D21/02 ,  G01R1/04 ,  G01R1/06 ,  G01R1/067 ,  G01R1/073 ,  G01R31/26 ,  G01R31/28 ,  H01L21/00 ,  H01L21/48 ,  H01L21/56 ,  H01L21/58 ,  H01L21/60 ,  H01L21/603 ,  H01L21/607 ,  H01L21/66 ,  H01L21/68 ,  H01L23/02 ,  H01L23/12 ,  H01L23/32 ,  H01L23/48 ,  H01L23/485 ,  H01L23/49 ,  H01L23/498 ,  H01L23/538 ,  H01L25/065 ,  H01L25/07 ,  H01L25/16 ,  H01L25/18 ,  H01R9/00 ,  H01R12/16 ,  H01R12/71 ,  H01R13/05 ,  H01R13/24 ,  H01R29/00 ,  H01R33/74 ,  H01R33/76 ,  H01R107/00 ,  H05H1/18 ,  H05K1/14 ,  H05K1/18 ,  H05K3/20 ,  H05K3/24 ,  H05K3/30 ,  H05K3/32 ,  H05K3/34 ,  H05K3/36 ,  H05K3/40 ,  H05K7/10 ,  H01R12/20

Abstract: The probe card assembly (500) includes a probe card (502), and a space transformer (506) having resilient contact structures (524) mounted to and extending from terminals (522) on its surface. An interposer (504) is disposed between the space transformer and the probe card. The space transformer and interposer are stacked on the probe card and the resilient contact structures can be arranged to optimise probing of entire wafer.

公开(公告)号：AU7959298A

公开(公告)日：1999-04-05

申请号：AU7959298

申请日：1998-06-11

Applicant: FORMFACTOR INC

Inventor： CHEN JIMMY KUO-WEI ,  ELDRIDGE BENJAMIN N ,  DOZIER THOMAS H ,  YEH JUNJYE J ,  HERMAN GAYLE J ,  KHANDROS IGOR Y

IPC: G01R1/067 ,  B81B7/00 ,  C25D5/50 ,  C25D7/00 ,  C25D7/12 ,  H01L21/00 ,  H01L21/48 ,  H01L21/768 ,  H01L23/32 ,  H01L23/50 ,  H01L23/48

Abstract: Deposition of metal in a preferred shape, including coatings (206) on parts (204), or stand-alone materials (300), and subsequent heat treatment (106) to provide improved mechanical properties. In particular, the method gives products with relatively high yield strength. The products often have relatively high elastic modulus, and are thermally stable, maintaining the high yield strength at temperatures considerably above 25 DEG C. This technique involves depositing a material (206) in the presence of a selected additive, and then subjecting the deposited material to a moderate heat treatment (106). This moderate heat treatment differs from other commonly employed "stress relief" heat treatments in using lower temperatures and/or shorter times, preferably just enough to reorganize the material to the new, desired form. For example, coating and heat treating a spring-shaped elongate member provides a resilient, conductive contact (212, 920, 1060) useful for electronic applications.

公开(公告)号：AU7491598A

公开(公告)日：1998-12-08

申请号：AU7491598

申请日：1998-05-14

Applicant: FORMFACTOR INC

Inventor： PEDERSEN DAVID V ,  KHANDROS IGOR Y

IPC: H01L23/12 ,  H01L21/20 ,  H01L21/3205 ,  H01L21/48 ,  H01L21/60 ,  H01L23/48 ,  H01L23/498 ,  H01L23/52 ,  H01L23/522 ,  H01R4/48 ,  H01R12/16 ,  H01R13/24 ,  H05K3/40

公开(公告)号：AU7476098A

公开(公告)日：1998-11-27

申请号：AU7476098

申请日：1998-05-08

Applicant: FORMFACTOR INC

Inventor： KHANDROS IGOR Y ,  PEDERSEN DAVID V

IPC: B23K20/00 ,  C25D7/12 ,  G01R1/067 ,  G01R1/073 ,  G01R31/28 ,  H01L21/00 ,  H01L21/48 ,  H01L21/56 ,  H01L21/60 ,  H01L21/603 ,  H01L21/66 ,  H01L23/48 ,  H01L23/485 ,  H01L23/49 ,  H01L23/498 ,  H01L25/065 ,  H01L25/16 ,  H05K1/14 ,  H05K3/20 ,  H05K3/32 ,  H05K3/34 ,  H05K3/36 ,  H05K3/40

Abstract: High density packaging of semiconductor devices on an interconnection substrate is achieved by stacking bare semiconductor devices atop one another so that an edge portion of a semiconductor device extends beyond the semiconductor device that it is stacked atop. Elongate interconnection elements extend from the bottommost one of the semiconductor devices, and from the exposed edge portions of the semiconductor devices stacked atop the bottommost semiconductor device. Free-ends of the elongate interconnection elements make electrical contact with terminals of an interconnection substrate, such as a PCB. The elongate interconnection elements extending from each of the semiconductor devices are sized so as to reach the terminals of the PCB, which may be plated through holes. The elongate interconnection elements are suitably resilient contact structures, and may be composite interconnection elements comprising a relatively soft core (e.g., a gold wire) and a relatively hard overcoat (e.g., a nickel plating).

公开(公告)号：AU4159896A

公开(公告)日：1996-06-06

申请号：AU4159896

申请日：1995-11-13

Applicant: FORMFACTOR INC

Inventor： KHANDROS IGOR Y ,  MATHIEU GAETAN L ,  ELDRIDGE BENJAMIN N ,  GRUBE GARY W ,  DOZIER THOMAS H

IPC: G01R1/073 ,  B23K1/00 ,  B23K20/00 ,  B23K31/02 ,  C23C18/16 ,  C25D5/08 ,  C25D5/16 ,  C25D5/22 ,  C25D7/12 ,  C25D21/02 ,  G01R1/04 ,  G01R1/06 ,  G01R1/067 ,  G01R31/26 ,  G01R31/28 ,  H01L21/00 ,  H01L21/48 ,  H01L21/56 ,  H01L21/58 ,  H01L21/60 ,  H01L21/603 ,  H01L21/607 ,  H01L21/66 ,  H01L21/68 ,  H01L23/02 ,  H01L23/12 ,  H01L23/32 ,  H01L23/48 ,  H01L23/485 ,  H01L23/49 ,  H01L23/498 ,  H01L23/538 ,  H01L25/065 ,  H01L25/07 ,  H01L25/16 ,  H01L25/18 ,  H01R9/00 ,  H01R12/16 ,  H01R12/71 ,  H01R13/05 ,  H01R13/24 ,  H01R29/00 ,  H01R33/74 ,  H01R33/76 ,  H01R107/00 ,  H05H1/18 ,  H05K1/14 ,  H05K1/18 ,  H05K3/20 ,  H05K3/24 ,  H05K3/30 ,  H05K3/32 ,  H05K3/34 ,  H05K3/36 ,  H05K3/40 ,  H05K7/10

Abstract: The probe card assembly (500) includes a probe card (502), and a space transformer (506) having resilient contact structures (524) mounted to and extending from terminals (522) on its surface. An interposer (504) is disposed between the space transformer and the probe card. The space transformer and interposer are stacked on the probe card and the resilient contact structures can be arranged to optimise probing of entire wafer.

公开(公告)号：WO2006068939A3

公开(公告)日：2006-12-28

申请号：PCT/US2005045611

申请日：2005-12-15

Applicant: FORMFACTOR INC ,  KHANDROS IGOR Y ,  ELDRIDGE BENJAMIN N

Inventor： KHANDROS IGOR Y ,  ELDRIDGE BENJAMIN N

IPC: G01R31/26 ,  G01R31/28

CPC classification number: G01R31/2884 ,  G01R31/3025 ,  G01R31/31907

Abstract: A central test facility transmits wirelessly test data to a local test facility, which tests electronic devices using the test data. The local test facility transmits wirelessly response data generated by the electronic devices back to the central test facility, which analyzes the response data to determine which electronic devices passed the testing. The central test facility may provide the results of the testing to other entities, such as a design facility where the electronic devices were designed or a manufacturing facility where the electronic devices where manufactured. The central test facility may accept requests for test resources from any of a number of local test facilities, schedule test times corresponding to each test request, and at a scheduled test time, wirelessly transmits test data to a corresponding local test facility.

Abstract translation: 中央测试设备将无线测试数据传输到本地测试设备，该设备使用测试数据测试电子设备。 本地测试设施将由电子设备生成的无线响应数据发送回中央测试设施，中央测试设施分析响应数据以确定哪些电子设备通过了测试。 中央测试设施可以将测试结果提供给其他实体，例如设计电子设备的设计设施或制造电子设备的制造设施。 中央测试设施可以接受来自多个本地测试设施中的任何一个的测试资源的请求，调度对应于每个测试请求的测试时间，并且在预定的测试时间，将测试数据无线传输到相应的本地测试设施。

公开(公告)号：WO9900844A3

公开(公告)日：1999-04-29

申请号：PCT/US9813692

申请日：1998-06-30

Applicant: FORMFACTOR INC ,  DOZIER THOMAS H II ,  ELDRIDGE BENJAMIN N ,  GRUBE GARY W ,  KHANDROS IGOR Y ,  MATHIEU GAETAN L ,  PEDERSEN DAVID V ,  STADT MICHAEL A

Inventor： DOZIER THOMAS H II ,  ELDRIDGE BENJAMIN N ,  GRUBE GARY W ,  KHANDROS IGOR Y ,  MATHIEU GAETAN L ,  PEDERSEN DAVID V ,  STADT MICHAEL A

IPC: G01R1/04 ,  H01L23/04 ,  H01L23/13 ,  H01L23/32 ,  H01L23/48 ,  H01L23/538 ,  H05K3/30 ,  H05K3/32

CPC classification number: G01R1/0408 ,  B23K3/087 ,  G01R1/0416 ,  G01R1/0466 ,  G01R31/2886 ,  H01L23/04 ,  H01L23/13 ,  H01L23/32 ,  H01L23/5385 ,  H01L24/72 ,  H01L2224/1134 ,  H01L2224/13099 ,  H01L2224/16 ,  H01L2224/16237 ,  H01L2224/73251 ,  H01L2224/8114 ,  H01L2224/81901 ,  H01L2924/00013 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01078 ,  H01L2924/01079 ,  H05K1/119 ,  H05K3/308 ,  H05K3/325 ,  H05K2201/0311 ,  H05K2201/09472 ,  H05K2201/09827 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49139 ,  Y10T29/4914 ,  Y10T29/49147 ,  Y10T29/49153 ,  Y10T29/49208 ,  Y10T29/53174 ,  Y10T29/53178 ,  Y10T29/53183 ,  H01L2924/00014 ,  H01L2224/72

Abstract: Temporary connections to spring contact elements extending from an electronic component such as a semiconductor device are made by urging the electronic component, consequently the ends of the spring contact elements, vertically against terminals of an interconnection substrate, or by horizontally urging terminals of an interconnection substrate against end portions of the spring contact elements. A variety of terminal configurations are disclosed.

Abstract translation: 通过迫使电子元件，因此弹簧接触元件的端部竖直地抵靠互连基板的端子，或者通过水平地推动互连基板的端子来形成从诸如半导体器件的电子部件延伸的弹簧接触元件的临时连接 抵靠弹簧接触元件的端部。 公开了各种终端配置。

公开(公告)号：DE69739773D1

公开(公告)日：2010-04-01

申请号：DE69739773

申请日：1997-05-15

Applicant: FORMFACTOR INC

Inventor： KHANDROS IGOR Y ,  PEDERSEN DAVID V

IPC: H01L21/48 ,  G01R1/073 ,  H01L21/60 ,  H05K1/18 ,  H05K3/34